- Cfp - lists.ibr.cs.tu-bs.de

Fwd: Call for Paper in ENSsys 2023
by Lars Wolf 13 Jul '23

13 Jul '23

-------- Weitergeleitete Nachricht -------- Betreff: Call for Paper in ENSsys 2023 Datum: Thu, 13 Jul 2023 20:29:23 +0000 Von: Bader, Sebastian <sebastian.bader(a)miun.se> Dear previous ENSsys submitters! Sorry if you receive this information through multiple channels, but we thought you might be interested to hear that ENSsys will this year again be part of SenSys. The workshop will be held in advance to the regular SenSys programme on *November 12* in Turkiye, at Bahcesehir University <https://www.bau.edu.tr/>, Istanbul. We are open to submissions of full papers (up to 6 pages), position papers (up to 3 pages), as well as demo and poster papers (up to 2 pages) through the following HotCRP page: https://enssys2023.hotcrp.com/ <https://enssys2023.hotcrp.com/> Topics of interest include, but are not limited to, the following: * Power management concepts, algorithms and circuits for energy-harvesting sensing systems * Hardware and software concepts, algorithms and circuits for intermittent computing * Middleware and services supporting interoperability between zero-energy networks * Resource management and operating system support for energy-harvesting sensing systems * Network-wide distributed energy management (e.g. routing, adaptive duty cycling, etc.) * Artificial intelligence for battery-free systems * Communication in intermittent-power domain * Online measurement of energy intake and consumption * Predicting energy intake and consumption * Ensuring reliable operation in energy-harvesting sensor systems * Modeling, simulation and tools for effective design of future energy harvesting sensing systems * Architectures and standards for energy-neutral, power-neutral or intermittent sensing systems * Internet of (battery-less) things * Experience with real-world deployments and innovative applications Important dates: * *Submission deadline: Sept 08, 2023 (23:59 AOE)* * *Notification of acceptance: Oct 6, 2023* * *Camera ready deadline: Oct 20, 2023* * *Workshop: Nov 12, 2023* More information can be found in the attached CfP document and on the workshop website at www.enssys.org <http://www.enssys.org> We are looking forward to your submissions! Thanks, Sebastian Bader and Bashima Islam, General chairs Domenico Balsamo, TPC chair

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Fwd: [TCCC-ANNOUNCE] IEEE JSAS - Special issue on Emerging Technologies in Sensor Networks
by Lars Wolf 11 Jul '23

11 Jul '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] IEEE JSAS - Special issue on Emerging Technologies in Sensor Networks Datum: Mon, 10 Jul 2023 20:24:55 -0700 Von: Reza Malekian <rza.mlkn(a)GMAIL.COM> Antwort an: Reza Malekian <rza.mlkn(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG Dear Colleagues, You are cordially invited to submit your original research contributions, tutorials, or review papers to the Special Section of IEEE Journal of Selected Areas in Sensors (JSAS) <http://ieee-jsas.org/> that focuses on the state-of-the-art in “Emerging Technologies in Sensor Networks <https://ieee-jsas.org/wp-content/uploads/2023/07/IEEE-JSAS-Special-Section-…> ”. The submission deadline is September 15, 2023. Please see the call for papers below. We look forward to receiving your submissions. Best Regards, Hossein Fotouhi (Mälardalen University), Reza Malekian (Malmö University), Rafia Inam (Ericsson), Hana Khamforoush (University of Kentucky), Mohammad Loni (Volvo Construction Equipment), and Nima Dokoohaki (Accenture). ============================== Call For Papers IEEE Journal of Selected Areas in Sensors (JSAS) <http://ieee-jsas.org/> ( https://ieee-jsas.org/) Special Issues on Emerging Technologies in Sensor Networks <https://ieee-jsas.org/wp-content/uploads/2023/07/IEEE-JSAS-Special-Section-…> ( https://ieee-jsas.org/wp-content/uploads/2023/07/IEEE-JSAS-Special-Section-… ) Sensor network is a fundamental building block of IoT applications, enabling reliable communication, while it is undergoing significant transformation through the integration of emerging technologies such as AI/ML, 5G and beyond, edge computing, quantum computing, blockchain, digital twin, AR, and VR. The integration of AI/ML algorithms into sensor networks is a rapidly growing research area, and its benefits include real-time data analysis, improved network reliability and accuracy, reduced manual intervention, and optimized sensor and network performance. Additionally, these algorithms can detect potential security threats, which is critical for improving network security. To fully explore the potential of AI/ML algorithms in sensor networks, extensive theoretical and practical research is necessary to design and develop new techniques and approaches that can enable even more efficient, accurate, and secure data collection and analysis. It is intended that this Special Section of IEEE Journal of Selected Areas in Sensors (JSAS) <http://ieee-jsas.org/> will show the state-of-the-art in “Emerging Technologies in Sensor Networks <https://ieee-jsas.org/wp-content/uploads/2023/07/IEEE-JSAS-Special-Section-…>”. Original research contributions, tutorials and review papers are sought in “Emerging Technologies in Sensor Networks <https://ieee-jsas.org/wp-content/uploads/2023/07/IEEE-JSAS-Special-Section-…>” related areas including (but not limited to): • Emerging sensor technologies • Edge intelligence in sensor networks • Emergence of AR/VR and metaverse • Digital twins for IoT networks • Novel QoS requirements • Novel system architectures • New communication paradigms • New hardware and system design • 5G/6G-IoT integration • Security and privacy • Interoperability in heterogeneous networks • Mobility management and handoff mechanisms • AI/ML-enabled sensor networking • Cognitive computing in sensor networks • Real-time support • Simulations and real-world experiments • Modeling, analysis and deployment • Sensor Data Processing • Testing, evaluation and verification of sensor networks • Sensors for various applications Solicited and invited papers shall undergo the standard IEEE Journal of Selected Areas in Sensors (JSAS) peer review process. All manuscripts must be submitted on-line, via the IEEE Author Portal, see https://ieee.atyponrex.com/journal/jsas. When submitting, please indicate in the “Manuscript Type” roll down menu that the paper is intended for the “2024 Emerging Technologies in Sensor Networks” Special Section. Authors are particularly encouraged to suggest names of potential reviewers for their manuscripts in the space provided for these recommendations. For manuscript preparation and submission, please follow the guidelines in the Information for Authors at IEEE Journal of Selected Areas in Sensors web page, http://ieee-jsas.org/. *Deadlines: * · Manuscript Submission: September 15, 2023 · Completion of First Review: November 15, 2023 · Revised Manuscript: December 15, 2023 · Completion of Final Review: January 15, 2024 · Publication: Q1 2024 *Guest Editors: * Lead GE: Hossein Fotouhi, Mälardalen University, Sweden Hossein.fotouhi(a)mdu.se GE: Reza Malekian, Malmö University, Sweden Reza.malekian(a)mau.se GE: Rafia Inam, Ericsson, Sweden Rafia.inam(a)ericsson.com GE: Hana Khamforoush, University of Kentucky, USA khamfroush(a)uky.edu GE: Mohammad Loni, Volvo Construction Equipment, Sweden mohammad.loni(a)volvo.com GE: Nima Dokoohaki, Accenture, Sweden nima.dokoohaki(a)accenture.com ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] WONS 2024 - Call for Papers
by Lars Wolf 10 Jul '23

10 Jul '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] WONS 2024 - Call for Papers Datum: Mon, 10 Jul 2023 11:20:33 -0400 Von: Michele Polese <michele.polese(a)GMAIL.COM> Antwort an: Michele Polese <michele.polese(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG Dear all, we are organizing the 19th edition of WONS on January 29-31st: https://2024.wons-conference.org Please find the call for papers below. The conference will be in Avoriaz, in the French alps, and the submission deadline is November 7. Looking forward to your contributions! Best, Michele Polese and Ana Aguiar TPC Co-Chairs -------------------------------------------------- Wireless on-demand network systems and services have become mainstream technologies that shape the networked world of the future. Different types of wireless LANs, both sub-6 GHz and in higher frequency bands, as well as such established technologies as Bluetooth LE, LTE-Direct, LTE ProSE, NR sidelink, NFC, and optical links are the cornerstone of networking paradigms including NextG cellular, mesh and sensor networks, cloud networks, vehicular networks, non-terrestrial networks, and in-body networks. The challenges of this exciting research field are numerous. These include providing robust services in highly dynamic, mobile, and extreme environments, how to minimize energy demands or zero out battery usage in favor of renewable energy sources, how to smartly blend multiple wireless technologies available to a network node (including across radically different bands), and how to make wireless on-demand networks and services self-configurable, adaptive, self-organizing, and self-healing in a variety of different context, each exhibiting its own peculiar constraints. IFIP WONS, now at its eighteenth edition, has established itself as a high quality forum to address the above and related challenges. WONS 2024 aims at continuing to provide a global platform for rich interactions between experts in their fields, discussing innovative contributions in a stimulating environment. This announcement solicits original contributions of high-quality research providing novel insights on all aspects of wireless on-demand networks and systems. Topics of interest comprise, but are not limited to: - 5G and 6G networks - Cloud/edge/fog computing and networking - Cognitive radio networks - Cross-layer design - Data analytics and ML/AI-driven network systems - Heterogeneous wireless networks - Joint communications, networking, and sensing - Implementations and testbeds - Internet of Things - Intra-body and biomedical on-demand systems - Integrated Access and Backhaul technologies - Integration of different wireless technologies - Localization and mobility management - Mobile computing and services - Network and service management - Non-terrestrial (aerial, space, underwater, …) networks - Novel architectures, protocols, applications and services - Open source software, open source hardware and open data - Optical and visible light wireless networks - Performance evaluation through simulations, emulations and real-world experiments - Pervasive and ubiquitous computing - Quantum computing and networking - QoS and QoE aspects - Security, privacy, and trust - Social and economic aspects - Sustainable networks and distributed ML/AI services - Theoretical and data driven modeling and optimization - Vehicular networks - Wireless technologies for NextG networks (millimeter-wave, terahertz, …) The authors of selected papers from WONS 2024 edition will be invited to submit an extended version of their work to Elsevier Computer Communications <https://www.sciencedirect.com/journal/computer-communications> for possible publication in a dedicated Virtual Special Issue (VSI). VSI submitted papers should extend significantly the original work offering additional contribution and insight to the community. Together with the honor, this year's Best Paper Award comes also with a monetary prize sponsored by IFIP <https://www.ifip.org/>. Important dates Paper registration deadline: Oct 30, 2023 Paper submission deadline: Nov 7, 2023 Acceptance notification: Dec 8, 2023 -- Michele Polese Research Scientist Institute for the Wireless Internet of Things Northeastern University, Boston, MA email: michele(a)polese.io web: polese.io ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] [Deadline Extended] Call for Posters - ACM MobiCom 2023
by Lars Wolf 05 Jul '23

05 Jul '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [Deadline Extended] Call for Posters - ACM MobiCom 2023 Datum: Wed, 5 Jul 2023 15:34:58 +0200 Von: Ginés García Avilés <000000b7dad46124-dmarc-request(a)COMSOC-LISTSERV.IEEE.ORG> Antwort an: Ginés García Avilés <gines.garcia(a)I2CAT.NET> An: tccc-announce(a)COMSOC.ORG * Call for Posters * https://sigmobile.org/mobicom/2023/posters_cfp.html * Important Dates * Deadlines Dates Poster Submission Deadline July 1st 2023, 11:59 PM AoE *July 15, 2023, 11:59 PM AoE* Notification July 31st 2023 August 7, 2023 Camera-ready August 7th 2023 August 14, 2023 * Posters/SRC Program Committee * - Aravindh Raman (Telefonica Research, Barcelona, Spain) aravindh.raman(a)telefonica.com - Carmen Delgado (i2CAT Foundation, Barcelona, Spain) carmen.delgado(a)i2cat.net - Mariya Zheleva (University at Albany, New York, USA) mzheleva(a)albany.edu Following the long tradition of poster presentations, ACM MobiCom 2023 solicits submissions for the Poster Program that feature early research work and preliminary results. The MobiCom 2023 Poster Session will provide an excellent opportunity for initial feedback on your early research results and give your ongoing projects early visibility. We invite submissions on all areas of mobile computing and wireless networking research, including but not limited to: - Fundamental understanding of mobile computing and wireless networking - Applications of machine learning to mobile/wireless research - Backscatter communication and wireless power - Mobile edge computing and cloud computing for mobile services - Decentralized networks and systems - Embedded and energy-harvesting systems - Experimental platforms and infrastructures for wireless/mobile research - Implanted and wearable computing - Intersection between mobile/wireless research, cloud computing, and software-defined networking - Long-range/Low-power wide-area wireless networking - Low-latency networking - Machine-to-machine communications - Millimeter wave and terahertz communications - Mobile data science & analysis - Mobile health - Mobile systems for smart spaces (e.g. smart factories, smart workspace, smart agriculture) - Mobile web, video, virtual reality, and other applications - Next generation of mobile networks (5G, 6G and beyond) - Non-terrestrial networks (e.g. UAS, Satellite Networks) - Novel applications of wireless signals - Performance evaluation of mobile and wireless networks, protocols, and systems - Reconfigurable surfaces and meta materials for mobile systems - Robotic and drone-based networking - Security and privacy challenges/solutions for mobile/wireless systems - Sensing with radio, light, sound, and acoustics - Ubiquitous computing and mobile human computer interaction - Visible light communications - Wireless communication and sensing for space/underwater systems - Wireless localization and tracking * Poster Submission Instructions* The posters should be submitted via HotCRP: https://mobicom23posters.hotcrp.com The submission should be formatted as a paper or extended abstract, describing the research to be presented in the poster and should be submitted as a PDF file of at most 3 pages, including all figures and references. Paper text blocks must follow ACM guidelines: double-column US letter size of 8.5 x 11 inches with fonts no smaller than 10 point size. The extended abstract must include the authors' names, affiliations, and email addresses. All poster submissions will be reviewed by the Posters committee. Once your poster is accepted, we will include the abstract of your poster on the conference website and publish it in the main proceedings and the ACM digital library. All poster submissions will be considered for the "MobiCom'23 Best Poster Award". The MOBICOM poster session will also serve as an ACM MOBICOM Student Research Competition (SRC). The ACM SRC offers a unique forum for graduate students (i.e., enrolled in a master or Ph.D. program) and undergraduate students (students enrolled in a program below master level) to present their original research before a panel of judges and attendees. Student authors are strongly encouraged to include their poster submissions in the ACM MobiCom Student Research Competition. We look forward to your submissions. Please feel free to contact us with any questions about submitting a Poster. ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: Jetzt anmelden! Konferenz "Stadt der Zukunft 2023"
by Lars Wolf 30 Jun '23

30 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: Jetzt anmelden! Konferenz "Stadt der Zukunft 2023" Datum: Fri, 30 Jun 2023 09:01:26 +0200 Von: Stadt der Zukunft <stadtderzukunft(a)tu-braunschweig.de> An: wolf(a)ibr.cs.tu-bs.de Jetzt anmelden! Konferenz "Stadt der Zukunft 2023" Forschung und Aktionen für einen positiven Wandel <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Konferenz #SdZ23 am 11. und 12. Oktober an der TU Braunschweig Städte sind wachsende Ballungszentren menschlicher Aktivität und Innovation. Sie sind Treiber von Ressourcenverbrauch und Klimawandel und gleichzeitig besonders von den Folgen betroffen. Städte haben zugleich immense Potentiale, Orte nachhaltiger Transformationen zu sein. Im Herbst 2023 lädt die Konferenz „Stadt der Zukunft. Forschung und Aktionen für einen positiven Wandel“ zu einem offenen interdisziplinären Dialog an die TU Braunschweig ein. Es erwarten Sie Flashtalks, Live-Pitches, Vorträge, Workshops und Diskussionen, Ausstellungen, Aktionen und Projekte, SpeedDating für PhDs, LiveMusik und vieles mehr. <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Nehmen Sie teil am offenen, vielfältigen und bunten Programm rund um Forschung und Aktionen für einen positiven Wandel für die Stadt der Zukunft. Die Konferenz ist *kostenfrei *zugänglich; eine Anmeldung zur Teilnahme an den Sessions jedoch bis zum 22. September notwendig. Jetzt anmelden und weitersagen! #sdz23.de <https://tf24e7c89.emailsys1a.net/c/189/6798941/2455/0/6612503/72/335292/d8b…> Eine Konferenz des Forschungsschwerpunktes Stadt der Zukunft an der Technischen Universität Braunschweig. Copyright 2023 _Webansicht / Webview <https://tf24e7c89.emailsys1a.net/mailing/189/6798941/6612503/72/ab3c0df1e0/…>_ _Abmelden / Unsubscribe <https://tf24e7c89.emailsys1a.net/189/6798941/2455/6612503/72/a13f27128f/uns…>_

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Fwd: [TCCC-ANNOUNCE] [Deadline Extended] Call for Demos - ACM MobiCom 2023
by Lars Wolf 29 Jun '23

29 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [Deadline Extended] Call for Demos - ACM MobiCom 2023 Datum: Thu, 29 Jun 2023 09:35:05 +0200 Von: Ginés García Avilés <000000b7dad46124-dmarc-request(a)COMSOC-LISTSERV.IEEE.ORG> Antwort an: Ginés García Avilés <gines.garcia(a)I2CAT.NET> An: tccc-announce(a)COMSOC.ORG * Call for Demos * https://sigmobile.org/mobicom/2023/demos.html * Important Dates * Deadlines Dates Submission Deadline July 1, 2023, 11:59 PM AoE *July 15, 2023, 11:59 PM AoE* Notification July 31, 2023 * August 7, 2023* Camera-ready August 7, 2023 *August 14, 2023* * Demo Chairs * - Andra Lutu (Telefonica Research, Spain): andra.lutu(a)telefonica.com - Ilenia Tinnirello (Università degli studi di Palermo, Italy): ilenia.tinnirello(a)unipa.it The ACM MobiCom 2023 Demo session solicits the submission of research, platform, and product demonstrations, and exhibits from both academia and industry. Demonstrations should showcase innovative research or product prototypes, platforms, and applications in the areas of mobile computing and wireless and mobile networking. We strongly encourage demos based on novel applications in the domain of mobile computing and wireless systems. We also welcome live demos reproducing evaluation results of papers appearing in ACM MobiCom 2023 or past editions as well as other relevant venues. Please refer to the main conference introduction and CFP for the general areas that are relevant to the typical MobiCom audience. * Submission Instructions * Please send your proposal of demo or exhibit as a “demo paper” through HotCRP at the following link: https://mobicom2023demos.hotcrp.com/ The demo paper should be a summary or extended abstract describing the research to be presented, details about what will be actually shown to the audience, maximum 2 pages in US letter size (8.5 x 11 inches) with fonts no smaller than 10 point size, in PDF file format with one extra page for references. To comply to these requirements, you might find useful the official ACM templates for LaTeX and Word. LaTeX users should use the following document class: \documentclass[sigconf,10pt]{acmart} Demo submissions accept single-blind submissions. Once your demo submission is accepted, we will include the abstract of your demo paper on the conference website and publish it in the main proceedings and the ACM digital library. All demo submissions will be considered for the "MobiCom '23 Best Demo Award". Student authors of demo submissions can also opt-in for this year’s Student Research Competition (see the Mobicom’23 Poster CFP for more details). The SRC offers a unique forum for graduate students (i.e., enrolled in a master or Ph.D. program) and undergraduate students (students enrolled in a program below master level) to present their original research before a panel of judges and attendees. Student authors are strongly encouraged to include their demo submissions in the ACM MobiCom SRC. * Demo presentation * For accepted demo submissions, authors will prepare for demonstrating their work during the dedicated demo session. Please note that the session will only run on-premise, and we expect authors to address questions from conference attendees in a live demo session onsite (no hybrid mode). We look forward to your submissions. Please feel free to contact us with any questions about submitting a Demo. ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: CFP FGSN2023
by Lars Wolf 28 Jun '23

28 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: CFP FGSN2023 Datum: Wed, 28 Jun 2023 17:33:03 +0000 Von: Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com> An: Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com> Dear FGSN friend, Due to several requests we have extended the deadline for submissions to the FGSN until 15^th of July, 2023 Check the CFP: https://easychair.org/cfp/fgsn2023 <https://easychair.org/cfp/fgsn2023> And submit a paper: https://easychair.org/conferences/?conf=fgsn2023 <https://easychair.org/conferences/?conf=fgsn2023> Thank you, and best regards, Krzysztof Piotrowski *Dr.-Ing. Krzysztof Piotrowski** *Group Leader* *Wireless Systems / Sensor Networks and Middleware Platforms** *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden. *Dr.-Ing. Krzysztof Piotrowski Group Leader Wireless Systems / Sensor Networks and Middleware Platforms* *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden. *From:* Piotrowski Krzysztof *Sent:* Thursday, May 25, 2023 17:56 *To:* Piotrowski Krzysztof <piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com>> *Subject:* CFP FGSN2023 Dear FGSN friend J Maybe you do not know it yet, but we plan the 20^th FGSN to happen together with the NetSys 2023 conference in Potsdam on 4^th September, 2023. We would appreciate you to help us making the fact known and distributing the CFP among your team and students so that we can together enjoy the fruitful discussions on sensor networks, their history, current state and future. Due to the fact that we have the 20^th anniversary, the main topic of the meeting is /Quo Vadis Sensor Networks/ (But all subjects on sensor networks are welcome!) here you will find the CFP: https://easychair.org/cfp/fgsn2023 <https://easychair.org/cfp/fgsn2023> here is our subpage on the NetSys 2023 webpage: https://www.kuvs.de/netsys/2023/calls/fgsn/ <https://www.kuvs.de/netsys/2023/calls/fgsn/> Thank you, and Best regards, Krzysztof Piotrowski *Dr.-Ing. Krzysztof Piotrowski** *Group Leader* *Wireless Systems / Sensor Networks and Middleware Platforms** *IHP* Fon: +49 (335) 5625-756 Fax: +49 (335) 5625-671 E-Mail: piotrowski(a)ihp-microelectronics.com <mailto:piotrowski@ihp-microelectronics.com> Website: www.ihp-microelectronics.com <https://www.ihp-microelectronics.com> <https://www.facebook.com/IHPFFO> <https://twitter.com/waferffo> <https://www.linkedin.com/company/ihp> IHP GmbH Innovations for High Performance Microelectronics Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) Germany Geschäftsführer: Prof. Dr.-Ing. Gerhard Kahmen, Nicolas Hübener, Vorsitzende des Aufsichtsrates: Dr. Inge Schlotzhauer Handelsregister: HRB 1982 Amtsgericht Frankfurt (Oder) , Steuernummer: 061/125/00152, Umsatzsteuer-ID: DE 138996546 Die IHP GmbH ist Mitglied der Leibniz-Gemeinschaft und wird von der Bundesrepublik Deutschland und dem Land Brandenburg institutionell finanziert. Diese E-Mail enthält vertrauliche und / oder rechtlich geschützte Informationen. Wenn Sie nicht der richtige Adressat sind oder diese E-Mail irrtümlich erhalten haben, informieren Sie bitte sofort den Absender und vernichten Sie diese Mail. Das unerlaubte Kopieren sowie die unbefugte Weitergabe dieser Mail sind nicht gestattet. This e-mail contains confidential and / or privileged information. If you are not the intended recipient or have received this e-mail in error, please notify the sender immediately and destroy this e-mail. Any unauthorized copying, disclosure or distribution of the material in this e-mail is strictly forbidden.

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Fwd: [TCCC-ANNOUNCE] [CFP] IEEE/ACM DS-RT 2023 - Special Sessions
by Lars Wolf 28 Jun '23

28 Jun '23

-------- Ursprüngliche Nachricht -------- Von: Rodolfo Lima Coutinho <rodolfo.coutinho(a)CONCORDIA.CA> Gesendet: 28. Juni 2023 18:29:43 MESZ An: tccc-announce(a)COMSOC.ORG Betreff: [TCCC-ANNOUNCE] [CFP] IEEE/ACM DS-RT 2023 - Special Sessions ******************************************************* 27th IEEE/ACM DS-RT 2023 - Special Sessions http://ds-rt.com/2023/home ******************************************************* Information: Special Session Submission Deadline: July 4th, 2023 ******************************************************* The 2023 edition of the IEEE/ACM 27th International Symposium on Distributed Simulation and Real Time Applications (DS-RT) will be held in Singapore. DS-RT 2023 serves as a forum for simulationists from academia, industry and research labs, for presenting recent research results in Distributed Simulation and Real Time Applications. DS-RT 2023 targets the growing overlap between large distributed simulations and real time applications, such as mirror world simulations and collaborative virtual environments. The conference features prominent invited speakers as well as papers by top researchers in the field. DS-RT 2023 will include contributed technical papers, invited papers, and panel discussions. The proceedings will be published by IEEE-CS press. This event is a wonderful opportunity to join the community of experts on related topics, share experiences, and have fruitful discussions. You are kindly invited to attend this prestigious conference. This year, DS-RT will feature the following Special Sessions (http://ds-rt.com/2023/specialsession.html) - Special Session on Distributed and Real-Time Simulations for Metaverse Systems - Special Session on Artificial Intelligence Approaches for Distributed and Real-Time Simulations - Special Session on Modeling and Simulation of Agent-based Systems - Special Session on Modeling, Analysis, and Simulation of Drones and UAVs in emergent applications - Special Session on Distributed Systems in Industry 4.0, Digital Twin, and Internet of Things Paper Submission Guidelines: Papers must be unpublished and must not be submitted for publication elsewhere. All papers will be reviewed by Technical Program Committee members and other experts active in the field to ensure high quality and relevance to the conference. At least one author of accepted papers must attend the conference to present its contribution. Papers should be written in English and should not exceed 10 pages, double column, IEEE style including tables and figures. Note that the regular paper size will be 8 pages, with the possibility to obtain up to 2 additional pages (total 10 pages) by paying a publication fee. A template for IEEE Proceedings style (LaTeX2e and MS Word) can be found at http://www.ieee.org/conferences_events/conferences/publishing/templates. Only Postscript and PDF formats are accepted. Papers must be submitted electronically through the EDAS system. The complete list of authors' names must be inserted when registering the paper on the EDAS system. Authors names can be inserted in the paper: that is, the review process is single blind. Authors should check if they already have a login on the EDAS system; otherwise, an account must be created before submitting a paper. If you are not already registered to EDAS please follow the instructions on EDAS registration page (https://edas.info/N30484), where you can login, or you can create a new EDAS user account. ******************************************************* Submission Deadline: July 4th, 2023 Submission link: https://edas.info/N30484 ******************************************************* *** ORGANIZING COMMITTEE DS-RT 2023 Special Sessions *** * DS-RT 2023 Special Sessions Chair: Rodolfo W. L. Coutinho, Concordia University, Canada ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: IEEE SENSORS 2023 Submission Deadline: 30 June
by Lars Wolf 27 Jun '23

27 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: IEEE SENSORS 2023 Submission Deadline: 30 June Datum: Tue, 27 Jun 2023 13:12:52 +0000 Von: IEEE SENSORS 2023 <ckravec(a)conferencecatalysts.com> Antwort an: IEEE SENSORS 2023 <ckravec(a)conferencecatalysts.com> An: wolf(a)ibr.cs.tu-bs.de IEEE SENSORS 2023 Submission Deadline: 30 June View this email in your browser <https://mailchi.mp/ieee-sensors/sensors-2023-call-for-papers-extended?e=4d9…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> 29 October - 1 November 2023 Vienna, Austria The Extended Paper Submission Deadline is 30 June Author Instructions <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> IEEE SENSORS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the areas of sensors and sensing technologies. IEEE SENSORS 2023 will include keynote addresses and invited presentations by eminent scientists and engineers. Submit a Paper <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Save the Date <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> *IEEE SENSORS 2023* October 29 - November 1, 2023 Vienna, Austria Add to Calendar <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Stay Connected LinkedIn <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Twitter <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Website <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Gold Patron <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Exhibitors <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Local Partner <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Conference Sponsor <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Become a Patron/Exhibitor <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> /Copyright © 2023 IEEE, All rights reserved. You are receiving this email because of your relationship to the IEEE Sensors Council. This list is used ONLY for IEEE Sensors Council announcements. It is NOT shared with others. If you unsubscribe, you will not receive future announcements about IEEE Sensors Council activities, such as the IEEE Sensors Journal and future IEEE SENSORS conferences./ IEEE PRIVACY POLICY <https://ieee-sensors.us7.list-manage.com/track/click?u=f2d2eabe9a09b13da660…> Want to change how you receive these emails? You can update your preferences <https://ieee-sensors.us7.list-manage.com/profile?u=f2d2eabe9a09b13da6607ea3…> or unsubscribe from this list <https://ieee-sensors.us7.list-manage.com/unsubscribe?u=f2d2eabe9a09b13da660…>.

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Fwd: PERCOM 2024 - CALL FOR PAPERS
by Lars Wolf 26 Jun '23

26 Jun '23

-------- Weitergeleitete Nachricht -------- Betreff: PERCOM 2024 - CALL FOR PAPERS Datum: Sun, 25 Jun 2023 21:12:19 +0000 Von: Edinger, Prof. Dr. Janick <janick.edinger(a)UNI-HAMBURG.DE> Antwort an: Mailing List der GI FG 3.3.1 "Kommunikation und Verteilte Systeme" <KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE> An: KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE ========================================================== PERCOM 2024 - CALL FOR PAPERS ========================================================== The 22nd International Conference on Pervasive Computing and Communications (PerCom 2024), March 2024 Biarritz, France http://www.percom.org ========================================================== IEEE PerCom, now in its 22nd year, will be held in Biarritz, France in March 2024 as a physical event. PerCom is the premier annual scholarly venue in pervasive computing and communications. Pervasive computing is constantly at the forefront of mobile systems research, and has found its way into many commercial applications due to tremendous advances in a broad spectrum of technologies and topics such as wireless networking, mobile and distributed computing, sensor systems, ambient intelligence, and smart devices. SCOPE PerCom 2024 solicits research contributions in all areas pertinent to pervasive computing and communications, , especially those that cross traditional research boundaries. In particular, PerCom targets contributions in: * Advances in pervasive systems and infrastructures: middleware systems and services; data engineering for pervasive computing; cloud, fog and edge computing; integrations of smartphones in pervasive experiences; applications of device-to-device coordination. * Theories, models, and algorithms: context modeling & reasoning; adaptive computing; activity & emotion recognition; programming paradigms; applied deep/federated/decentralized machine learning; causal learning; cognitive computing; complex networks; spatio-temporal modeling. * Domain-specific challenges and novel applications: urban/mobile crowdsensing & intelligence; PerCom for healthcare and well-being; cyber-physical PerCom; smart homes and virtual assistants; mixed reality; sports analytics; crime prevention; pervasive nowcasting; urban robotics; pervasive AR/VR; smart vehicles; disaster sensing and management. * Intersections of PerCom with: IoT and sensor systems; RFID; opportunistic networks; pervasive data science; cyber-physical systems; 3D networks; green networking. * New techniques for user-level concerns: participatory and social sensing; trust, security, privacy, fairness, and ethics; user interface, interaction, and persuasion; online and offline social networking; human-machine collaboration. * Technological innovations: architectures, protocols, and technologies for pervasive communications; energy-harvesting, self-powered, or battery-less systems; mobile and wearable systems; smart devices and environments; positioning, navigation, timing, and tracking technologies; and device-free human sensing. Contributions can be analytical, empirical, technological, methodological, or a combination thereof. Papers reporting strong systems engineering contributions backed by solid and appropriate evaluations are strongly encouraged. Contributions should be novel (those presenting only minor improvements over the state of the art will not be considered), should demonstrate a significant impact (i.e., they should address an outstanding problem), and should be rigorous. Note that the impact of the contributions should be demonstrated in the context of pervasive computing and communications applications. READ BEFORE SUBMITTING PerCom 2024 will follow a double-blind review process. As a result, authors must make a good-faith effort to anonymize their submissions. For detailed submission instructions, please check the www.percom.org website. PerCom would not be PerCom without its community. For this reason, we are looking for ways to strengthen the community and encourage meaningful interactions. To this end, all accepted papers must be presented in person by one of the authors, in addition to having an associated full registration. Failure to comply with this requirement will result in the exclusion of the paper from the final proceedings and from the IEEE Digital Library, and the paper will not be eligible for the Best Paper Award. IMPORTANT DATES * Paper registration in EDAS: September 25, 2023 * Submission via EDAS: October 2, 2023 * Notification: December 21, 2023 * Camera Ready: February 2024 (exact date to be announced) BEST PAPER AWARD AND EDITORIAL FOLLOW-UPS The best paper will receive the prestigious Mark Weiser Best Paper Award. Selected papers will be invited to submit extended versions for a special issue of the Pervasive and Mobile Computing Journal. ORGANIZING COMMITTEE * General Chairs Philippe Lalanda, University of Grenoble, France Claudio Bettini, University of Milan, Italy * TPC Chair and Vice-Chairs Chiara Boldrini, IIT-CNR, Italy Sara Khalifa, CSIRO, Australia Nirmalya Roy, University of Maryland Baltimore County, USA Stephan Sigg, Aalto University, Finland To contact the TPC chair and vice-chairs, please write to percom2024-tpc-chairs(a)iit.cnr.it

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