Von: James Pope <james.h.pope8@GMAIL.COM>
Datum: 26. Mai 2018 um 12:30:37 MESZ
An: tccc-announce@COMSOC.ORG
Betreff: [TCCC-ANNOUNCE] CfP: Deadline extension to 29 May, IEEE SenseApp 2018, 1-4 October 2018, Chicago, USA
Antwort an: James Pope <james.h.pope8@GMAIL.COM>
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IEEE SenseApp 2018
THIRTEENTH IEEE INTERNATIONAL WORKSHOP ON PRACTICAL ISSUES
IN BUILDING SENSOR NETWORK APPLICATIONS
(in conjunction with IEEE LCN 2018)
Chicago, USA
1-4 October 2018
www.senseapp.org
CALL FOR PAPERS
For more than a decade, embedded wireless sensors and actuators have been
increasingly networked to continually narrow the gap between the physical
world and cyberspace. Domain-specific sensing deployments in scenarios
like industrial settings and home automation are becoming more and more
ubiquitous, particularly with the advent of novel sensing platforms which
allow for the seamless integration of sensing devices into everyday
environments. At the same time, data gathered through wireless sensor
network deployments empower applications in the emerging domains of smart
cities and smart infrastructures.
While enabling technologies have evolved into mature and widely available
solutions, insights gathered from real-world sensor network deployments
are still scarce and many practical issues in building sensor network
applications persist. A thorough understanding of these challenges from a
practical/systems perspective is still necessary. This especially applies
to insights from the areas of hardware platforms of sensor and actuator
nodes, their operating systems, the networking of nodes, and fresh
perspectives from field trials and applications.
This workshop aims at bringing together researchers from both academia and
industry to showcase their work and obtain feedback. It serves as a forum
for the sensing network research communities working on embedded sensing
systems to discuss open issues, novel solutions, and the future
development of wireless sensing in general. We encourage contributions
describing innovative work in the realms of wireless sensor networks,
cyber-physical systems, smart spaces, machine-to-machine communication,
the Internet of Things, and all related disciplines. Topics of interest
include, but are not limited to:
- Practical experiences from innovative real-world sensor network deployments
and applications
- Hands-on experiences with the integration of sensor networks and the
Internet of Things
- Middleware support for sensor networks
- Programming and debugging sensor networks
- Security, availability and dependability issues in sensor networks
- Experiences with new sensor hardware and node/platform designs
- Practical problems in implementing localization and time synchronization
- Experiences with communications protocols for the IoT, M2M, or CPS
- Practical medium access control protocols (MACs)
- Topology control and routing protocols in sensor network deployments
- Novel communication paradigms for wireless sensor networks
- Mobility management in sensor applications and deployments
- Fault-tolerance and troubleshooting sensor networks
- Experiences regarding energy management and network lifetime
- Experiences with energy harvesters and energy-sustainable designs
- Deployment, installation, and configuration support
- Management of large-scale sensor networks and sensing campaigns
- Interconnection between IP and sensor networks
- Interfacing with sensor networks using mobile computing devices
- Large-scale open sensor data sets from real deployments
- Integration of wireless sensor networks with smart city infrastructures
- Real-world use of WSN platforms in smart spaces and cyber-physical systems
- Sensor networking for smart power grids
- Practical experiences with wearable sensing technologies
Submitted papers will be reviewed by at least three independent experts in
the field. Proceedings of the workshop will be published together with
those of IEEE LCN, and will be available in digital format from the IEEE
Xplore Digital Library.
SUBMISSION INSTRUCTIONS:
Authors are invited to submit original unpublished work, not currently
under review by another conference, workshop or journal.
Regular (full) papers (10 pt font in two-column IEEE format) should
present novel perspectives and match with at least two of the topics
of interest of the workshop. Papers are expected to be 6 pages long,
yet submissions of up to 8 pages are allowed. Papers in excess of this
limit will not be considered for review or publication.
Papers must be submitted electronically via EDAS at:
<http://edas.info/N24451>
All papers must include title, complete contact information of all
authors, abstract and up to 5 keywords on the cover page. Further
information can be found at:
www.senseapp.org
IMPORTANT DATES:
Paper submission deadline (ext): 29 May 2018
Notification of acceptance: 6 July 2018
Camera ready manuscript due: 6 August 2018
PROGRAM COMMITTEE CO-CHAIRS:
Andreas Reinhardt, TU Clausthal, Germany
Xenofon Fafoutis, University of Bristol, United Kingdom
PUBLICITY CHAIR:
James H. Pope, University of Bristol, United Kingdom
GENERAL CO-CHAIRS:
Matthias Hollick, Technische Universität Darmstadt, Germany
Salil Kanhere, The University of New South Wales, Australia
STEERING COMMITTEE:
Sanjay Jha, The University of New South Wales, Australia
Cormac Sreenan, University College Cork, Ireland
TECHNICAL PROGRAM COMMITTEE:
Neil Bergmann, University of Queensland, Australia
Carlo Alberto Boano, Graz University of Technology, Austria
Fernando Boavida, University of Coimbra, Portugal
David Boyle, Imperial College London, United Kingdom (Great Britain)
Rachel Cardell-Oliver, The University of Western Australia, Australia
Anna Förster, University of Bremen, Germany
Csaba Kiraly, Fondazione Bruno Kessler, Italy
Letizia Marchegiani, University of Oxford, United Kingdom (Great Britain)
Alan Marchiori, Bucknell University, USA
George Oikonomou, University of Bristol, United Kingdom (Great Britain)
Georgios Papadopoulos, IMT Atlantique, France
Christian Renner, Hamburg University of Technology, Germany
Olga Saukh, ETH Zurich, Switzerland
Corinna Schmitt, University of Zurich, Switzerland
Philipp Sommer, ABB Corporate Research, Switzerland
Leonardo Steinfeld, Universidad de la República, Uruguay
Kristof Van Laerhoven, University of Siegen, Germany
Dingwen Yuan, Technische Universität Darmstadt, Germany
______________________________________________________________
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