June 2023 - Cfp - lists.ibr.cs.tu-bs.de

Fwd: Jetzt anmelden! Konferenz "Stadt der Zukunft 2023"
by Lars Wolf 30 Jun '23

30 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: Jetzt anmelden! Konferenz "Stadt der Zukunft 2023" Datum: Fri, 30 Jun 2023 09:01:26 +0200 Von: Stadt der Zukunft <stadtderzukunft(a)tu-braunschweig.de> An: wolf(a)ibr.cs.tu-bs.de Jetzt anmelden! Konferenz "Stadt der Zukunft 2023" Forschung und Aktionen für einen positiven Wandel <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Konferenz #SdZ23 am 11. und 12. Oktober an der TU Braunschweig Städte sind wachsende Ballungszentren menschlicher Aktivität und Innovation. Sie sind Treiber von Ressourcenverbrauch und Klimawandel und gleichzeitig besonders von den Folgen betroffen. Städte haben zugleich immense Potentiale, Orte nachhaltiger Transformationen zu sein. Im Herbst 2023 lädt die Konferenz „Stadt der Zukunft. Forschung und Aktionen für einen positiven Wandel“ zu einem offenen interdisziplinären Dialog an die TU Braunschweig ein. Es erwarten Sie Flashtalks, Live-Pitches, Vorträge, Workshops und Diskussionen, Ausstellungen, Aktionen und Projekte, SpeedDating für PhDs, LiveMusik und vieles mehr. <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Nehmen Sie teil am offenen, vielfältigen und bunten Programm rund um Forschung und Aktionen für einen positiven Wandel für die Stadt der Zukunft. Die Konferenz ist *kostenfrei *zugänglich; eine Anmeldung zur Teilnahme an den Sessions jedoch bis zum 22. September notwendig. Jetzt anmelden und weitersagen! #sdz23.de <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Eine Konferenz des Forschungsschwerpunktes Stadt der Zukunft an der Technischen Universität Braunschweig. Copyright 2023 _Webansicht / Webview <https://tf24e7c89.emailsys1a.net/mailing/189/6798941/6612503/72/ab3c0df1e0/…>_ _Abmelden / Unsubscribe <https://tf24e7c89.emailsys1a.net/189/6798941/2455/6612503/72/a13f27128f/uns…>_

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Fwd: [TCCC-ANNOUNCE] [Deadline Extended] Call for Demos - ACM MobiCom 2023
by Lars Wolf 29 Jun '23

29 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [Deadline Extended] Call for Demos - ACM MobiCom 2023 Datum: Thu, 29 Jun 2023 09:35:05 +0200 Von: Ginés García Avilés <000000b7dad46124-dmarc-request(a)COMSOC-LISTSERV.IEEE.ORG> Antwort an: Ginés García Avilés <gines.garcia(a)I2CAT.NET> An: tccc-announce(a)COMSOC.ORG * Call for Demos * https://sigmobile.org/mobicom/2023/demos.html * Important Dates * Deadlines Dates Submission Deadline July 1, 2023, 11:59 PM AoE *July 15, 2023, 11:59 PM AoE* Notification July 31, 2023 * August 7, 2023* Camera-ready August 7, 2023 *August 14, 2023* * Demo Chairs * - Andra Lutu (Telefonica Research, Spain): andra.lutu(a)telefonica.com - Ilenia Tinnirello (Università degli studi di Palermo, Italy): ilenia.tinnirello(a)unipa.it The ACM MobiCom 2023 Demo session solicits the submission of research, platform, and product demonstrations, and exhibits from both academia and industry. Demonstrations should showcase innovative research or product prototypes, platforms, and applications in the areas of mobile computing and wireless and mobile networking. We strongly encourage demos based on novel applications in the domain of mobile computing and wireless systems. We also welcome live demos reproducing evaluation results of papers appearing in ACM MobiCom 2023 or past editions as well as other relevant venues. Please refer to the main conference introduction and CFP for the general areas that are relevant to the typical MobiCom audience. * Submission Instructions * Please send your proposal of demo or exhibit as a “demo paper” through HotCRP at the following link: https://mobicom2023demos.hotcrp.com/ The demo paper should be a summary or extended abstract describing the research to be presented, details about what will be actually shown to the audience, maximum 2 pages in US letter size (8.5 x 11 inches) with fonts no smaller than 10 point size, in PDF file format with one extra page for references. To comply to these requirements, you might find useful the official ACM templates for LaTeX and Word. LaTeX users should use the following document class: \documentclass[sigconf,10pt]{acmart} Demo submissions accept single-blind submissions. Once your demo submission is accepted, we will include the abstract of your demo paper on the conference website and publish it in the main proceedings and the ACM digital library. All demo submissions will be considered for the "MobiCom '23 Best Demo Award". Student authors of demo submissions can also opt-in for this year’s Student Research Competition (see the Mobicom’23 Poster CFP for more details). The SRC offers a unique forum for graduate students (i.e., enrolled in a master or Ph.D. program) and undergraduate students (students enrolled in a program below master level) to present their original research before a panel of judges and attendees. Student authors are strongly encouraged to include their demo submissions in the ACM MobiCom SRC. * Demo presentation * For accepted demo submissions, authors will prepare for demonstrating their work during the dedicated demo session. Please note that the session will only run on-premise, and we expect authors to address questions from conference attendees in a live demo session onsite (no hybrid mode). We look forward to your submissions. Please feel free to contact us with any questions about submitting a Demo. ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: CFP FGSN2023
by Lars Wolf 28 Jun '23

28 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: CFP FGSN2023 Datum: Wed, 28 Jun 2023 17:33:03 +0000 Von: Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com> An: Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com> Dear FGSN friend, Due to several requests we have extended the deadline for submissions to the FGSN until 15^th of July, 2023 Check the CFP: https://easychair.org/cfp/fgsn2023 <https://easychair.org/cfp/fgsn2023> And submit a paper: https://easychair.org/conferences/?conf=fgsn2023 <https://easychair.org/conferences/?conf=fgsn2023> Thank you, and best regards, Krzysztof Piotrowski *Dr.-Ing. Krzysztof Piotrowski** *Group Leader* *Wireless Systems / Sensor Networks and Middleware Platforms** *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden. *Dr.-Ing. Krzysztof Piotrowski Group Leader Wireless Systems / Sensor Networks and Middleware Platforms* *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden. *From:* Piotrowski Krzysztof *Sent:* Thursday, May 25, 2023 17:56 *To:* Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com>> *Subject:* CFP FGSN2023 Dear FGSN friend J Maybe you do not know it yet, but we plan the 20^th FGSN to happen together with the NetSys 2023 conference in Potsdam on 4^th September, 2023. We would appreciate you to help us making the fact known and distributing the CFP among your team and students so that we can together enjoy the fruitful discussions on sensor networks, their history, current state and future. Due to the fact that we have the 20^th anniversary, the main topic of the meeting is /Quo Vadis Sensor Networks/ (But all subjects on sensor networks are welcome!) here you will find the CFP: https://easychair.org/cfp/fgsn2023 <https://easychair.org/cfp/fgsn2023> here is our subpage on the NetSys 2023 webpage: https://www.kuvs.de/netsys/2023/calls/fgsn/ <https://www.kuvs.de/netsys/2023/calls/fgsn/> Thank you, and Best regards, Krzysztof Piotrowski *Dr.-Ing. Krzysztof Piotrowski** *Group Leader* *Wireless Systems / Sensor Networks and Middleware Platforms** *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden.

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Fwd: [TCCC-ANNOUNCE] [CFP] IEEE/ACM DS-RT 2023 - Special Sessions
by Lars Wolf 28 Jun '23

28 Jun '23

-------- Ursprüngliche Nachricht -------- Von: Rodolfo Lima Coutinho <rodolfo.coutinho(a)CONCORDIA.CA> Gesendet: 28. Juni 2023 18:29:43 MESZ An: tccc-announce(a)COMSOC.ORG Betreff: [TCCC-ANNOUNCE] [CFP] IEEE/ACM DS-RT 2023 - Special Sessions ******************************************************* 27th IEEE/ACM DS-RT 2023 - Special Sessions http://ds-rt.com/2023/home ******************************************************* Information: Special Session Submission Deadline: July 4th, 2023 ******************************************************* The 2023 edition of the IEEE/ACM 27th International Symposium on Distributed Simulation and Real Time Applications (DS-RT) will be held in Singapore. DS-RT 2023 serves as a forum for simulationists from academia, industry and research labs, for presenting recent research results in Distributed Simulation and Real Time Applications. DS-RT 2023 targets the growing overlap between large distributed simulations and real time applications, such as mirror world simulations and collaborative virtual environments. The conference features prominent invited speakers as well as papers by top researchers in the field. DS-RT 2023 will include contributed technical papers, invited papers, and panel discussions. The proceedings will be published by IEEE-CS press. This event is a wonderful opportunity to join the community of experts on related topics, share experiences, and have fruitful discussions. You are kindly invited to attend this prestigious conference. This year, DS-RT will feature the following Special Sessions (http://ds-rt.com/2023/specialsession.html) - Special Session on Distributed and Real-Time Simulations for Metaverse Systems - Special Session on Artificial Intelligence Approaches for Distributed and Real-Time Simulations - Special Session on Modeling and Simulation of Agent-based Systems - Special Session on Modeling, Analysis, and Simulation of Drones and UAVs in emergent applications - Special Session on Distributed Systems in Industry 4.0, Digital Twin, and Internet of Things Paper Submission Guidelines: Papers must be unpublished and must not be submitted for publication elsewhere. All papers will be reviewed by Technical Program Committee members and other experts active in the field to ensure high quality and relevance to the conference. At least one author of accepted papers must attend the conference to present its contribution. Papers should be written in English and should not exceed 10 pages, double column, IEEE style including tables and figures. Note that the regular paper size will be 8 pages, with the possibility to obtain up to 2 additional pages (total 10 pages) by paying a publication fee. A template for IEEE Proceedings style (LaTeX2e and MS Word) can be found at http://www.ieee.org/conferences_events/conferences/publishing/templates. Only Postscript and PDF formats are accepted. Papers must be submitted electronically through the EDAS system. The complete list of authors' names must be inserted when registering the paper on the EDAS system. Authors names can be inserted in the paper: that is, the review process is single blind. Authors should check if they already have a login on the EDAS system; otherwise, an account must be created before submitting a paper. If you are not already registered to EDAS please follow the instructions on EDAS registration page (https://edas.info/N30484), where you can login, or you can create a new EDAS user account. ******************************************************* Submission Deadline: July 4th, 2023 Submission link: https://edas.info/N30484 ******************************************************* *** ORGANIZING COMMITTEE DS-RT 2023 Special Sessions *** * DS-RT 2023 Special Sessions Chair: Rodolfo W. L. Coutinho, Concordia University, Canada ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: IEEE SENSORS 2023 Submission Deadline: 30 June
by Lars Wolf 27 Jun '23

27 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: IEEE SENSORS 2023 Submission Deadline: 30 June Datum: Tue, 27 Jun 2023 13:12:52 +0000 Von: IEEE SENSORS 2023 <ckravec(a)conferencecatalysts.com> Antwort an: IEEE SENSORS 2023 <ckravec(a)conferencecatalysts.com> An: wolf(a)ibr.cs.tu-bs.de IEEE SENSORS 2023 Submission Deadline: 30 June View this email in your browser <https://mailchi.mp/ieee-sensors/sensors-2023-call-for-papers-extended?e=4d9…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> 29 October - 1 November 2023 Vienna, Austria The Extended Paper Submission Deadline is 30 June Author Instructions <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> IEEE SENSORS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the areas of sensors and sensing technologies. IEEE SENSORS 2023 will include keynote addresses and invited presentations by eminent scientists and engineers. Submit a Paper <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Save the Date <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> *IEEE SENSORS 2023* October 29 - November 1, 2023 Vienna, Austria Add to Calendar <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Stay Connected LinkedIn <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Twitter <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Website <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Gold Patron <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Exhibitors <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Local Partner <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Conference Sponsor <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Become a Patron/Exhibitor <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> /Copyright © 2023 IEEE, All rights reserved. You are receiving this email because of your relationship to the IEEE Sensors Council. This list is used ONLY for IEEE Sensors Council announcements. It is NOT shared with others. If you unsubscribe, you will not receive future announcements about IEEE Sensors Council activities, such as the IEEE Sensors Journal and future IEEE SENSORS conferences./ IEEE PRIVACY POLICY <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Want to change how you receive these emails? You can update your preferences <https://ieee-sensors.us7.list-manage.com/profile?u=f2d2eabe9a09b13da6607ea3…> or unsubscribe from this list <https://ieee-sensors.us7.list-manage.com/unsubscribe?u=f2d2eabe9a09b13da660…>.

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Fwd: PERCOM 2024 - CALL FOR PAPERS
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: PERCOM 2024 - CALL FOR PAPERS Datum: Sun, 25 Jun 2023 21:12:19 +0000 Von: Edinger, Prof. Dr. Janick <janick.edinger(a)UNI-HAMBURG.DE> Antwort an: Mailing List der GI FG 3.3.1 "Kommunikation und Verteilte Systeme" <KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE> An: KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE ========================================================== PERCOM 2024 - CALL FOR PAPERS ========================================================== The 22nd International Conference on Pervasive Computing and Communications (PerCom 2024), March 2024 Biarritz, France http://www.percom.org ========================================================== IEEE PerCom, now in its 22nd year, will be held in Biarritz, France in March 2024 as a physical event. PerCom is the premier annual scholarly venue in pervasive computing and communications. Pervasive computing is constantly at the forefront of mobile systems research, and has found its way into many commercial applications due to tremendous advances in a broad spectrum of technologies and topics such as wireless networking, mobile and distributed computing, sensor systems, ambient intelligence, and smart devices. SCOPE PerCom 2024 solicits research contributions in all areas pertinent to pervasive computing and communications, , especially those that cross traditional research boundaries. In particular, PerCom targets contributions in: * Advances in pervasive systems and infrastructures: middleware systems and services; data engineering for pervasive computing; cloud, fog and edge computing; integrations of smartphones in pervasive experiences; applications of device-to-device coordination. * Theories, models, and algorithms: context modeling & reasoning; adaptive computing; activity & emotion recognition; programming paradigms; applied deep/federated/decentralized machine learning; causal learning; cognitive computing; complex networks; spatio-temporal modeling. * Domain-specific challenges and novel applications: urban/mobile crowdsensing & intelligence; PerCom for healthcare and well-being; cyber-physical PerCom; smart homes and virtual assistants; mixed reality; sports analytics; crime prevention; pervasive nowcasting; urban robotics; pervasive AR/VR; smart vehicles; disaster sensing and management. * Intersections of PerCom with: IoT and sensor systems; RFID; opportunistic networks; pervasive data science; cyber-physical systems; 3D networks; green networking. * New techniques for user-level concerns: participatory and social sensing; trust, security, privacy, fairness, and ethics; user interface, interaction, and persuasion; online and offline social networking; human-machine collaboration. * Technological innovations: architectures, protocols, and technologies for pervasive communications; energy-harvesting, self-powered, or battery-less systems; mobile and wearable systems; smart devices and environments; positioning, navigation, timing, and tracking technologies; and device-free human sensing. Contributions can be analytical, empirical, technological, methodological, or a combination thereof. Papers reporting strong systems engineering contributions backed by solid and appropriate evaluations are strongly encouraged. Contributions should be novel (those presenting only minor improvements over the state of the art will not be considered), should demonstrate a significant impact (i.e., they should address an outstanding problem), and should be rigorous. Note that the impact of the contributions should be demonstrated in the context of pervasive computing and communications applications. READ BEFORE SUBMITTING PerCom 2024 will follow a double-blind review process. As a result, authors must make a good-faith effort to anonymize their submissions. For detailed submission instructions, please check the www.percom.org website. PerCom would not be PerCom without its community. For this reason, we are looking for ways to strengthen the community and encourage meaningful interactions. To this end, all accepted papers must be presented in person by one of the authors, in addition to having an associated full registration. Failure to comply with this requirement will result in the exclusion of the paper from the final proceedings and from the IEEE Digital Library, and the paper will not be eligible for the Best Paper Award. IMPORTANT DATES * Paper registration in EDAS: September 25, 2023 * Submission via EDAS: October 2, 2023 * Notification: December 21, 2023 * Camera Ready: February 2024 (exact date to be announced) BEST PAPER AWARD AND EDITORIAL FOLLOW-UPS The best paper will receive the prestigious Mark Weiser Best Paper Award. Selected papers will be invited to submit extended versions for a special issue of the Pervasive and Mobile Computing Journal. ORGANIZING COMMITTEE * General Chairs Philippe Lalanda, University of Grenoble, France Claudio Bettini, University of Milan, Italy * TPC Chair and Vice-Chairs Chiara Boldrini, IIT-CNR, Italy Sara Khalifa, CSIRO, Australia Nirmalya Roy, University of Maryland Baltimore County, USA Stephan Sigg, Aalto University, Finland To contact the TPC chair and vice-chairs, please write to percom2024-tpc-chairs(a)iit.cnr.it

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Fwd: [TCCC-ANNOUNCE] ACM SenSys 2023 Call for Papers: Submission Deadline on June 29, 2023 (firm)
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] ACM SenSys 2023 Call for Papers: Submission Deadline on June 29, 2023 (firm) Datum: Sun, 18 Jun 2023 23:14:34 +0800 Von: Chenshu Wu <wucs32(a)GMAIL.COM> Antwort an: Chenshu Wu <wucs32(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG Dear Colleagues, We are writing to kindly bring your attention to the updated SenSys 2023 Call for Papers <https://sensys.acm.org/2023/cfp/>. This year’s conference will be held on November 13-15 in Istanbul, Turkey. We particularly would like to highlight two changes in the CFP: (1) the submissions will be in 10pt font (instead of 9pt in the old CFP) and (2) the submission deadline is firm. Please consider submitting your wonderful work! We apologize if you receive repetitive emails about this CFP. Best regards, Wei Gao and Chenshu Wu SenSys 2023 Publicity Chairs ================================== Sensys 2023 Call for Papers The ACM Conference on Embedded Networked Sensor Systems (SenSys 2023) is the premier computer systems conference focused on the architecture, design, implementation, and performance of networked sensing systems, sensor-oriented data modeling and analytics, and sensor-enabled applications. ACM SenSys brings together academic, industry, and government professionals to a single-track, highly selective forum that takes a broad view on the areas of computing relevant to the future of networked embedded sensor systems. Topics of interests include, but are not limited to, the following: - New platforms and hardware designs for networked sensor systems - New communication paradigms for ubiquitous connectivity - Low-power wireless media access control, network, and transport protocol designs - Systems software, including operating systems, network stacks, and programming - System services such as time and location estimation - Low-power operation, energy harvesting, and energy management - Resource-efficient machine learning for embedded and mobile platforms - Mobile and pervasive systems with elements of networked sensing - Data management and analytics, including quality, integrity, and trustworthiness - Learning algorithms and models for perception, understanding, and adaptation - Heterogeneous collaborative sensing, including human-robot sensor systems - Security and privacy in networked sensor applications and systems - Equity and fairness impacts of automated sensing and decision systems - Fault-tolerance, dependability, and verification - Applications and deployment experiences We invite technical papers describing original ideas, groundbreaking results, and real-world experiences involving innovative networked embedded sensor systems. Successful submissions will explain why the topic is relevant to a vision of the future of sensing systems. Submissions will be judged on originality, significance, clarity, relevance, and correctness. Important Dates Paper Registration and Abstract 22 June 2023, 23:59 AoE *Paper Submission 29 June 2023, 23:59 AoE (firm)* Notification of Paper Acceptance 19 September 2023 Camera-Ready Paper Deadline October 2023, date t.b.a. Conference 13-15 November 2023 Submission Guidelines Submitted papers must be unpublished and must not be currently under review for any other publication. Submissions must be full papers, at most 12 single-spaced 8.5” x 11” pages with *10-pt font size* in two-column format, including figures and tables. As for references, submissions may include as many pages as needed. All submissions must use the LaTeX (preferred) or Word styles found here <http://www.acm.org/publications/proceedings-template>. LaTeX submissions should use the acmart.cls template (sigconf option), with the 10-pt font. The 9-pt font format will be used for the camera-ready version of accepted papers. Authors must make a good faith effort to anonymize their submissions. Although submission is double-blind, existence or availability of non-anonymous preprints (on arXiv or other preprint servers) will not lead to your paper being rejected. Reviewers will be instructed not to actively look for such preprints, but encountering them will not constitute a conflict of interest. Papers that do not meet the size, formatting, and anonymization requirements will not be reviewed. We require each paper to be in Adobe Portable Document Format (PDF) and submitted through the conference submission system. Papers that describe experiments on human subjects, or that analyze nonpublic data derived from human subjects (even anonymized data), should briefly describe how the research protocol addresses ethical considerations and whether their work was vetted by an ethics review (e.g., IRB approval). We expect authors to follow the rules of their host institutions around data collection and experiments with human subjects. Accepted submissions will be available on the ACM digital library. SenSys 2023 Conference Submission System <https://sensys23.hotcrp.com/> ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] IEEE/IFIP PEMWN 2023 [Firm deadline]
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] IEEE/IFIP PEMWN 2023 [Firm deadline] Datum: Mon, 19 Jun 2023 10:15:58 +0100 Von: Ichrak Amdouni <ichrak.amdouni(a)ENSI-UMA.TN> Antwort an: Ichrak Amdouni <ichrak.amdouni(a)ENSI-UMA.TN> An: tccc-announce(a)COMSOC.ORG [Apologies if you receive multiple copies of this message.] *************************Call for Papers**************************** IEEE/IFIP PEMWN 2023 The 12th International Conference on Performance Evaluation & Modeling in Wired and Wireless Networks in Berlin, Germany, on Sept. 27-29 https://sites.google.com/view/pemwn2023 ******************************************************************** The 12th IEEE/IFIP International Conference on Performance Evaluation and Modeling in Wired and Wireless Networks (PEMWN) is inviting researchers to submit original and unpublished papers pertaining to wired and wireless networks covering novel contributions related to protocols, technologies, architectures, performance evaluation, optimization, modeling, implementation, simulation and experiments. Technically cosponsored by IFIP and IEEE ComSoc (IEEE approval pending). Proceedings will be published in IEEE Xplore, and indexed in Scopus. Extended versions of the 3 best papers will be published in "*Annals of Telecommunications", Springer* Confirmed keynotes include talks from Giuseppe Bianchi <https://scholar.google.com/citations?user=JQsX7rAAAAAJ> and Falko Dressler <https://scholar.google.com/citations?user=sK8213AAAAAJ>. *IMPORTANT DATES* ----------------------------- *Submission Deadline : *June 30, 2023** Authors Notification: *July 31, 2023* Camera Ready Paper Submission and Registration: *August 27, 2023* Conference Date: *September 27-29, 2023* *MAIN TOPICS OF INTEREST* ----------------------------------------- The topics addressed by the conference include, but are not limited to: § 5G and 6G networks § Cloud computing, Mobile cloud computing § Cloud continuum, edge and fog computing § Software Defined Networking (SDN), programmable data planes § Network Function Virtualization (NFV) § Radio access networks (RAN), Cloud-RAN, and Fog-RAN § Software Defined Radio (SDR), Cognitive Radio § Device-to-Device (D2D) and Machine-to-Machine (M2M) communications § Unmanned Aerial Vehicles and Internet of drones § Long-range IoT (LoRa, Sigfox, NB-IoT) § Low Power Wide Area (LPWA) networks § Internet of Things (IoT), Internet of Everything (IoE) § Industry 4.0/5.0 and Industrial IoT § Smart cities, smart farming, e-health, and home automation applications § Network Management § Privacy-preserving communication § Communication Networks with the Digital twins and metaverse § Software & platforms for networked device development & experiments § Content Centric Networks (CCN), Information-Centric Networks (ICN) § Internet of the Future, New IP § Internet of Vehicles § Machine learning for IoT and networks § Cyber-security in wired and wireless communications § Blockchain applications and technologies *Authors Instructions* ------------------------------ Prospective authors should submit original and unpublished papers limited to 6 pages in PDF format. Manuscripts should follow IEEE Two-Column format <http://www.ieee.org/conferences_events/conferences/publishing/templates.html> . All submitted manuscripts will be double-blind-reviewed. Submission is via EasyChair <https://easychair.org/conferences/?conf=pemwn2023>. *Committees* ---------------- *General Chair* Emmanuel Baccelli, Freie Universitat Berlin, Germany *Honorary Chairs* Leila Azouz Saidane, ENSI-University of Manouba, Tunisia Paul Muhlethaler, Inria Paris, France *Steering Committee* Cedric Adjih, Inria Saclay, France Farouk Kamoun, ENSI, Tunisia Giuseppe Bianchi, University of Roma Tor Vergata, Italy Guy Pujolle, Sorbonne University, France Noura Limam, University of Waterloo, Canada Periklis Chatzimisios, International Hellenic University,Thessaloniki, Greece Raouf Boutaba, University of Waterloo, Canada *Technical Program Committee Co-Chairs* Anis Laouiti, Telecom SudParis, Institut Mines-Télécom, Institut Polytechnique de Paris, France Oliver Hahm, Frankfurt University of Applied Sciences, Germany *Local Organization Chair* Larissa Groth, Freie Universitat Berlin, Germany *Technical Chair* Cherif Ghazel, ESEN-University of Manouba, Tunisia *Publicity Chair* Ichrak Amdouni, ENSI-University of Manouba, Tunisia *Publication Chair* Lobna Kriaa, ENSI-University of Manouba, Tunisia *Web Chair* Chiraz Houaidia, ENSI-University of Manouba, Tunisia *Technical Program Committee Members* Abdelatif Kobbane, ENSIAS, Morocco Abderrahmen Mtibaa, Carnegie Mellon University, USA Adrien Van den Bossche, University of Toulouse, France Aida Ben Chehida, ENIT, Tunisia Alex Afanasyev, Florida International University Andre-Luc Beylot, ENSEEIHT, France Andrea Baiocchi, University of Rome Sapienza, Italy Anis Laouiti, Télécom Sud Paris, France Badii Jouaber, Télécom SudParis, France Cedric Adjih, Inria Paris, France Cherifa Boucetta, ENSI-University of Manouba, Tunisia Cherif Ghazel, ESEN-University of Manouba, Tunisia Chiraz Houaidia, ENSI-University of Manouba, Tunisia Chris Blondia, University of Antwerp, Belgium Chung Shue Chen (Calvin), Nokia Bell Labs France Emmanuel Baccelli, Freie Universitat Berlin, Germany Engy Ali Maher, German University in Cairo, Egypt Farouk Kamoun, ENSI-University of Manouba, Tunisia Faten Ben Abdallah, Supcom, Tunisia Gerard Chalhoub, University of Clermont-Ferrand, France Giuseppe Bianchi, University of Roma Tor Vergata, Italy Guy Pujolle, Sorbonne University, France Hanifa Boucheneb, Ecole polytechnique de Montréal, Canada Hella Kaffel-Ben Ayed, Faculty of Sciences of Tunis, Tunisia Ichrak Amdouni, ENSI-University of Manouba, Tunisia Ines Ben Jemaa, IRT SystemX, France Juan Chafla Altamirano, Pontificia Universidad Católica del Ecuador, Ecuador Khalifa Toumi, Télécom SudParis, France Lamia Ben Azzouz, ENSIT, Tunis, Tunisia Laurent Toutain, IMT Atlantique Leila Azouz Saidane, ENSI-University of Manouba, Tunisia Li Li, Wuhan university, China Lobna Kriaa, ENSI, University of Manouba Lou Salaun, Nokia Bell Labs France Lucia Lo Bello, University of Catania, Italy Mariam Bouchaala, Sesame University, Tunisia Marian Buschsieweke, Otto-von-Guericke-University Magdeburg, Germany Mesut Günes, Otto-von-Guericke-University Magdeburg, Germany Michel Misson, University of Auvergne, France Mohamed El Houcine El Hdhili, ISI, Tunisia Mohamed Faten Zhani, ETS Montreal, Quebec University, Canada Mohamed Haddad, Vedecom, France Mohamed Mosbah, LaBRI, Bordeaux INP, France Mohammed Erradi, ENSIAS, Morocco Mohsen Guizani, University of Idaho, USA Mouna Ayari, ENSI-University of Manouba, Tunisia Nadjib Achir, University of Paris 13, France Nadjib Aitsaadi, ESIEE, France Nour Brinis, ISTIC-Borj-Cedria, University of Carthage, Tunisia Noura Limam, University of Waterloo, Canada Oliver Hahm, Frankfurt University of Applied Sciences, Germany Pascal Lorenz, University of Haute Alsace, France Paul Muhlethaler, Inria Paris, France Periklis Chatzimisios, International Hellenic University,Thessaloniki, Greece Pierre Merdrignac, Vedecom, France Rahim Haiahem, University of Annaba, Algeria Rami Langar, University of Paris-Est Marne-la-Vallée, France Raouf Boutaba, University of Waterloo, Canada Réjane Dalcé, IRIT, France Reza Malekian, Malmö University, Sweden Riadh Dhaou, ENSEEIHT, France Ridha Soua, University of Luxembourg, Luxembourg Rihab Boussada, Sesame University, Tunisia Ruben Milocco, Universidad Nacional del Comahue, Argentina Saadi Boudjit, University Sorbonne Paris Nord, France Selma Boumerdassi, CNAM, France Sidi-Mohammed Senouci, University of Bourgogne, France Sonia Mettali, ISAMM, Manouba, Tunisia Soumya Banerjee, Inria-EVA-PARIS, France Stefano Secci, CNAM, France Sylvain Cherrier, University of Paris-Est Marne-la-Vallée, France Thierry Val, University of Toulouse, France Tijani Chahed, Télécom SudParis, France Tobias Heer, Esslingen University of Applied Science, Germany Veselin Rakocevic, University of London City, United Kingdom Yassine Ghamri Doudene, university of La Rochelle, France Yosra BenSaid, ENSI-University of Manouba, Tunisia ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] CALL FOR PAPERS - NET4us 2023 (deadline extension, firm)
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CALL FOR PAPERS - NET4us 2023 (deadline extension, firm) Datum: Mon, 19 Jun 2023 03:09:55 -0400 Von: Pietro Manzoni <pmanzoni(a)DISCA.UPV.ES> Antwort an: Pietro Manzoni <pmanzoni(a)DISCA.UPV.ES> An: tccc-announce(a)COMSOC.ORG CALL FOR PAPERS - NET4us 2023 (deadline extension, firm) 2nd Workshop on Networked Sensing Systems for a Sustainable Society (NET4us 2023) In conjunction with ACM MOBICOM - The 29th Annual International Conference On Mobile Computing And Networking, 2-6 Oct. 2023, Madrid, SPAIN https://grc.webs.upv.es/events/net4us2023/ The deadline for submissions has been extended until July 3rd, 2023 (FIRM DEADLINE) With today's advancements in IoT sensor technologies and wireless and mobile connectivity, digital innovation and sustainability concepts have become mutually reinforcing. Companies must embrace digital transformation to pivot to more energy-efficient solutions, use resources more responsibly and organize processes in ways that reduce waste. Examples of possible actuation areas are energy management, air pollution monitoring, fleet management, water management, and farming. At the same time, the growth of the number of IoT deployments and its integration in the 5G and future 6G mobile networking contexts requires the solutions themselves to be green and sustainable, with, for example, the integration and use of energy and environmentally conscious technical solutions for communications. With these objectives in mind, researchers must overcome several challenges, ranging from developing "better" and novel sensing objects that must be energy-efficient, and able to communicate via wide-area networks (e.g., LPWAN) to relying on the general public for the deployment of such systems and crowdsourcing the data collection using mobile sensing devices (e.g., citizen science initiatives). The NET4us workshop offers a singular opportunity to discuss novel research contributions addressing systems and applications based on mobile computers and wireless networks in the specific area of networked sensing systems for a sustainable society while considering multidisciplinary approaches that emphasize the human role in resolving these issues. We propose this workshop to provide an alternative forum for the researchers of mobile networked sensing solutions and help create a community around this topic. With this workshop, we intend to attract contributions from different areas and backgrounds, to facilitate multidisciplinary discussions across academicians, practitioners, and policymakers, leading to high-impact and transformative research. TOPICS • Addressing Latency Challenges for Mobile and XR Applications • Analysis, simulation, testbed, and measurement campaigns • Converged communication, computing, and storage technologies • Crowd-sensing, human-centric sensing, citizen science • Data collection, organization and dissemination methods • Digital twins networking and system • Emerging applications (e.g., Smart Tourism, Society 5.0, ...) • Energy efficiency, energy harvesting, power management, and green operation • Enhancing user experience and interaction with sensing systems • Environmental intelligence solutions • Industrial Network and Industry 4.0 • IoT for Open Science • Lightweight security design • Mobile communication in remote and extreme conditions • Network pluralism for integrated connectivity in the edge-cloud continuum • Rural area sensing and connectivity solutions • Smart objects, cooperative devices, environments, middleware, and platforms • TinyML systems and application • Ultra-low-power IoT technologies and embedded systems architectures • Virtualization, sensors aggregation, sensors sharing • Zero-emission base stations, communication devices, and networks SUBMISSION INSTRUCTIONS * Please submit your paper via https://net4us2023.hotcrp.com. IMPORTANT DATES * Submissions deadline: July 3rd, 2023 (FIRM DEADLINE) * Camera-ready papers due: August 11, 2023 * Workshops date: October 2, 2023 GENERAL Chairs * Pietro Manzoni, Universitat Politecnica de Valencia, Spain * Catia Prandi, University of Bologna, Italy TPC-Chairs * Marco Zennaro, ICTP, Trieste, Italy * Nathalie Mitton, Inria Lille-Nord Europe / FUN, France * Ruidong Li, Kanazawa University, Japan ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] International IEEE Conference WinCom ( Istanbul, Turkey) (Hybrid mode: Physical and virtual)
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] International IEEE Conference WinCom ( Istanbul, Turkey) (Hybrid mode: Physical and virtual) Datum: Sun, 25 Jun 2023 10:09:33 -0500 Von: Afaf Bouhoute <afaf.bouhoute(a)USMBA.AC.MA> Antwort an: afaf.bouhoute(a)USMBA.AC.MA An: tccc-announce(a)COMSOC.ORG Dear Profs and Colleagues It is our pleasure to invite you to submit your recent work at the *IEEE WinCom2023, the 10th International Conference on Wireless Networks and Mobile Communications (WINCOM 2023)*, which will be held in *Istanbul*, *Turkey*, from *26th to 28th October 2023 *(Hybrid mode: Physical and virtual). https://www.wincom-conf.org/WINCOM_2023/?page=home The submission deadline is rapidly approaching. Submission: https://www.wincom-conf.org/WINCOM_2023/?page=submission Submit your paper through Edas link: https://edas.info/newPaper.php?c=30874&track=117797 All registrations & payment MUST be DONE through the wire Transfer. At least one of the authors listed in the paper must register for WINCOM23. One registration may cover up to two (2) papers of which the registrant is co-author. Registration Rates Category Before Registration deadline After Registration deadline Author (IEEE Member) 300 € 400 € Author (Non-Member) 400 € 500 € *Author (Low and middle income countries) 200 € 300 € From Extra paper accepted 100 € 150 € Non-Author (Attending only) 120 € 120 € https://www.wincom-conf.org/WINCOM_2023/assets/CFP-ISIoT1.pdf Call for papersDownload CFP <http://wincom-conf.org/WINCOM_2023/CFP-WINCOM23.pdf> WINCOM 2023 solicits high-quality and original contributions in ubiquitous networking, but not limited to, the following directions - Wireless Mobile Networks - Next-Generation Networks: 5G and 6G - AI, Machine learning in Network applications - AI-Enabled Networks - Game theory applied to networking problems - Learning theory to solve networking problems - Big Data for wireless networks - Federated learning applied to networking - Intelligent vehicle technologies and vehicular networks - Internet of thing and applications - Internet of Thing use cases and their applications - Artificial intelligence and machine learning for wireless communication systems - Smart global connectivity - Challenges and issues in designing AI-enabled wireless networks - Deep learning techniques for wireless networks - Cloud Computing, Networking and Storage - Mobile slicing and Multi-homing - Cooperative/non-cooperative communications - Self-adaptation on the service layer - Service discovery and portability - Future Internet and Next-Generation Networking - Green Communication Systems and Networks - Modeling and performance evaluation - Security and Cybersecurity - Trust, Privacy & Blockchain Platforms - Signal processing for Wireless communication - Physical layer design - Modulation, coding, and diversity techniques - Channel capacity estimation, modeling and equalization - Radio resource management, allocation and scheduling - Congestion, load and admission control - Smart antennas: MIMO, Massive MIMO and beamforming - Reconfigurability, adaptivity in MAC and PHY layers - Adaptive and cognitive MAC - Cognitive radio networks, SDN and NFV - Cross-layer design involving MAC layer - Routing and QoS provisioning - Multihop communications: Ad hoc, WSN, DTN, VANET - M2M and MTC communications - Mobility Issues and continuity of services - Emerging Internet applications - Context and location-awareness in pervasive systems - Emerging wireless and mobile applications - User interfaces, user-machine interactions - P2P services for multimedia - Service oriented architectures - e-Healt, Body area networks - Mobile health care and medical applications - Implementation, testbeds and prototypes - Satellite Communications and Networking -- Afaf Bouhoute, Ph.D Assistant Professor At Faculty of Science, Fez, SMBA University, Morocco Laboratoire de Physique Appliquée, Informatique et Statistique (LPAIS) e-mail: afaf.bouhoute(a)usmba.ac.ma, afaf.bouhoute(a)gmail.com ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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