Apologies for Multiple Copies
Call for Papers
The 3rd IEEE Workshop on Automotive Networking and Applications (AutoNet 2008)
Co-located with IEEE GLOBECOM 2008 December 4, 2008 (Thursday) - New Orleans, LA, USA
Coupled with advances in wireless communications and computing technologies, there have been significant recent efforts to enhance and integrate the communications and computing technologies into the vehicle and transportation systems to enhance vehicle safety, reduce traffic congestion, and protect environment. Significant industrial and governmental efforts are underway to push for vehicle-to-vehicle / vehicle-to-infrastructure networking functions in vehicles and highway infrastructure. When such communications and networking capabilities are integrated into vehicles and the infrastructure, not only safety but many other emerging applications can be supported for intelligent interactions with the transportation system, with other vehicles, and inside vehicles, to help with traffic management, vehicle diagnostics, mobile commerce, and much more.
This one-day workshop intends to bring together researchers, professionals, and practitioners to discuss and address recent developments and challenges in deploying vehicle-to-vehicle / vehicle-to-infrastructure networking technologies and their applications.
Specifically, we solicit original research contributions addressing the following areas:
* Vehicle-to-vehicle (V2V) communications * Vehicle-to-infrastructure (V2I) communications * Vehicular ad hoc networks * Potential applications of V2V and V2I communications including ITS * Protocols for V2V and V2I communications (MAC, routing, mobility management, etc.) * Security and privacy issues in V2V and V2I networks * Physical layer and RF level technologies for V2V and V2I communications * Antenna technologies for V2V and V2I communications * Radio resource management and QoS support for V2V and V2I communications * Information networking over V2V, V2R and next-generation networks * Simulation / performance evaluation techniques for V2V and V2I communications * Algorithms, protocols and systems for data dissemination in V2V and V2I communications * Experimental systems and testbeds for V2V and V2I communications * Standardization updates on V2V and V2I communications
All submitted papers will be peer-reviewed. Accepted papers will appear in the Workshop proceedings (CD-ROM and booklet of papers) as well as on the IEEE Xplore. Workshop URLs: http://www.ieee-globecom.org/ (workshops) or http://autonet2008.research.telcordia.com/ EDAS URL: http://edas.info/newPaper.php?c=5783&track=4681
Submission Instructions Authors are invited to submit full papers of up to 20 double-spaced pages, including references, figures and tables. All submissions should be submitted electronically in Postscript or Adobe PDF format on EDAS http://edas.info/newPaper.php?c=5783&track=4681
Please direct questions regarding the submission procedure to: Wai Chen (wchen@research.telcordia.com) Onur Altintas (onur@jp.toyota-itc.com)
Important Dates: Paper Submission Deadline: September 1, 2008
Notification of Acceptance: October 1, 2008
Camera-Ready Submissions: October 15, 2008
Workshop Co-chairs Dr. Wai Chen, Telcordia Technologies, USA Dr. Onur Altintas, Toyota InfoTechnology Center, Japan
Program Advisor Prof. Tadao Saito Professor Emeritus, University of Tokyo, Japan CTO, Toyota InfoTechnology Center, Japan
Technical Program Committee Subir Biswas Michigan State University, USA
Fan Bai GM R&D Center, USA
Luca Delgrossi Mercedes-Benz Research Lab, USA
Eylem Ekici Ohio State University, USA
Andreas Festag NEC Lab, Germany
Marco Gruteser WINLAB, Rutgers University, USA
Ratul Guha Telcordia Technologies, USA
Jerome Harri University of Karlsruhe, Germany
Teruo Higashino Osaka University, Japan
Hariharan Krishnan GM R&D Center, USA
Tim Leinmuller Denso Automotive Deutschland GmbH, Germany
Thomas Luckenbach FOKUS, Germany
Michela Meo Politecnico di Torino, Italy
Rahul Mangharam University of Pennsylvania, USA
Nick Maxemchuk Columbia University, USA
Guevara Noubir Northeastern University, USA
Umit Ozguner Ohio State University, USA
Ai-Chun Pang National Taiwan University, Taiwan
Chirag Patel Qualcomm, USA
Panagiotis Papadimitratos EPFL, Switzerland
Cem Saraydar GM R&D Center, USA
Chien-Chung Shen University of Delaware, USA
Daniel Stancil Carnegie Mellon University, USA
Marcus Strassberger BMW Group, Germany
Kazunori Takeuchi KDDI R&D Lab, Japan
Kemal Tepe University of Windsor, Canada
Christian Wewetzer Volkswagen Group, Germany
Benjamin Weyl BMW Group, Germany
Richard Wolff Montana State University, USA
Daniel Wong Malaysia University of Science and Technology, Malaysia
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