Von: "Liubingyang (Bryan)" <liubingyang@HUAWEI.COM>
Gesendet: 1. März 2018 02:27:13 MEZ
An: tccc-announce@COMSOC.ORG
Betreff: [TCCC-ANNOUNCE] [CFP] SIGCOMM NEAT Workshop

--- Apology if duplicated ---

ACM SIGCOMM 2018 Workshop on Networking for Emerging Applications and Technologies (NEAT 2018)
August 20 or 24, 2018, Budapest co-located with ACM Sigcomm'18

Scope
ACM NEAT'18 workshop is a forum about new network architectures, technologies and protocols specifically in the context of emerging applications, with a particular focus on achieving accurate prescribed latency, high throughput, and meeting service level objectives in complex and large-scale networks.

Topics of Interest

- New network architectures, technologies and protocols, evolutionary or disruptive, for future applications
- Convergence and optimizations of protocols for industrial, tactile or vehicular networks
- Techniques and solutions for deterministic services in industrial, tactile or vehicular networks
- Network challenges and requirements for emerging, resource-sensitive applications
- Architecture and protocols for ultra-reliable packet delivery at low latency
- Mechanisms to maximize link utilization for high-throughput applications
- Network security and privacy issues in Industrial and Tactile internet
- Resource allocation mechanisms for deterministic and reliable data transmission
- Architectures to enable edge computing and its seamless integration with remote clouds
- New network resource allocation based on data-driven adaptation and machine learning
- Quality of Services and Experience of Service guarantees: the key metrics that will allow future networks to meet industry demands


Submission deadline: March 25, 2018
Submission link: https://sigcomm18neat.hotcrp.com
More details available at: https://conferences.sigcomm.org/sigcomm/2018/workshop-neat.html

Regards,
Bingyang Liu
on behalf of General Chairs



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