IEEE SenseApp 2017

      TWELFTH IEEE INTERNATIONAL WORKSHOP ON PRACTICAL ISSUES
                   IN BUILDING SENSOR NETWORK APPLICATIONS
                               (in conjunction with IEEE LCN 2017)

                                                      Singapore

                                              9-12 October 2017

                                         http://www.senseapp.org


                                            CALL FOR PAPERS

For more than a decade, embedded wireless sensors and actuators have been
increasingly networked to continually narrow the gap between the physical
world and cyberspace. Domain-specific sensing deployments in scenarios
like industrial settings and home automation are becoming more and more
ubiquitous, particularly with the advent of novel sensing platforms which
allow for the seamless integration of sensing devices into everyday
environments. At the same time, data gathered through wireless sensor
network deployments empower applications in the emerging domains of smart
cities and smart infrastructures.

While enabling technologies have evolved into mature and widely available
solutions, insights gathered from real-world sensor network deployments
are still scarce and many practical issues in building sensor network
applications persist. A thorough understanding of these challenges from a
practical/systems perspective is still necessary. This especially applies
to insights from the areas of hardware platforms of sensor and actuator
nodes, their operating systems, the networking of nodes, and fresh
perspectives from field trials and applications.

This workshop aims at bringing together researchers from both academia and
industry to showcase their work and obtain feedback. It serves as a forum
for the sensing network research communities working on embedded sensing
systems to discuss open issues, novel solutions, and the future
development of wireless sensing in general. We encourage contributions
describing innovative work in the realms of wireless sensor networks,
cyber-physical systems, smart spaces, machine-to-machine communication,
the Internet of Things, and all related disciplines. Topics of interest
include, but are not limited to:

- Practical experiences from innovative real-world sensor network
 deployments and applications
- Hands-on experiences with the integration of sensor networks and the
 Internet of Things
- Middleware support for sensor networks
- Programming and debugging sensor networks
- Security, availability and dependability issues in sensor networks
- Experiences with new sensor hardware and node/platform designs
- Practical problems in implementing localization and time synchronization
- Experiences with communications protocols for the IoT, M2M, or CPS
- Practical medium access control protocols (MACs)
- Topology control and routing protocols in sensor network deployments
- Novel communication paradigms for wireless sensor networks
- Mobility management in sensor applications and deployments
- Fault-tolerance and troubleshooting sensor networks
- Experiences regarding energy management and network lifetime
- Experiences with energy harvesters and energy-sustainable designs
- Deployment, installation, and configuration support
- Management of large-scale sensor networks and sensing campaigns
- Interconnection between IP and sensor networks
- Interfacing with sensor networks using mobile computing devices
- Large-scale open sensor data sets from real deployments
- Integration of wireless sensor networks with smart city infrastructures
- Real-world use of WSN platforms in smart spaces and cyber-physical
  systems
- Sensor networking for smart power grids
- Practical experiences with wearable sensing technologies



Submitted papers will be reviewed by at least three independent experts in
the field. Proceedings of the workshop will be published together with
those of IEEE LCN, and will be available in digital format from the IEEE
Xplore Digital Library.


SUBMISSION INSTRUCTIONS:
Authors are invited to submit original unpublished work, not currently
under review by another conference, workshop or journal. Full papers must
be restricted to 8 camera-ready pages (in 10 pt font, double column, US
letter size, 8.5 x 11 inches, IEEE format), including text, figures and
references. Papers must be submitted electronically via EDAS at:

<https://edas.info/N23386>

All papers must include title, complete contact information of all
authors, abstract and up to 5 keywords on the cover page. Further
information can be found at:
https://www.senseapp.org/en/senseapp/submission-instructions/


IMPORTANT DATES:
 Paper submission deadline:        28      April  2017
 Notification of acceptance:          10       July  2017
 Camera ready manuscript due:   14  August  2017


PROGRAM COMMITTEE CO-CHAIRS:
 Andreas Reinhardt, TU Clausthal, Germany
 James H. Pope, University of Bristol, United Kingdom

PUBLICITY CHAIR:
 Xenofon Fafoutis, University of Bristol, United Kingdom

GENERAL CO-CHAIRS:
 Matthias Hollick, Technische Universität Darmstadt, Germany
 Salil Kanhere, The University of New South Wales, Australia

STEERING COMMITTEE:
 Sanjay Jha, The University of New South Wales, Australia
 Cormac Sreenan, University College Cork, Ireland

TECHNICAL PROGRAM COMMITTEE:
 Neil Bergmann, University of Queensland 
 Carlo Alberto Boano, Graz University of Technology 
 Fernando Boavida, University of Coimbra 
 David Boyle, Imperial College London 
 Rachel Cardell-Oliver, The University of Western Australia 
 Xenofon Fafoutis, University of Bristol 
 Anna Förster, University of Bremen 
 Ben Jolly, Landcare Research - Manaaki Whenua 
 Csaba Kiraly, Bruno Kessler Foundation 
 Olaf Landsiedel, Chalmers University of Technology 
 Enzo Mingozzi, University of Pisa 
 Steffen Peter, University of California, Irvine 
 Delphine Reinhardt, University of Bonn and Fraunhofer FKIE 
 Christian Renner, Hamburg University of Technology 
 Olga Saukh, ETH Zurich 
 Corinna Schmitt, University of Zurich 
 Philipp Sommer, ABB Corporate Research 
 Leonardo Steinfeld, Universidad de la República 
 Kristof Van Laerhoven, University of Freiburg 
 Dingwen Yuan, Technische Universität Darmstadt 


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