-------- Ursprüngliche Nachricht -------- Von: Jun Bi junbi@TSINGHUA.EDU.CN Gesendet: Fri Nov 01 17:34:24 MEZ 2013 An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] [Submission Due: Dec.15, 2013] INFOCOM2014 NOM workhsop
******************************************************************************** NOM 2013 Call for Papers The 2nd Workshop on Name-Oriented Mobility (NOM): Architectures, Algorithms, and Applications in conjunction with IEEE INFOCOM 2014 April 28 or May 2, 2014 Toronto, Canada http://www.ieee-infocom.org/2014/Workshops_NOM.html ********************************************************************************
The second edition of the NOM workshop will be held on May 2nd 2014 in conjunction with the IEEE INFOCOM 2014 conference after the great success of its first edition that was held with the ACM MobiHoc 2013 conference. The NOM workshop is particularly interested in Information Centric Network (ICN) advances in support of the mobile and wireless space.
Name-oriented network architectures appear very promising for wireless and mobile networks, such as for instance IoT among wireless and mobile devices that could not scale well up till now, home networks among wireless and mobile hand held devices that constitute the majority of end-users devices, wireless sensor networks for smart spaces and vehicular networks which account a large, and exponentially increasing number of devices and connections that clearly suffer from the lack of mobility management in the IP architecture and the lack of an efficient data storage and sharing mean. Moreover, within the context of multimedia and video services and the huge demand for highly scalable and efficient distribution of content, ICN is promising in offering an alternative or complementing to the proprietary or specialized content distribution mechanisms, such as CDN and P2P systems, and aims for improved content access through general Internet mechanisms for content replication and dissemination among not only core network devices but also wireless edge network devices and wireless and mobile end-users devices.
We encourage submissions of high quality technical papers on mobile and wireless ICN work in the following topics: - ICN mobile/wireless architectures and platforms - Compelling applications and services for ICN for wireless and mobile networks (IoT, smart environments, home networks, ……) - ICN deployment models for wireless and mobile networks (Clean-slate, evolutionary, …) - Technical deployment of ICN into operational networks (specialized hardware ICN routers, ICN software into virtualized nodes, etc.) - ICN scalability to high density network deployments (e.g. for IoT applications) - Impact of ICN on mobile/wireless protocols and systems - Mobility management in ICN considering multiple radio technologies - ICN support for seamless and simultaneous connectivity across multiple links - ICN tolerance to disruption in wireless and mobile links - Policy management with ICN - ICN in relation to CDNs and Cloud Services - Cooperation between ICN and CDN networks - Standardization efforts impacting mobile ICN - Data naming and Objects Identification in wireless and mobile networks - Radio resources management and congestion control - Context-awareness in ICN - Intelligent in-network Caching in ICN for better network resources optimization and user experience - ICN role in wireless and mobile User Experience - ICN Security and Privacy - Forwarding strategies in wireless and mobile ICN - Performance evaluation for wireless and mobile ICNs Workshop Chairs Jun Bi, Tsinghua University, China Hassnaa Moustafa, Intel Corporation, USA Bertrand Mathieu, Orange, France
Steering Committee Eve Schooler, Intel Corporation, USA Giovanni Pau, UCLA, USA Lixia Zhang, UCLA, USA Jun Bi, Tsinghua University, China Hassnaa Moustafa, Intel Corporation, USA Bertrand Mathieu, Orange, France Prof. Xiaoming Fu, Gottingen University, Germany
Important Dates Paper Submission due: December 15th 2013 Acceptance Notification: February 7th 2014 Camera-ready version: February 28th 2014 Workshop date: April 28th or May 2nd 2014
Manuscript submissions All submissions must be original work that has not been published or submitted elsewhere. The workshop will accept papers describing completed work as well as work-in-progress; papers describing significant experiments are especially encouraged. Reviews will be single-blind; please include author's name and affiliation in the submission. Accepted and presented papers will be published in the IEEE INFOCOM 2014 Conference Proceedings and in IEEE Xplore. All papers must be submitted via the EDAS Paper Processing System http://edas.info/newPaper.php?c=14383. For submission format, please follow INFOCOM 2014 webpage.
* Paper Submission: Submissions must be no greater than 6 pages in length and in a pdf file.
* Poster/demo Submission: Submissions must be no greater than 2 pages in length and in a pdf file.
TPC Members Hitoshi Asaeda, NICT, Japan Jun Bi, Tsinghua University, China Raouf Boutaba, Univeristy of Waterloo, Canada Prosper Chemouil, Orange, France Guillaume Doyen, University of Troyes, France Olivier Festor, Inria, France J. J. Garcia-Luna-Aceves, UCSC, USA Mario Gerla, UCLA, USA Nageen Himayat, Intel Corporation, USA Jérémie Leguay, Thalès, France Junzhou Luo, Southeast Univ., China Taekyoung Kwon, SNU, Korea Yan Ma, BUPT, China Priay Mahadevan, Palo Alto Research Center, USA Bertrand Mathieu, Orange, France Erwan Le Merrer, Technicolor, France Marie-Jose Monpetit, MIT, USA Hassnaa Moustafa, Intel Corporation, USA Katia Obraczka, UCSC, USA Börje Ohlman, Ericsson, Sweden Joerg Ott, Aalto University, Finland Yong-Jin Park, Waseda University, Japan Giovanni Pau, UCLA, USA George Pavlou, University College London, UK Giuseppe Piro, Politecnico di Bari, Italy Venkatesh Rajendran, Intel Corporation, USA Gwendal Simon, Telecom Bretagne (Institut Mines Telecom), France Karen Sollins, MIT, USA Eve Schooler, Intel Corporation, USA Ryuji Wakikawa, Softbank, Japan Cedric Westphal, Huawei, USA Gaogang Xie, China Academy of Science, China Ikjun Yeom, SKKU, Korea Lixia Zhang, UCLA, USA Yanyong Zhang, Rutgers University, USA Xinggong Zhang, Peking University, China
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