-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: IEEE MobiSec 2023 (co-located with IEEE INFOCOM 2023), New York City area, USA, May 2023 (Submission due: 12/20/2022) Datum: Tue, 15 Nov 2022 16:19:56 +0000 Von: Wenjia Li wli20@NYIT.EDU Antwort an: Wenjia Li wli20@NYIT.EDU An: tccc-announce@COMSOC.ORG
Dear Colleagues,
Sorry if you receive this message multiple times. We really appreciate if you would consider submitting your work to the 7th IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2023), which will be co-located with IEEE INFOCOM 2023.
Please note that the submission due date is December 20, 2022.
If you have any question regarding the MobiSec 2023 workshop, please contact the workshop chairs. Thank you.
Sincerely Yours,
Wenjia Li, Ph.D., SMIEEE Workshop organizer and TPC chair, IEEE MobiSec 2023 Associate Professor, Computer Science New York Institute of Technology New York City, USA
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The Seventh IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2023) co-located with IEEE INFOCOM 2023 New York City area, USA May 2023 https://bit.ly/mobisec2023
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Call for Papers
To many people, smartphones have been an indispensable part of daily life and work. With personal financial and medical information and job-related data being processed on smartphones and related mobile systems and networks, it is critically important that the development and advancement of secure mobile operating systems, secure mobile applications, secure smartphone devices and cellular networks keep up with the ever‐ growing smartphone usage. For this reason, this research area has been a very important sector in the network and telecommunication industry and a focus of funded research projects in many research institutes.
The scope of MobiSec 2023 encompasses the security, privacy, and digital forensics of mobile systems and networks, including but not limited to Android, iOS, and Windows Mobile operating systems, smartphones and applications for these platforms and devices, as well as cellular networks.
Topics of interest include (but are not limited to) the following subject categories:
+ Android, iOS, and Windows Mobile security and privacy + Digital forensics on mobile operating systems, applications, and smartphones + Secure mobile application development + Smartphone device/hardware security + Mobile application security and digital forensics + Mobile user authentication and authorization + Multi‐factor mobile authentication + Mobile user privacy + Mobile vulnerability detection and remediation + Intrusion detection and recovery on mobile OS, applications, smartphones, and cellular networks + Social network security and privacy + Secure cloud for mobile environment + Mobile device management + 4G and 5G security
SUBMISSION INSTRUCTIONS
The Mobisec 2023 Workshop seeks for original papers which are not currently under review or published in any other conference or journal. Paper length should not exceed six-page standard IEEE conference two-column format (including all text, figures, and references) and submitted as PDF files through the EDAS website:
Important Dates
Submission Due: December 20, 2022 Author Notification: February 6, 2023 Camera-ready Due: March 6, 2023
Honorary General Chair
* Dr. Wenjing Lou, Virginia Tech, USA
Workshop Organizers and Technical Program Chairs
* Dr. Lei Chen (Point of Contact), Georgia Southern University, USA * Dr. Wenjia Li, New York Institute of Technology, USA * Dr. Danda Rawat, Howard University, USA * Dr. Yun Lin (Point of Contact), Harbin Engineering University, China
Technical Program Vice Chairs
* Dr. Yiming Ji, Georgia Southern University, USA * Dr. Mauro Conti, The University of Padua, Italy * Dr. Feng Zeng, Central South University, China * Dr. Peter Mueller, IBM Zurich Research Laboratory, Switzerland * Dr. Yupeng Hu, Hunan University, China
Publication Chairs:
* Dr. Narasimha Shashidhar, Sam Houston State University, USA * Dr. Umit Karabiyik, Purdue University, USA * Dr. Yuansheng Luo, Changsha University of Science & Technology, China
Publicity Chairs:
* Dr. Weitian Tong, Eastern Michigan University, USA * Dr. Nhien-An Le Khac, University College Dublin, Ireland * Dr. Yejun He, Shenzhen University, China * Dr. Yehua Wei, Hunan Normal University, China
Web Chair:
* Dr. Atef Mohamed, Georgia Southern University, USA * Dr. Weinan Gao, Northeastern University, China * Dr. Di Zhang, University of Jyväskylä, Finland
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