November 2022 - Cfp - lists.ibr.cs.tu-bs.de

Fwd: [TCCC-ANNOUNCE] ACM MobiSys 2023 - Call for Papers
by Lars Wolf 28 Nov '22

28 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] ACM MobiSys 2023 - Call for Papers Datum: Mon, 28 Nov 2022 08:41:09 -0500 Von: Bo Han <hanbo00(a)GMAIL.COM> Antwort an: Bo Han <hanbo00(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG https://www.sigmobile.org/mobisys/2023/ Call for Papers ACM MobiSys 2023 seeks to present innovative and significant research on all aspects of mobile computing, applications, and services. The conference values technical contributions with working implementations and practical evaluations. We also welcome work that explores new and compelling mobile scenarios and applications as long as the work goes well beyond providing an initial vision. Topics of interest include, but are not limited to: ● Experience with mobile applications, networks, and systems ● Applications of mobile sensing and crowdsourcing ● Tools for building and measuring mobile systems ● Innovative wearable systems and applications ● Software architectures for mobile devices and mobile computing ● Data management for mobile applications ● Infrastructure support for mobile computing ● System-level energy management for mobile devices ● Operating systems for mobile devices ● Support for mobile social networking and the mobile web ● Security and privacy in mobile systems ● Resource-efficient machine learning and AI for mobile devices ● Systems for location and context sensing and awareness ● Mobile computing support for pervasive computing ● Vehicular and mobile robotic systems ● Systems and networking support for virtual or augmented reality ● Applications of mobile systems in healthcare and accessibility ● Applications in sustainability and smart cities ● IoT systems and applications with their implications for mobile computing ● Novel mobile applications using machine learning ● Techniques and systems for novel human-mobile interactions and experiences ● Nano satellites and mobile computing in outer space ● Non-traditional topics that bring new perspectives to mobile computing Note: Selected outstanding papers may be fast-tracked as a special section of IEEE Transactions on Mobile Computing. Policy on Concurrent/Previous submissions Papers whose contributions overlap with work currently under review elsewhere must not be submitted to ACM MobiSys. Papers whose contributions overlap with an earlier published paper will be considered only if (1) the previous paper was published (not just accepted) at a workshop at least 6 months before ACM MobiSys submission date and (2) it adds significant new contributions over the previous paper. Authors uncertain whether their submission meets these guidelines should contact the program chairs. Papers accompanied by nondisclosure agreement forms will not be considered. Accepted submissions will be treated as confidential prior to publication; rejected submissions will be permanently treated as confidential. Posted technical reports (ArXiv or similar) do not count as prior publication. However, (inspired by similar guidelines from ACM ASPLOS’23) we encourage the authors to (1) use different system names in the technical report and MobiSys submission and (2) avoid publicizing the technical report on social media or community blogs and webpages while it is under review by MobiSys. Double-Blind Review Process ACM MobiSys will use a double-blind review policy during the initial paper review. Authors are instructed to not include their names, affiliations, and contact information on the manuscript they submit for review. Authors should also anonymize the content of their paper to hide their identity. Reviewers will not know the identity of the authors until an outcome is decided for the paper. Only PC chairs will know the identity of the authors and be able to interact with them during the review process, should the need arise. Submissions which are not properly anonymized will be rejected without being reviewed. Submissions will be judged on originality, significance, interest, clarity, relevance, and technical correctness. Papers may be conditionally accepted and shepherded by a member of the program committee, with final acceptance determined by consent of the shepherd. Formatting Guidelines Submissions must be in PDF. We will not accept papers in any other format. Submissions must use a 10pt font (or larger) and be correctly formatted for printing on Letter-sized (8.5" by 11") paper. Paper text blocks must follow ACM guidelines: double-column, with each column 9.25" by 3.33", 0.33" space between columns and single-spaced. Submissions MUST be no more than twelve (12) pages + unlimited number of pages for bibliography references. The 12-page limit includes everything (e.g., abstract, text, appendix, etc.) except for the bibliography references. Submissions can use this LaTex template that is known to comply with the formatting requirements. Authors remain responsible for checking that their resulting PDF meets our formatting and anonymity specifications. Submissions not following these guidelines will be rejected without review. IRB Approval Requirement As part of the submission process, authors of papers that describe experiments on human subjects, or that analyze nonpublic data derived from human subjects (even anonymized data), will be asked to certify that their work was vetted by an ethics review (e.g., IRB approval). We expect authors to follow the rules of their host institutions around data collection and experiments with human subjects. Mandatory Registration At least one author of an accepted paper is expected to register for the conference (at non-student rate) and present the paper in-person. The MobiSys organizers will monitor the pandemic situation in case accommodations are needed. Artifact Evaluation Submissions may opt for an artifact evaluation. When authors do so, they commit to providing the implementations, models, test suites, benchmarks, and data used to derive the results presented in the paper to the artifact evaluation committee. Based on the evaluation, the papers will be awarded the appropriate artifact evaluation badge https://www.acm.org/publications/policies/artifact-review-badging. The artifact evaluation will be conducted after paper acceptance decisions. *(New) Early Rejection Notification and Rebuttal * MobiSys’23 will have early rejection notifications and a rebuttal phase. The authors of the papers that do not advance to the second round of review will be notified of the rejection of their paper. This allows the authors to plan for another submission and not have to wait for the MobiSys review process to come to an end. The papers that do advance to the second round of review will get a chance to submit a rebuttal after the second round comes to an end. In the rebuttal, the authors will be asked to respond to the questions raised by the reviewers. The reviewers will then read the response and use that as part of their discussions on the paper. To lower the amount of effort for both the authors and reviewers, MobiSys limits the rebuttal to 500 words. Important Dates *(New) This year, MobiSys will not have a registration deadline. * Paper Submission December 9, 2022 AoE Early Rejection Notification January 18, 2023 Rebuttal Period February 13-16, 2023 Final Decision Notification February 27, 2023 Contact If you have any questions, please contact the Program Co-Chairs, Yunxin Liu and Ardalan Amiri Sani at mobisys2023pcchairs(a)gmail.com. ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] [CFP] The 20th International Conference on Embedded Wireless Systems and Networks (EWSN 2023)
by Lars Wolf 24 Nov '22

24 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [CFP] The 20th International Conference on Embedded Wireless Systems and Networks (EWSN 2023) Datum: Thu, 24 Nov 2022 15:41:57 +0100 Von: loscri <valeria.loscri(a)INRIA.FR> Antwort an: loscri <valeria.loscri(a)INRIA.FR> An: tccc-announce(a)COMSOC.ORG ———————————————————————————————————————— Apologies for Multiple Receptions --------------------------------------------------------------------------------------------------- Call for Papers The 20th International Conference on Embedded Wireless Systems and Networks (EWSN 2023) https://ewsn2023.dimes.unical.it <https://ewsn2023.dimes.unical.it/> University of Calabria – Rende, Italy – 25-27 September 2023 The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. Building on the past 19 years of success, the 20th edition will be held in Rende, Italy. The conference continues its aim for broad, world-wide impact. Proceedings will be indexed in the ACM Digital Library, SCOPUS, and other prominent digital libraries. FEATURE TOPIC: Enabling the IoT ecosystem through Embedded Wireless Systems and Networks The Internet of Things (IoT) is the latest example of an ecosystem whose constituent elements promise to be independent, situated, and temporarily networked to synergically provide advanced cyber–physical functionalities. Embedded Wireless Systems and Networks play a key role in the IoT scenario but their engineering poses several challenges from as many viewpoints, spanning across the whole development stack: at device level, embedded systems demands to incorporate embedded intelligence for smartness, autonomy, safety, resilience, efficiency and privacy; at network level, current wireless technologies like 5G, NB-IOT, ZigBee and Lora as well as next-generation ones need to be fully exploited aiming to enable edge computing paradigm; at data level, the huge amount of data with heterogeneous data schemas and formats demand for effective processing, storage and exploitation techniques; finally, at the service level, integration and interoperability issues need to be addressed by means of semantic technologies to avoid siloed and segmented systems and applications. To systematically address these issues and tame the intrinsic complexity of the IoT ecosystem, full-fledged sets of development solutions and multidisciplinary approaches are needed: therefore, methodologies, frameworks, platforms and tools purposely conceived for the IoT scenario are gaining traction. SPECIFIC TOPICS`: of interest include but are not limited to: Edge Intelligence paradigms, models and techniques for IoT ecosystems; Architectures and infrastructures for Edge-Cloud continuum for IoT ecosystems; Interoperability-oriented and integration-oriented enablers for IoT ecosystems; Communication and networking for wireless, embedded and cognitive systems; Operating systems, middleware, and services; Processing, storage, and management of data; Communication and programming paradigms, languages and tools; Dependability (real-time, reliability, availability, safety) in wireless systems; AI operated wireless sensing, actuation and control systems; Modeling, simulation, and measurement tools for wireless AI systems and applications; Machine learning and data mining for wireless sensor system; Services and wireless networking for Cyber-Physical Systems and IoT; Next generation wireless networks, 6G; Privacy and security in applications and systems; Human- centric interaction with wireless and embedded AI systems; Experiences, challenges, comparisons of embedded AI platforms; Applications of wireless embedded AI in health, automation, manufacturing , transportation; Embedded algorithms and systems for computational perception, vision, speech, haptics; Empirical studies, measurement, validation, deployment, experiences; Sustainability and Green Tech; Applications and problems from developing countries and emerging markets. SUBMISSION to EWSN 2023 must be original (i.e., not previously published) and not currently under review by any other conference or journal. Submissions related to the featured topic are especially welcome, but all other submissions in scope of EWSN are equally welcome, all submissions will be evaluated based on the same criteria. EWSN 2023 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that their identities are not disclosed to reviewers and reviewers are discouraged from actively working to uncover author identities. To promote early dissemination, submission to arXiv (or similar) is allowed, provided cross-citations are not made. Paper Submission is managed through Easychair at: https://easychair.org/conferences/?conf=ewsn2023 <https://easychair.org/conferences/?conf=ewsn2023> Publication template available at website. Visit us at https://ewsn23.dimes.unical.it <https://ewsn23.dimes.unical.it/> Honorary Chair Adam Wolisz, Tech Univ. Berlin, Germany General Chair Giancarlo Fortino, Univ. of Calabria, Italy General co-Chair Archan Misra, Singapore Management Univ., Singapore Program Chair Valeria Loscrì, Inria Lille, France Fabrizio Granelli, Univ. of Trento, Italy Tarek Abdelzaher, Univ. of Illinois, USA Workshop & Special Session Chairs Gian Pietro Picco, Univ. of Trento, Italy Raymond Choo, Univ. of Texas at San Antonio, USA Gregory O’Hare, Trinity College Dublin, Ireland Sponsorship/Industry/Projects Chairs Tommaso Melodia, Northeastern Univ., USA Carlos Palau, Politech. Univ. of Valencia, Spain Yiannis Andreopoulos, Univ. College London, UK Finance Chair Antonio Guerrieri, ICAR-CNR, Italy Publication Chair Claudio Savaglio, Univ. of Calabria, Italy Antonella Guzzo, Univ. of Calabria, Italy Web Chair Raffaele Gravina, Univ. of Calabria, Italy Important Dates Full paper submission: 01 Apr 2023 Acceptance Notice: 01 Jun 2023 Camera Ready Submission: 30 Jun 2023 Early Bird Registration: 15 Jul 2023 Paper Types Full Paper: 10-12 pages Short Paper: 4-6 pages Poster/Demo Paper: 2-3 pages --------------------------------------------------------------------- Valeria Loscri Research Scientist FUN Team Inria Lille-Nord Europe. Parc scientifique de la Haute Borne 40, Avenue Halley - Bât A - Park Plaza 59650 Villeneuve d'Ascq - France http://researchers.lille.inria.fr/~loscri/home.html ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] CFP: ACM DLT SI on Recent Advances of Blockchain Evolution: Architecture and Performance
by Lars Wolf 22 Nov '22

22 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: ACM DLT SI on Recent Advances of Blockchain Evolution: Architecture and Performance Datum: Tue, 22 Nov 2022 07:53:42 -0500 Von: Xueqin Liang <xueqin.leung(a)GMAIL.COM> Antwort an: Xueqin Liang <xueqin.leung(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG ACM Distributed Ledger Technologies: Research and Practice Special Issue on Recent Advances of Blockchain Evolution: Architecture and Performance Guest Editors: • Xueqin Liang, Xidian University, China, liangxueqin(a)xidian.edu.cn • Xiaokang Wang, Hainan University, China, xkwang(a)hainanu.edu.cn • Chonggang Wang, InterDigital Inc., USA, cgwang(a)ieee.org • Witold Pedrycz, University of Alberta, Canada, wpedrycz(a)ualberta.ca Blockchain, as a disruptive technology, has attracted widespread attention from both academia and industry. It is promising to establish a truly decentralized, transparent, and accountable environment, where blockchain and other cutting-edge technologies will play an essential role. Despite the benefits and great potential of blockchain, current blockchain technologies still suffer from many severe problems, e.g., insufficient trust and security, vulnerability to attacks, low efficiency, poor scalability, low throughput, high energy consumption, privacy leakage, and threats caused by dishonest behaviors. Hence, there is an urgent demand for blockchain evolution, including its architecture, consensus mechanism, incentive mechanism, as well as the theories to integrate blockchain with other emerging technologies, such as machine learning and optimization algorithms. The recent advances in artificial intelligence have offered opportunities to detect anomalies and optimize resources. Furthermore, incentive mechanisms boost the participation willingness of system entities and promote intrinsic trust for blockchain, thereby greatly enhancing system security. Obviously, the evolution of blockchain in architecture, intelligence, and incentive will further extend its applications to wider fields. This special issue aims to bring together recent advances in new architecture, algorithms with intelligence, incentive mechanisms, and so on for innovating blockchain to improve its overall performance. It will also consider peer-reviewed journal versions (at least 30% new content) of top papers from IEEE Blockchain 2022, which is scheduled to take place in Espoo, Finland, 22-25 August 2022. The new content must be in terms of intellectual contributions, technical experiments, and findings. Any manuscript submitted to this special issue not be published or currently submitted for publication elsewhere. Contributions arising from papers given at other conferences are also welcome but should be substantially extended and should cite the conference paper where appropriate. The differences should also be explicitly outlined in the accompanying cover letter. Topics Potential topics include but are not limited to the following: • New architecture of blockchain with enhanced security and privacy preservation • AI-enabled smart blockchain • AI-enabled blockchain consensus mechanisms • Blockchain scalability issues and solutions • Blockchain interoperability with privacy preservation • Security, privacy, and trust of emerging blockchain systems • Intelligent quality assurance of smart contracts • Intelligent resource allocation for blockchain • Incentive mechanisms for blockchain or blockchain-based incentive mechanisms • AI-enabled incentive mechanisms for blockchain-based applications • Blockchain-based novel applications and services • Novel consensus mechanisms for redactable blockchain • Novel redactable blockchain architecture with accountability and trustfulness • Attacks to redactable blockchain and its solutions • Redactable blockchain with universality • Redactable blockchain applications in IoT, crowdsourcing, and edge computing • Blockchain and other emerging technologies Important Dates • Submissions deadline: 15 December 2022 • First-round review decisions: 15 March 2023 • Deadline for revision submissions: 15 May 2023 • Notification of final decisions: 1 July 2023 • Tentative publication: December 2023, subject to journal publication schedules Submission Information Prospective authors are invited to submit their manuscripts electronically adhering to the ACM Distributed Ledger Technologies: Research and Practice guidelines. Please submit your papers through the online system and be sure to select the Paper for Recent Advances of Blockchain Evolution: Architecture and Performance option for the paper-type. Also, please indicate that you are submitting to this special issue in the author's cover letter. Papers will be subject to a strict review process under the supervision of the Guest Editors, and accepted papers will be published online individually before print publication. For questions and further information, please contact liangxueqin(a)xidian.edu.cn ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: DCOSS-IoT 2023 (former DCOSS) - 19th International Conference on Distributed Computing in Smart Systems and the Internet of Things - Call for Papers
by Lars Wolf 21 Nov '22

21 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: DCOSS-IoT 2023 (former DCOSS) - 19th International Conference on Distributed Computing in Smart Systems and the Internet of Things - Call for Papers Datum: Mon, 21 Nov 2022 14:03:43 +0000 Von: Vijay K Shah <vshah22(a)gmu.edu> An: cistc-distribution(a)comsoc.org <cistc-distribution(a)comsoc.org> [Apologies for cross postings] * * *The 19th Annual International Conference on Distributed Computing in Smart Systems and the Internet of Things (DCOSS-IoT2023) * *Coral Bay, Pafos, Cyprus — June 19-21, 2023* The 19th International Conference on Distributed Computing in Smart Systems and the Internet of Things (DCOSS-IoT2023 ) will be held in Cyprus in June 2023. The conference is co-sponsored by the IEEE Computer Society and by the IEEE Technical Committee on Parallel Processing (TCPP). The conference was previously known as DCOSS. *Starting in 2023, the event is broadening its scope beyond sensor networks to include smart systems in general and the Internet of Things (IoT). The updated name is “Distributed Computing in Smart Systems and the Internet of Things” (DCOSS-IoT).* In the last few years, we have witnessed significant growth in the use of IoT and distributed sensor systems in several application areas, including smart transportation, smart energy systems, smart homes and buildings, smart healthcare, and environmental monitoring. For smart sensor systems to truly become useful and pervasive, we need to address several research challenges, including the tight integration of sensing and machine intelligence, reliable and efficient networking, interoperability and scalability, the need for dependable autonomy, interaction with humans, and important aspects of security, privacy and trust.DCOSS-IoTfocuses on issues arising in the entire IoT and networked sensor systems stack, covering aspects of high-level abstractions, models and languages, communication technologies, novel algorithms and applications, system design approaches and architectures, and tools for simulated and real deployments. Potential authors are invited to submit original, unpublished manuscripts demonstrating recent advances in theoretical and experimental research. Topics of interest include, but are not limited to, the following: Artificial Intelligence for IoT Machine learning and data mining for IoT and Smart Systems Smart healthcare to combat epidemics (including COVID-19) Edge and fog computing: distributed computing models from sensor to cloud Machine intelligence in distributed sensor systems and real-time analytics Novel communication paradigms (e.g., 5G/6G, VLC, DSA) for IoT and Smart Systems Cyber-Physical Systems IoT and Smart Systems for Smart and Connected Communities Autonomy: closing the loop between sensing and actuation Time and location management Robustness, resilience, and dependability of IoT and smart systems Security and privacy in IoT and Smart Systems Performance analysis: complexity, correctness, scalability Mobile and human-centric sensing IoT and Smart Systems for social computing Interoperability, heterogeneity and scalability Unmanned aerial vehicle (UAV)-based sensing/communications/networking Social sensing and crowd sensing techniques, applications, and systems Complex systems comprising wearable, robotic and/or fixed sensor systems IoT and Smart Systems for emerging and developing economies Green and environmentally friendly IoT (low-power, harvesting, energy management) Design and implementation of real-world applications and systems Approaches, tools, and experience of deployment and operation Interdisciplinary applications of IoT and Smart Systems Smart healthcare and digital epidemiology Smart agriculture Smart infrastructures Smart cities Smart energy, transportation, and water distribution systems Smart factories Smart workspace Authors are invited to submit original, unpublished manuscripts demonstrating current research on distributed smart systems and IoT related to the aforementioned topics of interest. Please use the US letter size (8.5 X 11 in) standard IEEE conference LaTeX format or Microsoft Word template available on: http://www.ieee.org/conferences_events/conferences/publishing/templates.html <https://nam11.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.ieee.o…>. All submissions should be written in English and have a maximum of eight (8) printed pages, including figures and references. Starting this year,DCOSS-IoTwill follow a double-blind review process. As a result, authors must make a good faith effort to anonymize their submissions. Although submission is double-blind, the existence or availability of non-anonymous preprints (on arXiv or other preprint servers) will not lead to your paper being rejected. Reviewers will be instructed not to look for such preprints actively, but encountering them will not constitute a conflict of interest. Papers that do not meet the size, formatting, and anonymization requirements will not be reviewed. We require each paper to be in Adobe Portable Document Format (PDF) and submitted through the HotCRP submission system. **** Special Issue and Best Paper Awards **** DCOSS-IoT2023 will announce a best paper award and a best poster/demo award. Extended versions of the selected best papers fromDCOSS-IoT2023 will be published in the Pervasive and Mobile Computing (PMC) Journal after a successful fast-track evaluation. **** Important dates **** Abstract Registration Deadline: January 30, 2023 Paper Submission Deadline: February 6, 2023 Acceptance Notification: April 7, 2023 Camera Ready Deadline: April 28, 2023 Conference: June 19-21, 2023 *** Key Organizers *** – Technical Program Committee Co-Chairs: Salil Kanhere, UNSW Sydney, Australia Simone Silvestri, University of Kentucky, USA Olga Saukh, TU Graz and Complexity Science Hub Vienna, Austria – Local Chairs Savvas Chatzichristofis, Neapolis University of Pafos, Cyprus Zinon Zinonos, Smart City of Pafos, Cyprus Vasos Vassiliou, University of Cyprus, Cyprus – Steering Committee Chair: Sotiris Nikoletseas, University of Patras and CTI, Greece Please visit theDCOSS-IoT2023 website <https://nam11.safelinks.protection.outlook.com/?url=https%3A%2F%2Fdcoss.org…> for more information. Vijay K. Shah, PhD Assistant Professor, Cybersecurity Engineering Department NextG Wireless Laboratory (NextG Lab@Mason) George Mason University 328 Research Hall, 10401 York River Rd, Fairfax, VA 22030 Phone: +1 (573) 578-4238 Website: https://mason.gmu.edu/~vshah22/ <https://mason.gmu.edu/~vshah22/> Lab site: www.nextgwirelesslab.org <http://www.nextgwirelesslab.org> --------------------------------------------------------------------------- To unsubscribe from the tciin list, click the following link: https://comsoc-listserv.ieee.org/cgi-bin/wa?SUBED1=tciin&A=1

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Fwd: [TCCC-ANNOUNCE] Deadline approaching: Special Issue on Internet of Things for Sustainable Society Development. Elsevier Sustainable Technology and Entrepreneurship
by Lars Wolf 20 Nov '22

20 Nov '22

-------- Ursprüngliche Nachricht -------- Von: Chaker Abdelaziz Kerrache <ch.kerrache(a)LAGH-UNIV.DZ> Gesendet: 19. November 2022 20:47:40 MEZ An: tccc-announce(a)COMSOC.ORG Betreff: [TCCC-ANNOUNCE] Deadline approaching: Special Issue on Internet of Things for Sustainable Society Development. Elsevier Sustainable Technology and Entrepreneurship Dear colleagues, We are organizing a Special Issue on Internet of Things for Sustainable Society Development with Elsevier Sustainable Technology and Entrepreneurship journal *SCHEDULE: * Deadline of submission: *1 December 2022 * Acceptance of papers: 30 March 2023 *CALL FOR PAPERS * This special issue focuses on the role of Internet of Things (IoTs) in shaping the future of our societies. The main aim is to show how the research and education ecosystem promoting impactful solutions-oriented science can help citizenry, government, industry, and other stakeholders to work collaboratively in order to make informed, socially responsible, science-based decisions. Guimarães et al. [1] aimed to look at the impact of Smart Governance variables on Quality of Life in the context of smart cities in Brazil's northeast. Transparency, Collaboration, Participation and Partnership, Communication, and Accountability on Quality of Life relationships were all assessed for this purpose. The study's findings reveal strong and significant connections between the constructs. Montori et al. [2] introduced SenSquare, an architecture that can manage disparate data sources from open IoT platforms and crowdsensing campaigns while providing consumers with a single interface. Besides, Alsamhi et al. [3] offered an overview of prospective collaborative drone and IoT methodologies and applications that have recently been proposed in order to improve the smartness of smart cities. Accordingly, this special issue solicits novel research and review papers addressing how communities can address complex, interconnected socio-environmental challenges. This special issue aims at pointing out the key inter-related challenges in areas such as the environment, climate change, mining, energy, agro-economic, water, and forestry that are limiting the development of a sustainable and resilient society with respect to the recent technological advances in IoT-based solutions. This special issue covers a wide range of topics on technology and innovation management related to sustainable societies and the internet of things and the scope of sustainability. Its topics of interest include but not limited to: · Sustainable IoT for sustainable society · Environmental issues in IoT-based solutions · Internet of Everything for sustainable and smart cities · Security, privacy, and trust models for sustainable internet of things · 5G-empowered IoT solutions for sustainable development · Artificial Intelligence solutions for IoT-based smart and sustainable cities · Performance, scalability, reliability, and efficiency of IoT-based sustainable society solutions · Testbeds and validation. *SUBMISSIONS: *Please submit using the Editorial Manager for Sustainable Technology and Entrepreneurship selecting the short title “Special Issue: ITSSD” https://www.editorialmanager.com/stae/default2.aspx *SPECIAL ISSUE GUEST-EDITORS * Chaker Abdelaziz Kerrache (ch.kerrache(a)lagh-univ.dz) Anand Nayyar (anandnayyar(a)duytan.edu.vn) Houbing Song (SONGH4(a)erau.edu) Boubakr Nour (n.boubakr(a)ieee.org) Looking forward to receiving your contributions ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] Call For Papers - The 16th ACM International Systems and Storage Conference - SYSTOR 2023
by Lars Wolf 19 Nov '22

19 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call For Papers - The 16th ACM International Systems and Storage Conference - SYSTOR 2023 Datum: Sat, 19 Nov 2022 07:46:07 +0000 Von: kolosov(a)campus.technion.ac.il <kolosov(a)CAMPUS.TECHNION.AC.IL> Antwort an: kolosov(a)campus.technion.ac.il <kolosov(a)CAMPUS.TECHNION.AC.IL> An: tccc-announce(a)COMSOC.ORG [apologies if you receive multiple copies of this message] ============================================================ C A L L F O R P A P E R S SYSTOR 2023 16th ACM International Systems and Storage Conference June 5 - 7, 2023, Haifa, Israel https://www.systor.org/2023 Scope: ====== The ACM International Systems and Storage Conference (SYSTOR) is an international forum for interaction across the systems research community. The program includes innovative, peer-reviewed research papers in the broad area of systems and storage, as well as distinguished keynote lecturers, a poster session, and social events. ACM SYSTOR is designed to appeal to academic and industrial researchers and practitioners, welcoming both students and seasoned professionals. Topics: ======= SYSTOR welcomes academic and industrial papers in systems and storage, broadly construed. SYSTOR encourages submissions that describe results from experimental system prototypes, as well as experience papers describing practical deployments, and valuable lessons learned from them. Topics of interest include, but are not limited to: Big Data infrastructure Cloud, edge, data center, and distributed systems Embedded and real-time systems Fault tolerance, reliability, and availability File and storage systems Networked, mobile, wireless, peer-to-peer, and sensor systems Operating systems, computer architecture, and their interactions Performance evaluation and workload characterization Runtime systems and compiler/programming-language support System deployment, usage, and experience System design or adaptation for emerging storage technologies System security and trust Systems for machine learning/machine learning for systems Virtualization and containers Tracks: ======= Full Papers Track – original research, at most 10 pages, excluding references Short Papers Track – original research, at most 5 pages, excluding references Highlight Papers Track – papers accepted at top-tier conferences Posters with Extended Abstract Track – original work presented as a poster, accompanied by an extended abstract in the conference proceedings Important Dates: ================ Full and Short Papers Track Paper Submission Thursday, March 2, 2023 Acceptance Notification Thursday, April 13, 2023 Camera-ready Monday, May 8, 2023 Highlight Papers Track Extended Abstract Submission Monday, April 3, 2023 Acceptance Notification Monday, May 1, 2023 Posters with Extended Abstract Track Poster & Abstract Submission Wednesday, March 15, 2023 Acceptance Notification Monday, April 17, 2023 Camera-ready Monday, May 8, 2023 Conference June 5-7, 2023 Program Chairs: =============== Yossi Gilad (Hebrew University of Jerusalem, Israel) Dejan Kostic (KTH Royal Institute of Technology, Sweden) Program Committee: ================== Abutalib Aghayev (Pennsylvania State University) Aishwarya Ganesan (University of Illinois Urbana-Champaign) Amit Klein (Hebrew University) Andromachi Chatzieleftheriou (Microsoft Research) Animesh Trivedi (VU Amsterdam) Ashvin Goel (University of Toronto) Avani Wildani (University of California, Santa Cruz) Aviad Zuck (Technion-Israel Institute of Technology) Charlie Hu (Purdue University) Cristina Abad (Escuela Superior Politecnica del Litoral) Huaicheng Li (Virginia Tech) Lluís Vilanova (Imperial College London) Marco Chiesa (KTH Royal Institute of Technology) Ming Liu (University of Wisconsin at Madison/ VMware Research) Orna Agmon Ben-Yehuda (Haifa University) Patrick P. C. Lee (The Chinese University of Hong Kong) Ramnatthan Alagappan (University of Illinois Urbana-Champaign) Rob Johnson (VMWare Research) Rodrigo Fonseca (Microsoft Research) Sam H. Noh Ulsan (National Institute of Science and Technology) Shir Landau Feibish (Open University Israel) Thanumalayan Sankaranarayana Pillai (Google) Thomas Shull (Oracle Labs) Vasily Tarasov (IBM Research – Almaden) Waleed Reda (KTH Royal Institute of Technology) Youjip Won (Korea Advanced Institute of Science and Technology (KAIST)) Youngjin Kwon (Korea Advanced Institute of Science and Technology (KAIST)) Youyou Lu (Tsinghua University) General Chair: ============== Ofer Biran (IBM Research – Haifa, Israel) Yosef Moatti (IBM Research – Haifa, Israel) Poster Chair: ============= Dean Lorenz (IBM Research – Haifa, Israel) Publication Chair: ================== TBD Publicity Chair: ================ Oleg Kolosov (Technion, Israel) Steering Committee Head: ======================== Dalit Naor (The Academic College of Tel Aviv-Yaffo, Israel) Steering Committee: =================== Michael Factor (IBM Research – Haifa, Israel) Ethan Miller (University of California Santa Cruz, USA) Liuba Shrira (Brandeis University, USA) Dan Tsafrir (Technion, Israel & VMware Research Group, USA) Gala Yadgar (Technion, Israel) Erez Zadok (Stony Brook University, USA) ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] ACM CoNEXT 2023 -- Call for papers & important news
by Lars Wolf 19 Nov '22

19 Nov '22

-------- Ursprüngliche Nachricht -------- Von: Dario Rossi <dario.rossi(a)TELECOM-PARISTECH.FR> Gesendet: 18. November 2022 22:00:57 MEZ An: tccc-announce(a)COMSOC.ORG Betreff: [TCCC-ANNOUNCE] ACM CoNEXT 2023 -- Call for papers & important news (apologies for cross-posting) Dear all, on behalf of the ACM CoNEXT Steering Committee and the 2023 Organization Committee, we are disseminating two important news about CoNEXT. <TL;DR> 1) There will be **TWO deadlines**, the first of which is fast approaching: - [new deadline] **November 30th, 2022** - [usual deadline] June 2023 2) Accepted papers will appear in the new journal **Proceedings of the ACM on Networking (PACMNET)** https://dl.acm.org/journal/pacmnet </TL;DR> ACM CoNEXT 2023 Call for Papers ------------------------------- The CoNEXT Steering Committee is happy to announce that ACM CoNEXT 2023 will be held in Paris in December 5-8 2023. Check: https://conferences.sigcomm.org/co-next/2023/#!/home for all details. The 2023 ACM CoNEXT conference will be held in Paris, France, on December 5-8, 2023, and the website is now active at https://conferences2.sigcomm.org/co-next/2023/#!/home The CoNEXT 2023 conference seeks papers presenting significant and novel research results on emerging computer networks and its applications. We especially encourage submissions that present novel experimentation, creative use of networking technologies, and new insights made possible using analysis. NEW: The conference presents papers that have been accepted to appear in the Proceedings of the ACM on Networking (PACMNET). There are two deadlines to submit your work in time for a presentation at the conference (see below). We invite submissions on a wide range of networking topics. The list of topics includes (in alphabetical order): • Content distribution and caching, e.g., CDN, peer-to-peer, overlays • Design, analysis, and evaluation of network architectures • Energy-efficient computing and networking • Experience and lessons learned by deploying large-scale networked systems • In-network computing, NFV and network programmability • Innovative uses of network data beyond communication • Network measurement and modeling • Internet economics and policy • Mobile and wireless network protocols and applications • Machine learning as applied to all layers of networking • Networked applications including web, video, and online social networks • Network aspects of datacenters, cloud computing, operating systems, virtualization • Network aspects of IoT • Network control and management, including SDN • Network, transport, and application-layer protocols • Reliability and availability of networks, protocols, and applications • Reproducibility of networking research • Routing and traffic engineering • Security and privacy aspects of network applications and protocols We are open to other contributions that stretch networking research outside of these topics, present new emerging computing trends, or potentially involve unfamiliar techniques. We ask authors to bear in mind that the main factor of interest in their work will be the implications of their results in networking. As such CoNEXT is, e.g., not looking for papers addressing only the physical layer. Potential authors who are unsure of the scope are encouraged to contact the PC chairs before submission. IMPORTANT DATES: There are two submission opportunities over the course of the year: November 2023 submission: • Paper Submission: Wednesday, November 30, 2023 (11:59PM) (hard deadline, no extensions will be given) • Notification of Acceptance: March 31, 2023 • Publication of accepted papers: June 2023 issue of PACMNET • For papers given the one-shot major revision option • Major revision due: May 30 2023 • Final decision: June 15, 2023 • Publication of accepted papers: September 2023 issue of PACMNET June 2023 submission: • Paper Submission: mid June 2023 • Notification of Acceptance: mid September 2023 • Publication of accepted papers: December 2023 issue of PACMNET • For papers given the one-shot major revision option • Major revision due: December 15 2023 • Final decision: January 15 2024 • Publication of accepted papers: March 2024 issue of PACMNET Papers may be submitted to any deadline. Upon acceptance, long papers will be scheduled for publication in the closest issue of the Proceedings of the ACM on Networking (CoNEXT)” (PACMNET). Short papers will appear in the Proceedings of the CoNEXT conference. Accepted papers before December 2023 will be presented at the ACM CoNEXT 2023 conference in Paris. Best Regards, ACM CoNEXT 2023 Organising Team This e-mail and its attachments contain confidential information from HUAWEI, which is intended only for the person to whom it is addressed. If you are not the intended recipient of this email, please notify immediately the sender by phone or email and delete it. Any use of the information contained herein in any way, including, but not limited to, total or partial disclosure, reproduction, or dissemination, by persons other than the intended recipient(s) is prohibited, unless expressly authorized by HUAWEI. HUAWEI Technologies France SASU (“HUAWEI”) respects your privacy and is committed to the protection of your personal data. Your personal data included in this email and/or its attachments may be processed by HUAWEI. In compliance with Regulation (EU) 2016/679 (GDPR) and French data protection law of 6 January 1978 as amended, you can exercise at any time your rights of access, rectification or erasure of your personal data, as well as your rights to restriction, portability or object to the processing by sending us your request via the form available at https://www.huawei.com/fr/personal-data-request or a letter to the following address: HUAWEI Technologies France, Privacy Officer, 18 quai point du jour, 92100 Boulogne-Billancourt, France. To know more about how HUAWEI processes your personal data, please contact us. https://www.huawei.com/fr/personal-data-request/ ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: IEEE INFOCOM 2023: Call for Demos and Posters
by Lars Wolf 16 Nov '22

16 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: IEEE INFOCOM 2023: Call for Demos and Posters Datum: Wed, 16 Nov 2022 13:34:33 +0900 Von: Ruidong Li <lrd(a)se.kanazawa-u.ac.jp> An: tciin(a)COMSOC.ORG *** Please accept our apologies if you receive multiple copies of this CFP *** ================================================ *IEEE INFOCOM 2023: Call for Demos and Posters* The 42nd Annual IEEE Conference on Computer Communications May 17-20, 2023, *In-Person* Conference https://infocom2023.ieee-infocom.org *CALL FOR DEMOS and POSTERS* Technical demonstrations and posters showing/presenting innovative and original research are solicited. In general, IEEE INFOCOM is interested in demonstrations and posters of technology that validate important research ideas or showcase realistic applications. The research topics of interest include, but are not limited to: ●Big data and data processing for networks ●Cellular networks ●Cloud computing ●Cognitive radio networks ●Cooperative networking ●Cross-layer optimization and control ●Crowdsourcing ●Cyber-physical systems ●Datacenter networking ●Delay tolerant networks ●Energy efficiency ●Fault tolerance, reliability and survivability ●Flow and congestion control ●Game theory in networks ●Information security and privacy ●Information centric networking ●Interference management and mitigation ●Internet of Things ●Localization and location-based services ●Medium access control ●MIMO-based networking ●Mobile cloud computing ●Mobility management and models ●Multimedia networking ●Network calculus ●Network coding ●Network economics and pricing ●Network management ●Network measurement and analysis ●Network security and privacy ●Network virtualization ●Optical networks ●Overlay and peer-to-peer networks ●Quality of Service and resource management ●Router and switch design ●Routing & multicast ●Scaling laws and fundamental limits ●Scheduling and buffer management ●Smart antenna based networking ●Smart grid ●Smartphone and mobile applications ●Social computing and networks ●Software defined networking ●Tactile Internet ●Vehicular networks ●Web applications and content distribution ●WLAN, WPAN, RFID, and NFC ●Wireless security and privacy ●Wireless sensor networks *DEMO and POSTER SUBMISSION INSTRUCTIONS* Submissions should be a two-page abstract that follows the IEEE formatting guidelines. Please refer to the IEEE submission instructions for details. There is no need for double-blind submissions (names, affiliations, and email addresses are therefore required). Please be as specific as possible in describing what you will display or demonstrate for your poster or demo. In the submission, specify clearly whether you will be presenting a poster or a demo. The demo and poster sessions will be held *in person*, and at least one co-author of the accepted poster/demo is required to present in the conference. If a demonstration requires special arrangements or additional equipment, please detail it in the submission. All additional equipment/needs are subject to budget approval. Abstracts of accepted demos/posters will be included in the INFOCOM 2023 Proceedings. Accepted and presented abstracts will be submitted to IEEE Xplore®. Poster submissions should be made via EDAS using this link: https://edas.info/N30339 Demo submissions should be made via EDAS using this link: https://edas.info/N30338 *IMPORTANT DATES* Two-page demo or poster paper submission deadline: 11:59 pm (EST), January 13, 2023 Notification of acceptance: February 10, 2023 IEEE INFOCOM 2022 conference dates: May 17-20, 2023 IEEE INFOCOM 2022 Demo/Posters session dates: May 17-19, 2023 IEEE INFOCOM 2022 Demo/Poster Co-Chairs: ●Huacheng Zeng (Michigan State University, USA) – hzeng(a)msu.edu <mailto:hzeng@msu.edu> ●●Rui Zhang (University of Delaware, USA) - _ruizhang(a)udel.edu_ --------------------------------------------------------------------------- To unsubscribe from the tciin list, click the following link: https://comsoc-listserv.ieee.org/cgi-bin/wa?SUBED1=tciin&A=1

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Fwd: [TCCC-ANNOUNCE] Inaugural ISOC Symposium on Vehicle Security & Privacy, VehicleSec, co-located with NDSS'23: Submission Due in 2 Months, *Jan 3*
by Lars Wolf 15 Nov '22

15 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Inaugural ISOC Symposium on Vehicle Security & Privacy, VehicleSec, co-located with NDSS'23: Submission Due in 2 Months, *Jan 3* Datum: Tue, 15 Nov 2022 11:52:50 -0500 Von: Berkay Celik <celik.berkay(a)GMAIL.COM> Antwort an: Berkay Celik <celik.berkay(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG ---------- Forwarded message --------- From: Berkay Celik <zcelik(a)purdue.edu> Date: Tue, Nov 15, 2022 at 11:12 AM Subject: Inaugural ISOC Symposium on Vehicle Security & Privacy, VehicleSec, co-located with NDSS'23: Submission Due in 2 Months, *Jan 3* To: <tccc-announce(a)comsoc.org> Dear Colleagues, I want to gently bring to your attention the upcoming submission deadline for the Inaugural ISOC Symposium on Vehicle Security and Privacy (VehicleSec’23), due in ~2 months (Jan 3). VehicleSec will be co-located with NDSS, one of the "big 4" top-tier computer security conferences. Consistent with NDSS, the 2023 event will still be in a hybrid format to accommodate those who cannot easily travel. The creation of this new symposium builds upon the continuous 4-year growth of the AutoSec (Automotive and Autonomous Vehicle Security) Workshop with NDSS, which strongly encourages us to make this event more formal and stable to better serve the community. The scope of this event has been extended accordingly to include any security/privacy issues related to vehicles (e.g., ground, aerial, underwater), their sub-systems (e.g., in-vehicle networks, autonomy, connectivity, human-machine interfaces), supporting infrastructures (e.g., transportation infrastructure, ground control station), and related fundamental technologies (e.g., sensing, control, AI/ML, real-time computing, location service, simulation, digital twin, etc.). Like previous AutoSec events, we solicit not only regular papers (6-8 pages), but also short/work-in-progress papers (4 pages), and demos/posters (1 page). The 4-page work-in-progress ones are great for initial ideas to solicit feedback from the top-tier security community. The 1-page demos/posters are great for published works to gain more publicity in the community. Several quick highlights of this submission opportunity: - Topic: Any security/privacy issues that can be related to vehicles (no matter ground, aerial, underwater, or other domains). - Solicit (1) regular papers of 6-8 pages, (2) short position papers or work-in-progress (WIP) papers of up to 4 pages, and (3) demo/poster papers of up to 1 page. All exclude bibliography and well-marked appendices. - All accepted papers and demos/posters will be considered for Best Paper and Demo/Poster Awards. The winner and runner-up will win cash prizes. - A special AutoDriving Security Award will be given to one of the accepted papers to recognize and reward research that makes substantial contributions to secure today’s emerging autonomous driving technology. Like previous AutoSec events, this award will also come with cash prizes. - Will provide Student Travel Grants for students to attend the symposium in person. - Will host a Community Reception as a community social event on the night of the symposium (Feb 27, 2023). More details are in the full CFP: https://www.ndss-symposium.org/ndss2023/cfp-vehiclesec/ Last year's program is also put here for your interest: https://www.ndss-symposium.org/ndss-program/autosec-2022. We look forward to your new papers/demos/posters contributions to this brand-new symposium! On behalf of the entire VehicleSec organizing committee. Thank you, -Berkay ---------------- Z. Berkay Celik, Assistant Professor Department of Computer Science Purdue University 305 N. University Street West Lafayette, Indiana, 47907-2107 Email: zcelik(a)purdue.edu Phone: (765) 496-1761 URL: https://beerkay.github.io ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] CFP: IEEE MobiSec 2023 (co-located with IEEE INFOCOM 2023), New York City area, USA, May 2023 (Submission due: 12/20/2022)
by Lars Wolf 15 Nov '22

15 Nov '22

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: IEEE MobiSec 2023 (co-located with IEEE INFOCOM 2023), New York City area, USA, May 2023 (Submission due: 12/20/2022) Datum: Tue, 15 Nov 2022 16:19:56 +0000 Von: Wenjia Li <wli20(a)NYIT.EDU> Antwort an: Wenjia Li <wli20(a)NYIT.EDU> An: tccc-announce(a)COMSOC.ORG Dear Colleagues, Sorry if you receive this message multiple times. We really appreciate if you would consider submitting your work to the 7th IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2023), which will be co-located with IEEE INFOCOM 2023. Please note that the submission due date is December 20, 2022. If you have any question regarding the MobiSec 2023 workshop, please contact the workshop chairs. Thank you. Sincerely Yours, Wenjia Li, Ph.D., SMIEEE Workshop organizer and TPC chair, IEEE MobiSec 2023 Associate Professor, Computer Science New York Institute of Technology New York City, USA +++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ The Seventh IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2023) co-located with IEEE INFOCOM 2023 New York City area, USA May 2023 https://bit.ly/mobisec2023 +++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ Call for Papers To many people, smartphones have been an indispensable part of daily life and work. With personal financial and medical information and job-related data being processed on smartphones and related mobile systems and networks, it is critically important that the development and advancement of secure mobile operating systems, secure mobile applications, secure smartphone devices and cellular networks keep up with the ever‐ growing smartphone usage. For this reason, this research area has been a very important sector in the network and telecommunication industry and a focus of funded research projects in many research institutes. The scope of MobiSec 2023 encompasses the security, privacy, and digital forensics of mobile systems and networks, including but not limited to Android, iOS, and Windows Mobile operating systems, smartphones and applications for these platforms and devices, as well as cellular networks. Topics of interest include (but are not limited to) the following subject categories: + Android, iOS, and Windows Mobile security and privacy + Digital forensics on mobile operating systems, applications, and smartphones + Secure mobile application development + Smartphone device/hardware security + Mobile application security and digital forensics + Mobile user authentication and authorization + Multi‐factor mobile authentication + Mobile user privacy + Mobile vulnerability detection and remediation + Intrusion detection and recovery on mobile OS, applications, smartphones, and cellular networks + Social network security and privacy + Secure cloud for mobile environment + Mobile device management + 4G and 5G security SUBMISSION INSTRUCTIONS The Mobisec 2023 Workshop seeks for original papers which are not currently under review or published in any other conference or journal. Paper length should not exceed six-page standard IEEE conference two-column format (including all text, figures, and references) and submitted as PDF files through the EDAS website: https://edas.info/N30346 Important Dates Submission Due: December 20, 2022 Author Notification: February 6, 2023 Camera-ready Due: March 6, 2023 Honorary General Chair * Dr. Wenjing Lou, Virginia Tech, USA Workshop Organizers and Technical Program Chairs * Dr. Lei Chen (Point of Contact), Georgia Southern University, USA * Dr. Wenjia Li, New York Institute of Technology, USA * Dr. Danda Rawat, Howard University, USA * Dr. Yun Lin (Point of Contact), Harbin Engineering University, China Technical Program Vice Chairs * Dr. Yiming Ji, Georgia Southern University, USA * Dr. Mauro Conti, The University of Padua, Italy * Dr. Feng Zeng, Central South University, China * Dr. Peter Mueller, IBM Zurich Research Laboratory, Switzerland * Dr. Yupeng Hu, Hunan University, China Publication Chairs: * Dr. Narasimha Shashidhar, Sam Houston State University, USA * Dr. Umit Karabiyik, Purdue University, USA * Dr. Yuansheng Luo, Changsha University of Science & Technology, China Publicity Chairs: * Dr. Weitian Tong, Eastern Michigan University, USA * Dr. Nhien-An Le Khac, University College Dublin, Ireland * Dr. Yejun He, Shenzhen University, China * Dr. Yehua Wei, Hunan Normal University, China Web Chair: * Dr. Atef Mohamed, Georgia Southern University, USA * Dr. Weinan Gao, Northeastern University, China * Dr. Di Zhang, University of Jyväskylä, Finland ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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