-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call For Paper IEEE VTC2023-FALL Datum: Thu, 15 Jun 2023 11:36:44 +0800 Von: Kan Zheng kanzhengon@GMAIL.COM Antwort an: Kan Zheng kanzhengon@GMAIL.COM An: tccc-announce@COMSOC.ORG
*** Please accept our apologies if you receive multiple copies of this CFP ***
VTC2023-Fall in Hong Kong will feature world-class technical sessions, workshops, and tutorials on, but not limited to, the following technical tracks. Prospective authors are invited to submit 5-page, original, and unpublished full papers. A full paper can be up to 7 pages in length, just note that papers longer than 5 pages will require the purchase of additional page charges at the time of registration and final paper submission. Please do not submit papers longer than 8 pages for review as it is not likely that the paper could be edited to a maximum of 7 pages or less upon acceptance.
1. Antenna Systems, Propagation, and RF Design 2. Electric Vehicles, Vehicular Electronics and Intelligent Transportation 3. Emerging Technologies, 5G and Beyond 4. IoV, IoT, M2M, Sensor Networks, and Ad-Hoc Networking 5. Machine Learning and AI for Communications 6. Positioning, Navigation, and Mobile Satellite Systems 7. Radio Access Technology and Heterogeneous Networks 8. Spectrum Management, Green Communications, Services and Security 9. Signal Transmission and Reception 10.Unmanned Aerial Vehicle Communications, Vehicular Networks, and Telematics 11.Wireless Networks: Protocols, Security and Services
************************************************************************************************ Paper submission deadline: 9 July 2023 Acceptance notification: 26 August 2023 Final paper submission deadline: 9 September 2023
Submission requirements: 5-page paper (without overlength charge) and up to 2 additional pages are allowed with the purchase of additional page charges in the amount of $100 USD per additional page at the time of registration and final paper submission.
Paper submission is open: https://vtc2023fall.trackchair.com/ ************************************************************************************************ Organizing Committee:
General Co-Chairs Khaled B. Letaief, Hong Kong University of Science and Technology, Hong Kong Song Guo, The Hong Kong Polytechnic University, Hong Kong
Technical Program Chair Xianbin Wang, Western University, Canada
Technical Program Vice-Chairs Jianping Wang, City University of Hong Kong, Hong Kong Dusit Niyato, Nanyang Technological University, Singapore
Publications Chair James Irvine, University of Strathclyde, UK Soumaya Cherkaoui, Polytechnique Montreal, Canada Fiona Fang, Western University, Canada
Keynotes & Panels Co-Chairs Nirwan Ansari, New Jersey Institute of Technology, USA Lajos Hanzo, University of Southampton, UK
Tutorials Chair Deze Zeng, China University of Geosciences (Wuhan), China Peng Li, University of Aizu, Japn
Workshops Co-Chairs Shui Yu, University of Technology Sydney, Australia Keshav Sood, Deakin University, Canada
Industry Program Chair Taimoor Abbas, InterDigital, Inc, USA
Publicity Chair Kan Zheng, Ningbo University, China Fulvio Babich, University of Trieste, Italy
Local Arrangements Chair Zhenjiang Li, City University of Hong Kong, Hong Kong Wenchao Xu, Hong Kong Polytechnic University, Hong Kong
Finance Chair J. R. Cruz, The University of Oklahoma, USA
Conference Administrators Rodney C. Keele, The University of Oklahoma, USA Cerry Leffler, The University of Oklahoma, USA
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