-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] COINS 2020 (IEEE CEDA) Datum: Thu, 12 Sep 2019 10:25:37 +0200 Von: Farshad Firouzi farshadfirouzi@GMAIL.COM Antwort an: Farshad Firouzi farshadfirouzi@GMAIL.COM An: tccc-announce@COMSOC.ORG
*COINS 2020: International Conference on Omni-Layer Intelligent Systems *
Barcelona, Spain| July 27-29, 2020
In collaboration with IEEE CEDA
Submission Deadline: March 06, 2020 https://coinsconf.com
COINS is the premier conference devoted to omni-layer techniques for smart IoT systems, by identifying new perspectives and highlighting impending research issues and challenges. COINS main topics include the following but are not limited to:
· Internet of Things: From Device to Edge, and Cloud
· Embedded Systems, and Computer Architecture
· Cloud Computing
· Big Data
· Distributed Ledger Technologies and Blockchain
· Artificial Intelligence, Machine Learning, and Advanced Analytics
· Artificial Intelligence Circuits and Systems
· Intelligent IoT eHealth
· Omni-Layer Security, Privacy, and Trust
Special tracks:
· Cyber-physical and embedded systems
· Critical System Design
· Face Recognition
*Important Date*
Submission Deadline: March 06, 2020 Acceptance Notification: May 06, 2020
Camera-Ready Submission: May 16, 2020
Contact the chairs at farshad.firouzi@duke.edu
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