-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [PerCom2019 Work-in-Progress] CFP Paper due Nov 10, 2018 Datum: Wed, 19 Sep 2018 11:46:57 -0400 Von: Peizhao Hu peizhao.research@GMAIL.COM Antwort an: Peizhao Hu peizhao.research@GMAIL.COM An: tccc-announce@COMSOC.ORG
Work In Progress (WiP) Session
The Work-in-Progress (WiP) session provides an opportunity to present and discuss new challenges and visions, showcase early research results, and explore novel research directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought-provoking ideas. All selected papers will be presented as posters in a special conference session following a 1-minute madness oral presentation. In addition, all selected papers will be included in PerCom Workshops proceedings to be published by IEEE and included in the IEEE Xplore digital library. Contributions are solicited in all areas of pervasive computing research and applications. Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications. Preliminary experimental results are appreciated.
Topics of interest include, but are not limited to: - Innovative pervasive computing applications (e.g., use of blockchain and smart contracts) - Software engineering aspects of pervasive computing - Middleware services and agent technologies - Pervasive computing for smart environments - Energy-aware pervasive computing - Wearable systems - Smart City systems - Internet of Things - Enabling technologies for pervasive systems (e.g., Visible Light Communication) - Mobile sensing techniques and applications - Perception and semantic interpretation of pervasive sensing data - Communication architectures for pervasive computing - Pervasive opportunistic communications and applications - Adaptive, autonomic, and context-aware computing - Positioning and tracking technologies - Virtual and immersive systems for pervasive environments - Social and economics aspects of pervasive computing - New challenges and visions of a pervasive world
Submission Guidelines Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format (two-column format with a 4-page limit including figures, tables, and references) in PDF format that include contact information of all the authors to the EDAS submission site. The submitted manuscripts will be reviewed by the WiP Technical Program Committee. The authors of accepted papers will present their work during the main conference in a special WiP poster session and must register for the conference (at least one author must have a full registration). The minimum poster size for display is 20" x 30" (508 mm x 763 mm), and the maximum size is approximately 24â x 36â (610 mm x 914 mm). The papers of the WiP session will be published in the workshop proceedings of the 16th Annual IEEE International Conference on Pervasive Computing and Communications.
Important Dates Submission Deadline: November 10, 2018 Notification of Acceptance: December 22, 2018 Camera Ready Deadline: January 13, 2019
Technical Program Committee Chiara Boldrini, IIT-CNR, Italy Haiming Chen, Ningbo University, China Christos Goumopoulos, University of the Aegean, Greece Xin Qi, VMWare, USA Aaron Striegel, University of Notre Dame, USA Kanchana Thilakarathna, The University of Sydney, Australia Shuangquan Wang, College of William and Mary, USA Klaus David, University of Kassel, Germany Jamie Payton, Temple University, USA Mahbub Hassan, University of New South Wales, Australia Gregor Schiele, University of Duisburg-Essen, Germany
Work in Progress Chairs Takuya Maekawa, Osaka University, Japan Peizhao Hu, Rochester Institute of Technology, USA
______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce@comsoc.org https://comsoc-listserv.ieee.org/