-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [TDIS] Deadline Extended: July 5th - International Workshop on,Testing Distributed Internet of Things Systems Datum: Thu, 23 Jun 2022 12:36:17 +0200 Von: Ilja Behnke i.behnke@TU-BERLIN.DE Antwort an: Ilja Behnke i.behnke@TU-BERLIN.DE An: tccc-announce@COMSOC.ORG
========================================================== Call for Papers: 2nd International Workshop on Testing Distributed Internet of Things Systems (TDIS 2022) ========================================================== https://tdis22.diselab.berlin
Co-located with the 10th IEEE International Conference on Cloud Engineering (IC2E 2022)
========================================================== Submission deadline extended: July 5th 2022 ==========================================================
Sep 27, 2022, in Pacific Grove, California
The TDIS workshop aims to provide a forum for current work by researchers and practitioners in the different research areas and application domains connected to testing IoT systems. We welcome submissions that describe initial ideas and visions, just as much as reports on novel approaches, practical tools, and completed projects. In case that the workshop will have to take place virtually, we will make sure there will be ample opportunities for constructive feedback, lively discussions, and direct interactions.
Topics of interest include but are not limited to:
* physical and hybrid IoT testbeds * simulation and emulation of IoT environments * co-simulation within IoT domains * model-based and model-supported approaches * simulation-based integration testing * testing and benchmarking on heterogeneous IoT devices * testing and benchmarking of network technologies and protocols * testing and benchmarking of real-time behavior * testing and benchmarking of fault tolerance mechanisms (fault injection, chaos - engineering, etc.) * dependability modeling and assessments (high availability, consistency, etc.) * testing and modeling of resource usage and energy consumption * resource management and scheduling in testbeds * scalability and efficiency of test runs and testbeds * testing frameworks for edge and fog computing * testbed automation and orchestration * distributed monitoring, tracing, and error detection * usability of testbeds and testing frameworks * representativeness, reproducibility, and repeatability of test results
Important Dates ===============
* Submission deadline: July 5, 2022 * Notification of acceptance: July 24, 2022 * Camera-ready submission: August 1, 2022 * Workshop: September 27, 2022
Workshop Chairs ===============
Lauritz Thamsen, University of Glasgow, United Kingdom Jossekin Beilharz, Hasso Plattner Institute, University of Potsdam, Germany Demetris Trihinas, University of Nicosia, Cyprus Andreas Polze, Hasso Plattner Institute, University of Potsdam, Germany
Program Committee =================
Fotis Nikolaidis, ICS-FORTH, Greece Shashikant Ilager, Technische Universität Wien, Austria Miguel Matos, Universidade de Lisboa, Portugal Steffen Zeuch, German Research Center for Artificial Intelligence (DFKI), Germany Vasileios Karakostas, University of Athens, Greece Lito Michala, University of Glasgow, United Kingdom Ang Li, Duke University, USA Peter Tröger, Beuth University of Applied Sciences Berlin, Germany Thomas Rausch, LocalStack, Austria Moysis Symeonides, University of Cyprus, Cyprus Eyhab Al-Masri, University of Washington Tacoma, USA Eleni Tzirita Zacharatou, IT University of Copenhagen, Denmark Dragi Kimovski, Alpen-Adria Universität Klagenfurt, Austria
Submission of Papers ====================
Papers should not exceed 6 double-column pages, including figures and tables, in the IEEE Manuscript Template for Conference Proceedings. References can be up to two additional pages. The submitted papers should include the names and affiliations of all authors. Submitted papers will be peer-reviewed by our Program Committee. Submissions should not have been published earlier and not be currently under review submission anywhere else. Accepted papers will be published with the main conference proceedings via IEEE Xplore.
For more information please visit our website: https://tdis22.diselab.berlin.
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We welcome your submission to TDIS 2022 and are happy to answer any questions. Furthermore, please consider forwarding this call to other researchers!
Best regards, Ilja Behnke, Philipp Wiesner, and Lukas Pirl Publicity Chairs