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- ----- 1942 -----
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- ----- 1939 -----
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- ----- 1937 -----
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- ----- 1936 -----
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- ----- 1935 -----
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- ----- 1934 -----
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- ----- 1933 -----
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- ----- 1932 -----
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- ----- 1931 -----
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- ----- 1930 -----
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- ----- 1929 -----
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- ----- 1928 -----
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- ----- 1927 -----
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- ----- 1926 -----
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- ----- 1925 -----
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- ----- 1924 -----
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- ----- 1923 -----
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- ----- 1922 -----
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- ----- 1921 -----
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- ----- 1920 -----
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- ----- 1919 -----
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- ----- 1918 -----
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- ----- 1917 -----
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- ----- 1916 -----
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- ----- 1915 -----
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- ----- 1914 -----
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- ----- 1913 -----
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- ----- 1902 -----
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- ----- 1901 -----
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- ----- 1900 -----
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November 2018
- 1 participants
- 33 discussions
-------- Weitergeleitete Nachricht --------
Betreff: [TCCC-ANNOUNCE] Cfp IEEE SECON 2019
Datum: Fri, 2 Nov 2018 10:05:02 +0000
Von: Anna Maria Vegni <annamaria.vegni(a)UNIROMA3.IT>
Antwort an: Anna Maria Vegni <annamaria.vegni(a)UNIROMA3.IT>
An: tccc-announce(a)COMSOC.ORG
[Apologies for multiple receptions of this CfP.]
*********************************** Call for Papers
***********************************
IEEE SECON 2019
http://www.ieee-secon.org/
Boston, MA, USA
10-13 June 2019
******************************************************************************************
The 16th annual IEEE International Conference on Sensing, Communication
and Networking (SECON) will provide a unique forum to exchange
innovative research ideas, recent results, and share experiences among
researchers and practitioners in wireless and mobile communication
networks. The focus of this year's IEEE SECON is twofold:
* Systems research, experimentation, hands on evaluations: The
conference aims to serve as the reference exhibit for state-of-the-art
research supported by implementation and insights gained on all scales
of experimental network architectures.
* Cross-disciplinary wireless research: Looking beyond current
networking paradigms, IEEE SECON welcomes pioneering cross-disciplinary
work at the intersection of wireless and parallel disciplinary areas
including (but not limited to) new devices, physics, biology, computing,
to name a few, encompassing topics ranging from biological communication
and computing networks to wireless communication networks in uncharted
spectral bands.
The conference will have special plenary sessions for papers that fall
under these broad categories, along with other regular sessions that
encompass many other exciting developments in the wireless domain.
Papers describing original, previously unpublished research work,
experimental efforts, practical experiences, as well as visionary
roadmaps, in all aspects of sensor networks, Internet of Things, mobile
devices, and wireless communication are solicited. Particular topics of
interest include, but are not limited to:
* Wireless and mobile sensing systems in challenging media (e.g.,
underground, underwater, space)
* Cellular communications and data networks, including 5G and beyond
* Software defined and programmable networks
* Cognitive radio and dynamic spectrum access
* Internet of Things, Nano-Things and Bio-Nano-Things
* New communication paradigms, such as Terahertz Communications, Optical
Wireless Communications
* Intra-body Networks and Molecular Communication Networks
* Unmanned aerial systems; robotic wireless networks
* Wearable computing and networking
* Machine learning for wireless
* Low-power and energy limited sensing and communications
* Measurement of wireless and sensor systems, and novel experimental
testbeds
* Security, privacy, and trustworthiness of mobile, wireless and sensor
systems
* Survivability and fault tolerance in disaster scenarios
* In-network processing/fog/edge computing in wireless networks
* Application protocols and cross-layer design
* Next generation applications enabled via wireless, such as
virtual/augmented reality, autonomous driving, smart cities
* Testing platforms for city-scale evaluation of new sensing systems
PAPER SUBMISSION AND PUBLICATION
Papers should neither have been published elsewhere nor be currently
under review at another venue. All papers for IEEE SECON 2019 must be
submitted via the conference submission page. Each submission must be no
longer than 9 pages and in font size no smaller than 10 points.
Submissions that violate the formatting guidelines will be rejected
without review.
All submitted papers will be judged based on their quality and relevance
through *double-blind* reviewing, where the identities of the authors
are withheld from the reviewers. As an author, you are required to
preserve the anonymity of your submission, while at the same time
allowing the reader to fully grasp the context of related past work,
including your own. Common sense and careful writing will go a long way
towards preserving anonymity. Papers that do not conform to our
double-blind submission policies will be rejected without review.
To be published in the IEEE SECON 2019 conference proceedings and to be
eligible for publication in IEEE Xplore, one author of each accepted
paper is required to register for the conference at the full (member or
non-member) rate. The paper must be presented by an author of that paper
at the conference, unless the TPC co-chairs grant permission for a
substitute presenter arranged in advance. The designated presenter
should be qualified to both present the paper and answer questions.
Non-refundable registration fees must be paid prior to uploading the
final IEEE formatted, publication-ready version of the paper. Only IEEE
Xplore compliant papers received by the camera-ready deadline can appear
in the proceedings. For authors with multiple accepted papers, one full
registration is valid for up to 3 papers. Accepted and presented papers
will be published in the IEEE SECON 2019 conference proceedings and
submitted to IEEE Xplore as well as other Abstracting and Indexing (A&I)
databases.
The organizers of IEEE SECON 2019 as well as our attendees expect
accepted papers to be presented at the conference. IEEE reserves the
right to exclude a paper from distribution after the conference (e.g.,
removal from IEEE Xplore) if the paper is not presented at the conference.
IMPORTANT DATES
Abstract Registration: 18 January 2019
Paper Submission: 25 January 2019
Acceptance Notification: 29 March 2019
Camera Ready: 12 April 2019
ORGANIZING COMMITTEE
General co-chairs:
Stefano Basagni, Northeastern University, Boston, USA
Tommaso Melodia, Northeastern University, Boston, USA
TPC co-chairs:
Giuseppe Bianchi, University of Roma Tor Vergata, Italy
Kaushik Chowdhury, Northeastern University, USA
Josep Miquel Jornet, State University of New York at Buffalo, USA
______________________________________
Anna Maria Vegni, PhD
COMLAB - Telecommunication Lab
Department of Engineering
Roma Tre University
Via Vito Volterra, 62 - 00146 Rome, Italy
e-mail: annamaria.vegni(a)uniroma3.it<mailto:annamaria.vegni@uniroma3.it>
other: a.v.vegni(a)ieee.org<mailto:a.v.vegni@ieee.org>,
vegni(a)acm.org<mailto:vegni@acm.org>, amvegni(a)bu.edu<mailto:amvegni@bu.edu>
web: http://www.comlab.uniroma3.it/vegni.htm
ph: +39.06.5733.7357
mob: +39.333.6570348 (or 87873)
fax: +39.06.5733.7026
______________________________________________________________
IEEE Communications Society Tech. Committee on Computer Communications
http://committees.comsoc.org/tccc/
TCCC Announce: For announcements concerning computer networking and
communications.
tccc-announce(a)comsoc.org
https://comsoc-listserv.ieee.org/
1
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Fwd: [TCCC-ANNOUNCE] 2019 IEEE Sustainability through ICT Summit (StICT) in Montréal (Deadline: January 15th, 2019)
by Lars Wolf 01 Nov '18
by Lars Wolf 01 Nov '18
01 Nov '18
-------- Weitergeleitete Nachricht --------
Betreff: [TCCC-ANNOUNCE] 2019 IEEE Sustainability through ICT Summit
(StICT) in Montréal (Deadline: January 15th, 2019)
Datum: Wed, 31 Oct 2018 23:14:39 +0000
Von: Burak Kantarci <Burak.Kantarci(a)UOTTAWA.CA>
Antwort an: Burak Kantarci <Burak.Kantarci(a)UOTTAWA.CA>
An: tccc-announce(a)COMSOC.ORG
Dear colleagues,
Apologies for possible multiple postings. We would like to invite you to
submit your work to the 2019 IEEE Sustainability through ICT Summit
(StICT), which will be held on 18-20 June in Montréal, QC, Canada.
Please see call for papers below for further details.
We look forward to your submission,
Best regards,
StICT 2019 Chairs
Call for Papers for the 2019 IEEE Sustainability through ICT Summit (StICT)
( http://sustainableict.ieee.org/summit/sict-summit-2019 )
In an increasingly connected world, where Information and Communication
Technology (ICT) is transforming all spheres of human activity, both
opportunities and challenges for sustainability are arising from the
widespread use of ICT. ICT can be leveraged for sustainability’s triple
bottom line of economic, environmental and social benefits by
facilitating green business models and societal functions. However
greening ICT through energy efficient operation and resource management
as well as the use of renewable energy sources and proper life cycle
management is indispensable to unleash the full potential of greening
through ICT and more generally of ICT as a driving force of sustainability.
The 2019 IEEE Sustainability through ICT Summit (StICT), in its second
edition, will be held on 18-20 June 2019 at the ETS campus in Montréal.
Under the theme of “ICT - A Key Driver for Sustainability,” the Summit
promotes a holistic approach on prospects for technologies, standards
and policies for ICT-enabled sustainable development that also takes
into consideration the sustainability of ICT resources. The summit is
sponsored by the IEEE Sustainable ICT Initiative.
Professionals from different disciplines are invited to contribute to
the open dialogue over the 3-day summit. The summit will provide an
inter-discipline collaboration platform for ICT practitioners; users;
technology providers; the standardization community; policy makers; and
the research community to exchange views and share expertise through the
“Sustainability through ICT” keynote speeches and discussion panel
session on Day 1 and the World Cafe event on Day 2. On Day 3, the summit
will host the International Workshop on Green ICT and Smart Networking
(GISN 2019) where researchers from both industry and academia will come
together to promote discussions on smart and green solutions for
stimulating, innovating, designing, provisioning, and optimizing the
networked society.
IEEE Sustainable ICT initiative White Paper “A Smart and Sustainable
World through ICT”
represents output from the first Summit and sets the stage for the World
Café Event (Day 2)
of this Summit. The white paper will be available shortly.
The summit invites submissions on different aspects of networking and
computing with a strong focus on sustainability of ICT and
sustainability through ICT.
Papers will be dispatched for either Day 1 (Sustainability through ICT)
or Day 3 GISN Workshop (Greening ICT). The World Café on Day 2 will be a
fully interactive session between all participants to address challenges
and opportunities to achieve sustainability through ICT.
Topics of interest include but are not limited to:
• Green data center architectures
• Energy efficient resource provisioning in data centers
• Green cloud and fog computing
• Green 5G and Beyond 5G systems
• Sustainable smart networking technologies
• Sustainable ICT equipment design
• QoE/QoS trade-offs in sustainable ICT
• Modelling of sustainable ICT systems
• The use of Renewable energy in ICT
• Community resilience microgrids
• Life-cycle analysis for smart ICT
• E-waste
• Circular economy and large scale sensing systems
• Standardization of Green ICT
• ICT for sustainable industrial applications
• ICT for sustainable buildings
• Sustainability applications for smart cities
• Sustainable smart transportation
• Sobriety in software design
• Communication technologies for energy harvesting
• Machine learning for sustainable systems
• Business models and public policy (regulatory) options for
sustainability through ICT
Important Dates:
Paper Submission: January 15th, 2019
Notification of acceptance: February 28th, 2019
Camera Ready: March 28th, 2019
How to Submit:
• All papers must be submitted in PDF and US letter format.
Submitted papers must conform to the IEEE formatting guidelines as
specified in these Word and LaTeX templates. The submission must clearly
identify the specific Vertical or topical area it is related to.
• Papers are limited to six (6) pages, without incurring extra
page charges. Papers may be extended to eight (8) pages however, for a
paper longer than 6 pages, an extra page charge per additional page will
be applied.
• All submitted technical papers will be peer reviewed by an
international Technical Program Committee (TPC). If the paper is
accepted, registered and presented, it will be included in the
conference proceedings and be submitted to the IEEEXplore Digital
Library. IEEE takes the protection of intellectual property very
seriously. All submissions will be screened for plagiarism using
CrossCheck. All submitted papers are subject to the IEEE ComSoc
plagiarism policy, see: https://www.comsoc.org/conferences/plagiarism-policy
• Papers must be marked and submitted electronically:
https://edas.info/N25451
o If you do not already have an EDAS account, you need to
create one as the first step in the submission process.
o Once you create an account and login, scroll down to the row:
StICT 2019 2019 IEEE Sustainability through ICT Summit (StICT)
o Then, click on the link ' 2019 IEEE Sustainability through
ICT Summit (StICT)' and follow the directions to submit your paper.
Contacts:
Honorary Chairs (IEEE Sustainable ICT Initiative Co-Chairs)
Prof. Jaafar Elmirghani, School of Electronic and Electrical
Engineering, Univ. of Leeds, UK,
J.M.H.Elmirghani(a)leeds.ac.uk<mailto:J.M.H.Elmirghani@leeds.ac.uk>
Prof. Charles Despins, École de Technologie Supérieure, Univ.
of Québec, Canada,
Charles.Despins(a)etsmtl.ca<mailto:Charles.Despins@etsmtl.ca>
Summit General Co-chairs
Dr. Emad Alsusa, School of Electrical and Electronic
Engineering, Manchester Univ., UK,
e.alsusa(a)manchester.ac.uk<mailto:e.alsusa@manchester.ac.uk>
Dr. Taisir El-Gorashi, School of Electronic and Electrical
Engineering, Univ. of Leeds, UK,
t.e.h.elgorashi(a)leeds.ac.uk<mailto:t.e.h.elgorashi@leeds.ac.uk>
Summit TPC Chair
Dr. Burak Kantarci, School of Electrical Engineering and
Computer Science, Univ. of Ottawa, Canada,
burak.kantarci(a)uottawa.ca<mailto:burak.kantarci@uottawa.ca>
Local Arrangements Chair
Prof. Mohamed Cheriet, École de Technologie Supérieure, Univ.
of Québec, Canada,
mohamed.cheriet(a)etsmtl.ca<mailto:mohamed.cheriet@etsmtl.ca>
GISN General Co-Chairs
Prof. Mohamed Cheriet, École de Technologie Supérieure, Univ.
of Québec, Canada,
mohamed.cheriet(a)etsmtl.ca<mailto:mohamed.cheriet@etsmtl.ca>
Prof. Tereza Cristina Melo de Brito Carvalho, Polytechnic
School, Univ. of Sao Paulo, Brazil
GISN TPC Co-Chairs
Dr. Kim-Khoa Nguyen, École de Technologie Supérieure, Univ. of
Québec, Canada, kim-khoa.nguyen(a)etsmtl.ca<mailto:kim-khoa.nguyen@etsmtl.ca>
Dr. Ana Carolina Riekstin, École de Technologie Supérieure,
Univ. of Québec, Canada,
ana-carolina.riekstin.1(a)ens.etsmtl.ca<mailto:ana-carolina.riekstin.1@ens.etsmtl.ca>
Dr. Mohamed Musa, School of Electronic and Electrical
Engineering, Univ. of Leeds, m.musa(a)leeds.ac.uk<mailto:m.musa@leeds.ac.uk>
Prof. Dan Kilper, University of Arizona, AZ, USA,
dkilper(a)optics.arizona.edu<mailto:dkilper@optics.arizona.edu>
Please visit the 2019 IEEE Sustainability through ICT Summit (StICT)
website for more information:
http://sustainableict.ieee.org/summit/sict-summit-2019 .
Burak Kantarci, Ph.D, P.Eng, SMIEEE
Professeur adjoint / Asst. Professor
École de science informatique et de génie électrique /
School of Electrical Engineering and Computer Science
Université d’Ottawa / University of Ottawa
Ottawa, ON, K1N 6N5, Canada
Phone / Tél: +1-613-562-5800 ext. 6955
http://site.uottawa.ca/~bkantarc/
______________________________________________________________
IEEE Communications Society Tech. Committee on Computer Communications
http://committees.comsoc.org/tccc/
TCCC Announce: For announcements concerning computer networking and
communications.
tccc-announce(a)comsoc.org
https://comsoc-listserv.ieee.org/
1
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Fwd: [TCCC-ANNOUNCE] Cfp: IEEE Communications Magazine New Series on MOBILE COMMUNICATIONS AND NETWORKS
by Lars Wolf 01 Nov '18
by Lars Wolf 01 Nov '18
01 Nov '18
-------- Weitergeleitete Nachricht --------
Betreff: [TCCC-ANNOUNCE] Cfp: IEEE Communications Magazine New Series on
MOBILE COMMUNICATIONS AND NETWORKS
Datum: Wed, 31 Oct 2018 17:52:24 -0400
Von: Wojciech Mazurczyk <wmazurczyk(a)CYGNUS.TELE.PW.EDU.PL>
Antwort an: Wojciech Mazurczyk <wmazurczyk(a)CYGNUS.TELE.PW.EDU.PL>
An: tccc-announce(a)COMSOC.ORG
IEEE Communications Magazine New Series on MOBILE COMMUNICATIONS AND
NETWORKS
CALL FOR PAPERS
The next generation of wireless cellular networks will transform mobile
communications, from a mere supplier of generic high-speed data
connectivity to a flexible provider of super-fast, highly reliable and
low-latency communications that are capable of supporting diversified
service categories. In order to fulfil the (often stringent)
requirements of those services, mobile network designers are required to
deploy novel high-performance technologies and solutions at all levels.
The IEEE Communications Magazine’s Mobile Communications and Networks
Series selects and publishes in-depth, cutting-edge tutorial articles on
state-of-the-art technologies and solutions for mobile wireless systems
and networks.
The Series emphasizes novel but practical solutions and emerging topics
of interest to industry, academia and government. Articles must be
written in clear and concise language and should be suitable for a broad
readership, i.e., design engineers, engineering managers,
industrial/academic researchers, students, and others. A rigorous
peer-review process ensures that only the highest quality articles that
fully adhere to the IEEE Communications Magazine publications guidelines
are accepted and published.
Authors are invited to submit manuscripts in all topics within the scope
of this Series including, but not limited to, the following:
- Mobile Wireless Systems and Their Architecture
- Mobile Networking Procedures and Algorithms
- Performance Evaluation, Testing and Measurement
- Emerging Topics
A complete list of topics and the submission guidelines are available at
https://www.comsoc.org/commag/cfp/mobile-communications-and-networks.
SERIES EDITORS
Tom Alexander, Uplevel Systems, Inc.
talex1962(a)gmail.com
Wojciech Mazurczyk, Warsaw University of Technology, Poland
wmazurczyk(a)tele.pw.edu.pl
Amitabh Mishra, Johns Hopkins University
amitabh(a)cs.jhu.edu
Alberto Perotti, Huawei Technologies
alberto.perotti(a)ieee.org
______________________________________________________________
IEEE Communications Society Tech. Committee on Computer Communications
http://committees.comsoc.org/tccc/
TCCC Announce: For announcements concerning computer networking and
communications.
tccc-announce(a)comsoc.org
https://comsoc-listserv.ieee.org/
1
0