-------- Ursprüngliche Nachricht -------- Von: Kiran Makhijani kiranmak@GMAIL.COM Gesendet: 20. März 2019 19:06:51 MEZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] Submission deadline for [NEAT'19] 2nd ACM SIGCOMM Workshop on Networking for Emerging Applications and Technologies
Hello,
The 2nd NEAT workshop aims exchange ideas about network architectures, technologies, and protocols specifically in the context of emerging applications.
*Details of the Workshop:* Workshop site: http://conferences.sigcomm.org/sigcomm/2019/workshop-neat.html
Paper Submission deadline (firm): April 08, 2019
Submission link: https://sigcomm19neat.hotcrp.com/
*Topic of Interest*
We invite submissions on a wide range of topics of interest, including, but not limited to:
- Architecture and frameworks for delivering high precision of services - Convergence and optimizations of protocols for Industrial and Tactile networks - Solutions for deterministic services in Industrial and Tactile networks - Investigations, survey and techniques in data plane for Industrial and Tactile internet. - Network challenges and requirements for emerging, resource-sensitive applications - Mechanisms to support ultra-low-latency in packet based networks - Internetworking frameworks for deterministic multi-access edge applications - Maximizing link utilization for high-throughput applications - Architecture and protocols for reliable packet delivery - Network security and privacy issues in Industrial and Tactile interne - Resource allocation mechanisms deterministic and reliable data transmission - Requirements and challenges in Holographic type communications - Networking requirements and challenges of VR/AR - High-throughput transport for VR/AR and Holographic type communications - Adaptive video streaming for network/user dynamics - Video analytics and smart offloading for VR/AR - Measurement study of existing VR/AR and HTC applications
Best Regards Kiran
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