-------- Ursprüngliche Nachricht -------- Von: oana iova oana.iova@GMAIL.COM Gesendet: 21. Juni 2019 18:56:21 MESZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] EWSN2020 - Call For Papers
International Conference on Embedded Wireless Systems and Networks EWSN 2020 February 17-19, 2020 Lyon (France)
Call for Papershttp://ewsn2020.conf.citi-lab.fr/
The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. After last year’s positive experience in China, the 17th edition returns to Europe in Lyon, France. The conference continues its aim for broad, world-wide impact.
Topics of Interest
The conference solicits both full technical papers and short papers describing validated early ideas. Specific topics of interest include but are not limited to:
* Communication and networking for wireless and embedded systems * Sensing, actuation, and control * Operating systems, middleware, and services * Processing, storage, and management of data * Programming paradigms, languages, and tools * Time and location management * Dependability (real-time, reliability, availability, safety) * Privacy and security in applications and systems * Human-machine interaction with wireless and embedded systems * Design and implementation of real-world applications and systems * Measurement studies and deployment experiences * Green IoT (low-power, harvesting, energy management) * Challenges of ultra dense networks * Heterogeneous networks * Applications and problems from developing countries and emerging markets
As always, contributions are welcome across the entire scope of the conference. As the relevant environments grow increasingly diverse and dense, we encourage contributions addressing this increased heterogeneity, and ultra dense networks. Papers highlighting novel ideas that are not ready for extensive evaluations, report on new tools and platforms with limited evaluation, or topics that could be adequately described in a short format are invited for submission as short papers. Initial explorations of profound problems in developing countries that have been addressed using IoT solutions may also be appropriate short paper submissions.
The conference proceedings will appear in the ACM Digital Library. Selected accepted papers will be fast-tracked to ACM Transactions on Sensor Networks (TOSN) or ACM Transactions on the Internet of Things (TIOT).
Submission Instructions
Submissions to EWSN 2020 must be original (i.e., not previously published) and not currently under review by any other conference or journal. EWSN 2020 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that their identities are not disclosed to reviewers and reviewers are discouraged from actively working to uncover author identities. To promote early dissemination, submission to arXiv (or similar) is allowed, provided cross-citations are not made.
Formatting requirements. Both full (10-12 pages) and short papers (4-6 pages) are welcome. Authors should carefully consider this choice as full papers will not be considered as short paper candidates during the review phase. Pages must use 8.5" x 11" (letter) two-column format, using 10-point type on 11-point leading, with a maximum text block of 7" wide x 9" deep with an inter-column spacing of .25". The page limits include figures, tables, and references. Authors may use the LaTex templates provided here.
Paper Submission. Paper submission is managed through HotCRP at the following site: http://hotcrp-ewsn2020.citi-lab.fr
Important Dates
Paper registration: September 6, 2019 Paper submission: September 13, 2019 Authors rebuttal deadline: November 15, 2019 Notification: November 29, 2019 Each deadline is 23:59 UTC-12 (AoE). All dates are firm. No extensions will be granted.
TPC (preliminary)
Omprakash Gnawali, University of Houston (USA) (chair) Amy L. Murphy, Fondazione Bruno Kessler (Italy) (chair)
Olivier Berder, IRISA (France) Carlo Alberto Boano, Graz University of Technology (Austria) Maurizio Bocca, Xandem (USA) Philippe Bonnet, ABB Corporate Research (Switzerland) Matteo Ceriotti, U of Duisburg-Essen (Germany) Mun Choon Chan, NUS (Singapore) Jiming Chen, ZJU (China) Octav Chipara, University of Iowa (USA) Wei Dong, ZJU (China) Andrzej Duda, LIG, UGA (France) Xenofon Fafoutis, Technical University of Denmark (Denmark) Luoyi Fu, SJTU (China) Jie Gao, Stony Brook University (USA) Vlado Handziski, TU Berlin (Germany) Yuan He, Tsinghua University (China) Oana Iova, INSA Lyon (France) Konrad Iwanicki, University of Warsaw (Poland) Salil Kanhere, UNSW (Australia) Rudiger Kapitza, TU Braunschweig (Germany) Olaf Landsiedel, Kiel University (Germany) & Chalmers University (Sweden) Andrew Markham, U of Oxford (UK) Julie McCann, Imperial College (UK) Luca Mottola, Politecnico di Milano (Italy) and SICS (Sweden) Thomas Noel, Université Strasbourg (France) Chiara Petrioli U of Rome, La Sapienza (Italy) Gian Pietro Picco, University of Trento (Italy) Andreas Reinhardt, Technische Universität Clausthal (Germany) Utz Roedig, niv. of Lancaster (UK) Kay Römer, TU Graz (Austria) Olga Saulk, TU Graz (Austria) Leo Selavo, U of Latvia (Latvia) Longfei Shangguan, Microsoft Research (USA) Philipp Sommer, ABB (Switzerland) Junehwa Song, KAIST (Korea) Cormac Sreenan, U of Cork (Ireland) Eduardo Tovar, U of Porto (Portugal) Xiaolong Zheng, Tsinghua (China) Yuanqing Zheng, PolyU HK (China)
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