Von: "JeongGil (John) Ko" <jeonggil.ko@GMAIL.COM>
Gesendet: 16. Juni 2018 00:35:44 MESZ
An: tccc-announce@COMSOC.ORG
Betreff: [TCCC-ANNOUNCE] [Call for Papers] EWSN 2019
** Sincere Apologies for Cross-posting **
Call for Papers - EWSN 2019
The International Conference on Embedded Wireless Systems and Networks
(EWSN) is a highly selective single-track international conference focusing
on the latest research results on embedded systems and wireless networking,
key enablers for visionary scenarios such as the Internet of Things and
Cyber-Physical Systems. Building on 15 years of successful EWSN
conferences, the 16th edition marks a significant change: for the first
time, EWSN will go outside Europe, and be held in Beijing, China. The
conference aims at a broader impact world-wide, while maintaining its role
as a premier conference originated from Europe.
The conference solicits both full technical papers and short papers
describing validated early ideas. Specific topics of interest include but
are not limited to:
- Communication and networking for wireless and embedded systems
- Sensing, actuation, and control
- Operating systems, middleware, and services
- Processing, storage, and management of data
- Programming paradigms, languages, and tools
- Emerging computing platforms, e.g., drones and robots
- Time and location management
- Dependability (real-time, reliability, availability, safety)
- Sustainability (low-power operation, energy management, energy harvesting)
- Privacy and security in applications and systems
- Human-machine interaction with wireless and embedded systems
- Design and implementation of real-world applications and systems
- Measurement studies and deployment experiences
Contributions that reflect emerging technologies and applications related
to industrial IoT are particularly welcome.
The conference proceedings will appear in the ACM Digital Library. Selected
accepted papers will be fast-tracked to ACM Transactions on Sensor Networks
(TOSN) or ACM Transactions on the Internet of Things (TIOT).
Submission Instructions
Submissions to EWSN 2019 must be original (i.e., not previously published)
and not currently under review by any other conference or journal. EWSN
2019 will adopt a double-blind review process. Authors must make a good
faith effort to anonymize their submissions to ensure that author
identities are not disclosed to reviewers. We will also offer authors a
rebuttal phase before final decisions are made.
* Formatting requirements. Full paper submissions must have at most 12
pages. Short paper submissions must have at most 6 pages. Pages must have
8.5" x 11" (letter) two-column format, using 10-point type on 11-point
leading, with a maximum text block of 7" wide x 9" deep with an
inter-column spacing of .25". The page limits include figures, tables, and
references. Authors may use the LaTex templates provided here.
* Submission Site. Paper submission is managed through HotCRP at the
following site:
http://hotcrp.disi.unitn.it/ewsn2019/
Important Dates
- Paper registration: 23:59:59 pm.(AOE), September 7, 2018
- Paper submission: 23:59:59 pm.(AOE), September 14, 2018
- Authors rebuttal deadline: November 16, 2018
- Notification: December 1, 2018
Organisation Committee
General Co-Chairs
Yunhao Liu, Tsinghua University (China)
Guoliang Xing, Michigan State University (USA)
TPC Co-Chairs
Yuan He , Tsinghua University (China)
Gian Pietro Picco, University of Trento (Italy)
Workshop Co-Chairs
Mo Li, Nanyang Technological University (Singapore)
Marco Zimmerling, Technische Universität Dresden (Germany)
Poster Co-Chairs
Simon Duquennoy, RISE SICS (Sweden)
Rui Tan, Nanyang Technological University (Singapore)
Demo Co-Chairs
Zhichao Cao, Tsinghua University (China)
Hongkai Wen, University of Warwick (UK)
Competition Chair
Carlo Alberto Boano, Graz University of Technology (Austria)
Phd Colloquium Co-Chairs
Lothar Thiele, Swiss Federal Institute of Technology Zurich (Switzerland)
Thiemo Voigt, Uppsala University and RISE SICS (Sweden)
Industry Liaison Chair
Xiaohua Tian, Shanghai Jiao Tong University (China)
Local Arrangement Co-Chairs
Fan Li, Beijing Institute of Technology (China)
Liang Liu, Beijing University Of Posts And Telecommunications (China)
Jiliang Wang, Tsinghua University (China)
Registration Chair
Kele Shen, Tsinghua University (China)
Publicity Co-Chairs
Octav Chipara, University of Iowa (USA)
JeongGil Ko, Ajou University (Korea)
Olga Saukh, Graz University of Technology (Germany)
Fu Xiao, Nanjing University of Posts and Telecommunications (China)
Publication Co-Chairs
Bernd-Christian Renner, Hamburg University of Technology (Germany)
Yuanqing Zheng, Hong Kong Polytechnic University (HK)
Web Chair
Xipeng Ma, Tsinghua University (China)
IEEE Communications Society Tech. Committee on Computer Communications
http://committees.comsoc.org/tccc/
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