-------- Original-Nachricht -------- Betreff: [Tccc] Deadline Extension: ACM VANET 2009 Datum: Fri, 3 Apr 2009 13:51:09 -0700 (PDT) Von: Fan Bai fan_bai@yahoo.com An: tccc@lists.cs.columbia.edu
The paper submission deadline of ACM VANET 2009 has been extended to Apr 14, 2009. --------------------------------------------------------------------------------------------------------------------------------- ACM VANET 2009
Vehicle to Vehicle -- Vehicle to Roadside -- Vehicle to Internet
The Sixth ACM International Workshop on VehiculAr Inter-NETworking
In conjunction with ACM MobiCom 2009 Date: To be announced Beijing, China
Sponsored by ACM SIGMOBILE http://www.sigmobile.org/workshops/vanet2009/
Important Dates (tentative): EXTENDED Paper Submission Deadline: April 14th Notification of Acceptance: June 19th Camera-Ready Deadline: July 15th
The goal of this workshop is to present and discuss recent advances in the development of vehicular inter-networking (VANET) technologies. Based on short- and medium-range communication as well as on cellular systems, vehicular inter-networking will enable vehicular safety applications (including collision and other safety warnings) as well as non-safety applications (like real-time traffic congestion and routing information, high-speed tolling, mobile infotainment, and many others).
The creation of high-performance, highly reliable, highly scalable, secure, and privacy-preserving VANET technologies presents an extraordinary challenge for the wireless research community. Clearly, the specificity of vehicular inter-networking in terms of mobility behavior, applications scenarios, and application requirements makes VANET research an exciting and demanding application- and purpose-driven sub-discipline of wireless networking.
Furthermore, VANET present a very active field of research, development, standardization, and field trials. Throughout the world, there are many national and international projects in government, industry, and academia devoted to VANET. These include consortia like Vehicle Safety Consortium (US), Car-2-Car Communication Consortium (Europe), and Advanced Safety Vehicle Program (Japan), standardization efforts like IEEE 802.11p (WAVE), and field trials like the large-scale Vehicle Infrastructure Integration Program (VII) in the US.
Authors are invited to submit papers presenting new research related to the theory or practice of vehicular inter-networking (VANET). All submissions must describe original research, not published or currently under review for another workshop, conference, or journal.
Areas of interest include, but are not limited to:
- Channel modeling - Modulation and coding - Power control and scalability issues - Medium access control protocols - Multi-channel organization and operation - Communication protocol design - Safety and non-safety applications - Vehicle-to-vehicle/roadside/Internet communication - Simulation frameworks - Field operational testing - Network management - Security issues and countermeasures - Privacy issues
Submission Instructions
All paper submissions will be handled electronically. Papers must be in PDF format, no longer than 10 pages (single- or double-column), use the ACM SIG Proceedings Templates (http://www.acm.org/sigs/publications/proceedings-templates) and must fit properly on US Letter-sized paper (8.5 inch x 11 inch) with reasonable margins. Submitted papers will be judged based on their quality through a double-blind review process, where the identities of the authors are withheld from the reviewers.
Detailed instructions for paper submission will be posted on the VANET 2009 web page at: http://www.sigmobile.org/workshops/vanet2009/.
Organizing Committee
General Co-Chairs:
Rajeev Shorey, General Motors Research, India Andre Weimerskirch, escrypt Inc., USA
Technical Program Co-Chairs:
Daniel Jiang, Mercedes-Benz Research & Development North America,Inc., USA Martin Mauve, Heinrich-Heine University in Düsseldorf
Technical Program Committee
Victor Bahl, Microsoft Research, USA Fan Bai, General Motors Research, USA Fabian Bustamante, Northwestern University, USA Levente Buttyan, Budapest University of Technology and Economics, Hungary Eylem Ekici, Ohio State University, USA Tamer ElBatt, Lockheed Martin Advanced Technology Center, USA Andreas Festag, NEC Europe Ltd, Germany Hannes Hartenstein, University of Karlsruhe, Germany Yih-Chun Hu, University of Illinois at Urbana-Champaign, USA Jean-Pierre Hubaux, EPFL, Switzerland Daniel Jiang, Mercedes-Benz Research & Development North America,Inc., USA Frank Kargl, Ulm University, Germany Timo Kosch, BMW, Germany P. R. Kumar, University of Illinois at Urbana-Champaign, USA Ken Laberteaux, Toyota Research, USA Martin Mauve, Heinrich Heine University Düsseldorf, Germany Panagiotis(Panos) Papadimitratos, EPFL, Switzerland Maxim Raya, EPFL, Switzerland Paolo Santi, IIT-CNR, Italy Björn Scheuermann, Heinrich Heine University Düsseldorf, Germany Rajeev Shorey, General Motors Research, India Daniel Stancil, Carnegie Mellon University, USA Ozan Tonguz, Carnegie Mellon University,USA Pravin Varaiya, University of California at Berkeley, USA Michele Weigle, Old Dominion University, USA Andre Weimerskirch, escrypt Inc., USA
Publicity and Web Chair:
Fan Bai, General Motors Research, USA _______________________________________________ Tccc mailing list Tccc@lists.cs.columbia.edu https://lists.cs.columbia.edu/cucslists/listinfo/tccc