-------- Original-Nachricht -------- Betreff: 2nd CFP WiMAN 2008 (Frank Reichenbach) Datum: Thu, 1 Nov 2007 15:00:45 +0100 Von: Frank Reichenbach frank.reichenbach@uni-rostock.de An: multicomm@comsoc.org
---------------------------------------------------------------------------------------- The Second IEEE International Workshop on Wireless Mesh and Ad Hoc Networks (WiMAN'08)
Beijing, China, June 20, 2008
in conjunction with ICDCS 2008
http://www.cs.iusb.edu/~liqzhang/WiMAN2008/index.htm
Submission Deadline: December 7, 2007
**************************************************************************************** Recently, wireless mesh networking is attracting significant interest from academia, industry, and standard organizations. With several favorable characteristics, such as dynamic self-organization, self-configuration, self-healing, easy maintenance, high scalability and reliable services, wireless mesh networks have been advocated as a cost-effective approach to support high-speed last mile connectivity and ubiquitous broadband access in the context of home networking, enterprise networking, or community networking. Despite recent advances, and the technical accumulations from more than a decade's research effort in mobile ad hoc networks, many research issues remain in all protocol layers of wireless mesh networks. For example, the introducing of mixed (infrastructure and ad hoc) architecture, multi-radio, multi-channel, and multi-antenna, have brought new challenges in the design of physical, MAC, and routing protocols. New application scenarios, such as all-wireless office, are urging researchers to address enhanced QoS support and various security issues in the design of different protocol layers for wireless mesh networks.
This workshop aims to bring together the technologies and researchers who share interest in the area of wireless mesh and ad hoc networks. The main purpose is to promote discussions of research and relevant activities in the design of architectures, protocols, algorithms, services, and applications for wireless networks. It also aims at increasing the synergy between academic and industry professionals working in this area. We plan to seek papers that address theoretical, experimental, and work in-progress at the all layers of wireless mesh and ad hoc networks, from application layer to the physical layer.
Topics covered by the workshop will include, but are not limited to, the following:
Multi-radio and ?multi-channel wireless mesh networking Multi-hop wireless communications and ad hoc networking MAC protocols (IEEE 802.11, 802.15, 802.16, 802.20, and beyond) Routing, scheduling, and channel assignment protocols Quality of Services provisioning Multimedia communications over mesh and ad hoc networks Network deployment, localization, and synchronization Topology construction and maintenance Modeling and performance evaluations Cross layer optimizations Power-aware and energy-efficient protocols and algorithms Intelligent system techniques for mesh and ad hoc networks Testbed, prototype, and practical systems Novel applications of mesh and ad hoc networks Vehicular mesh and ad hoc networks Wireless sensor networks Self-adaptive and self-organizing wireless networking systems
Important Dates ---------------
Paper submission due: December 7, 2007 Acceptance notification: February 11, 2008 Camera-ready due: March 9, 2008 Workshop: June 20, 2008
Submissions and Publications ----------------------------
Authors are invited to submit manuscripts reporting original unpublished research and recent developments in the topics related to the workshop. Submissions should include an abstract, key words, the e-mail address of the corresponding author. The length of the papers should be limited to 6 pages in standard IEEE camera-ready format (double-column, 10-pt font) with at most two additional pages with extra charge. One additional page costs $150. Submission method will be posted on the workshop webpage shortly. Submission of a paper should be regarded as an undertaking that, should the paper be accepted, at least one of the authors will register and attend the workshop to present the work.
All papers will be peer reviewed and the comments will be provided to the authors. All accepted papers will be published in workshop proceedings by IEEE Computer Society Press and IEEE online library.
Organizing Committees ---------------------
Workshop Program Co-Chairs
Christian Poellabauer, University of Notre Dame, USA (cpoellab@cse.nd.edu)
Liqiang Zhang, Indiana University South Bend, USA (liqzhang@cs.iusb.edu)
Workshop Program Vice Chair
Jun Luo, University of Waterloo, Canada (j7luo@engmail.uwaterloo.ca)
Publicity Co-Chairs
Yong Cui, Tsinghua University, China (cuiyong@tsinghua.edu.cn)
Frank Reichenbach, University of Rostock, Germany (frank.reichenbach@uni-rostock.de)
Technical Program Committee Wessam Ajib, University of Qu?bec at Montr?al, Canada Hasnaa Aniss, UQAT-LRCS, Canada Tricha Anjali, Illinois Institute of Technology, USA Malik Audeh, Tropos Networks, USA Stefano Avallone, University of Naples, Italy Edoardo S. Biagioni, University of Hawaii at Manoa, USA Luciano Bononi, University of Bologna, Italy Raffaele Bruno, IIT-CNR, Italy Fabian Bustamante, Northwestern University, USA Chun Tung Chou, University of New South Wales, Australia Gang Ding, Olympus Communication Technology, USA Junzhao Du, Xidian University, China Karoly Farkas, University of West Hungary, Hungary Shinichi Honiden, University of Tokyo, Japan Holger Karl, University of Paderborn, Germany Sandeep Kulkarni, Michigan State University, USA Hyunjeong Hannah Lee, Intel Research, USA Guoqing Li, Intel Research, USA Qun Li, College of William and Mary, USA Hock Beng Lim, Nanyang Technological University, Singapore Guoqiang Mao, The University of Sydney, Australia Shivajit Mohapatra, Motorola Labs, USA Luis Montestruque, EmNet LLC., USA Stephan Olariu, Old Dominion University, USA Paolo Santi, IIT-CNR, Italy Kaoru Sezaki, University of Tokyo, Japan Haiying Sheng, University of Arkansas, USA Weisong Shi, Wayne State University, USA Aaron Striegel, University of Notre Dame, USA David Surma, Indiana University South Bend, USA Zhijun Wang, Hong Kong Polytechnic University, Hongkong, China Takashi Watanabe, Shizuoka University, Japan Jianbin Wei, South Dakota School of Mines & Technology, USA Jiang (Linda) Xie, University of North Carolina at Charlotte, USA Yang Yang, University College London, UK Yang Yu, Motorola Labs, USA Advisory Committee
Hossein Hakimzadeh, Indiana University South Bend, USA Sharon Hu, University of Notre Dame, USA Yingbo Hua, University of California Riverside, USA Sitharama Iyengar, Louisiana State University, USA Bahar Sadeghi, Intel Research, USA Loren Schwiebert, Wayne State University, USA Wei Zhao, Rensselaer Polytechnic Institute, USA
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