-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [EWSN 2023] Call for Papers - Deadline Postponed to Apr. 15 Datum: Sun, 2 Apr 2023 11:16:07 +0200 Von: Kay Römer 0000008f6b7165cc-dmarc-request@COMSOC-LISTSERV.IEEE.ORG Antwort an: Kay Römer romer.kay@GOOGLEMAIL.COM An: tccc-announce@COMSOC.ORG
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------------------------------------------------------------------------------------------------------------------- Call for Papers The 20th edition on the International Conference on Embedded Wireless Systems and Networks (EWSN 2023)
25-27 September 2023 Rende, Italy
Info: https://events.dimes.unical.it/ewsn2023/
We apologize for any duplicates of this CFP that you may receive.
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IMPORTANT DATES
Regular (full/short) Paper Submission: April 15th , 2023 Regular Paper Acceptance Notice: June 1st , 2023 Poster/Demo Paper Submission: June 15th , 2023 Poster /Demo Paper Acceptance Notice: June 25th , 2023 Camera Ready Submission: June 30th, 2023 Early Bird Registration: July 15th , 2023
The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. Building on the past 19 years of success, the 20th edition will be held in Rende, Italy. The conference continues its aim for broad, world-wide impact. Proceedings will be indexed in the ACM Digital Library, SCOPUS, and other prominent digital libraries.
FEATURE TOPIC: Enabling the IoT ecosystem through Embedded Wireless Systems and Networks
The Internet of Things (IoT) is the latest example of an ecosystem whose constituent elements promise to be independent, situated, and temporarily networked to synergically provide advanced cyberÐphysical functionalities. Embedded Wireless Systems and Networks play a key role in the IoT scenario but their engineering poses several challenges from as many viewpoints, spanning across the whole development stack: at device level, embedded systems demands to incorporate embedded intelligence for smartness, autonomy, safety, resilience, efficiency and privacy; at network level, current wireless technologies like 5G, NB-IOT, ZigBee and Lora as well as next-generation ones need to be fully exploited aiming to enable edge computing paradigm; at data level, the huge amount of data with heterogeneous data schemas and formats demand for effective processing, storage and exploitation techniques; finally, at the service level, integration and interoperability issues need to be addressed by means of semantic technologies to avoid siloed and segmented systems and applications.
To systematically address these issues and tame the intrinsic complexity of the IoT ecosystem, full-fledged sets of development solutions and multidisciplinary approaches are needed: therefore, methodologies, frameworks, platforms and tools purposely conceived for the IoT scenario are gaining traction.
SPECIFIC TOPICS of interest include but are not limited to: Edge Intelligence paradigms, models and techniques for IoT ecosystems; Architectures and infrastructures for Edge-Cloud continuum for IoT ecosystems; Interoperability-oriented and integration-oriented enablers for IoT ecosystems; Communication and networking for wireless, embedded and cognitive systems; Operating systems, middleware, and services; Processing, storage, and management of data; Communication and programming paradigms, languages and tools; Dependability (real-time, reliability, availability, safety) in wireless systems; AI operated wireless sensing, actuation and control systems; Modeling, simulation, and measurement tools for wireless AI systems and applications; Machine learning and data mining for wireless sensor system; Services and wireless networking for Cyber-Physical Systems and IoT; Next generation wireless networks, 6G; Privacy and security in applications and systems; Human- centric interaction with wireless and embedded AI systems; Experiences, challenges, comparisons of embedded AI platforms; Applications of wireless embedded AI in health, automation, manufacturing , transportation; Embedded algorithms and systems for computational perception, vision, speech, haptics; Empirical studies, measurement, validation, deployment, experiences; Sustainability and Green Tech; Applications and problems from developing countries and emerging markets.
CO-LOCATED WORKSHOPS:The 1st International Workshop on Machine Learning for Autonomic System Operation in the Device-Edge-Cloud Continuum (MLSysOps 2023); The 2nd International Workshop on Security and Privacy in Connected Embedded Systems (SPICES 2023); The 2nd International Workshop on Hybrid Internet of Everything Models for Industry 5.0 (HIEMI 2023); The 1st International Workshop on Trusted and Reliable Embedded Wireless Environments (TREWE 2023).
SUBMISSION to EWSN 2023 must be original (i.e., not previously published) and not currently under review by any other conference or journal. Submissions related to the featured topic are especially welcome, but all other submissions in scope of EWSN are equally welcome, all submissions will be evaluated based on the same criteria. EWSN 2023 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that their identities are not disclosed to reviewers and reviewers are discouraged from actively working to uncover author identities. To promote early dissemination, submission to arXiv (or similar) is allowed, provided cross-citations are not made. ¥ Paper Submission is managed through Easychair at: https://easychair.org/conferences/?conf=ewsn2023 ¥ Publication template available at website https://ewsn23.dimes.unical.it
Paper Types Full Paper: 10-12 pages Short Paper: 4-6 pages Poster/Demo Paper: 2-3 pages
ORGANIZERS
Honorary Chair Adam Wolisz, Tech Univ. Berlin, Germany
General Chair Giancarlo Fortino, Univ. of Calabria, Italy
General co-Chair Archan Misra, Singapore Management Univ., Singapore
Program Chair Valeria Loscrì, Inria Lille, France Fabrizio Granelli, Univ. of Trento, Italy Tarek Abdelzaher, Univ. of Illinois, USA
Workshop Chairs Gian Pietro Picco, Univ. of Trento, Italy Raymond Choo, Univ. of Texas at San Antonio, USA Gregory OÕHare, Trinity College Dublin, Ireland Sponsorship/Industry/Projects Chairs Tommaso Melodia, Northeastern Univ., USA Carlos Palau, Politech. Univ. of Valencia, Spain Yiannis Andreopoulos, Univ. College London, UK
Finance Chair Antonio Guerrieri, ICAR-CNR, Italy
Publication Chair Claudio Savaglio, Univ. of Calabria, Italy Antonella Guzzo, Univ. of Calabria, Italy
Web Chair Raffaele Gravina, Univ. of Calabria, Italy
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