-------- Original-Nachricht -------- Betreff: [Tccc] Second CFP for ICCPS 2013: 4th ACM/IEEE International Conference on Cyber-Physical Systems Datum: Wed, 26 Sep 2012 00:37:05 -0400 Von: Hongwei Zhang hzhang@cs.wayne.edu Antwort an: hongwei@wayne.edu An: tccc@lists.cs.columbia.edu
CALL FOR PAPERS
**** ACM/IEEE ICCPS 2013 **** Philadelphia, USA April 8-11, 2013 http://cesg.tamu.edu/iccps2013/
Cyber-physical systems are systems with a coupling of the cyber aspects of computing and communications with the physical aspects of dynamics and engineering that must abide by the laws of physics.
The objective of ICCPS 2013, the 4th ACM/IEEE International Conference on Cyber-Physical Systems, is to serve as a single-track forum for reporting advances in all aspects of cyber-physical systems, including but not limited to theory, tools, applications, systems, and testbeds. Examples of theoretical advances encompassed by this conference include but are not limited to control, real-time, hybrid systems, and sensor networks. Similarly, examples of applications include transportation, energy, water, medical, and robotic systems, and other challenges for the twenty-first century.
SUBMISSION GUIDELINES Submissions must report results from original research and not have been submitted to or published in other conferences or journals. Submissions must be a maximum of 10 pages, in 2-column format, and use font sizes of no less than 10 pt. Quality of the paper is the primary consideration, and is not synonymous with length. The length of a submission should be tuned to the nature of the topic addressed.
Each submission will be reviewed using a peer-review process by the ICCPS 2013 Program Committee. The review process will be typical of high-quality IEEE and ACM conferences. Papers that are clearly not appropriate whether in quality or scope will receive an early decision.
IMPORTANT DATES Submission Deadline: October 15, 2012 (11:59PM PDT) Early Decisions: November 15, 2012 Acceptance Decisions: December 7, 2012 Final Manuscript: February 15, 2013 Conference: April 8-11, 2013
ORGANIZERS
General Chair Chenyang Lu, Washington University, USA
Program Chairs P.R. Kumar, Texas A&M University, USA Radu Stoleru, Texas A&M University, USA
Program Committee Antoine Girard, Universite Joseph Fourie Aranya Chakrabortty, North Carolina State University Christopher Gill, Washington University in St. Louis Eduardo Tovar, Polytechnic Institute of Porto (ISEP-IPP), Portugal Fan Bai, General Motors George Pappas, University of Pennsylvania Guangfeng Liang, DOCOMO Innovations, Inc. Guoliang Xing, Michigan State University Hamsa Balakrishnan, Massachusetts Institute of Technology I-Hong Hou, Texas A&M University Insup Lee, University of Pennsylvania Juan Jose Jaramillo, Universidad EAFIT, Colombia Kang Shin, University of Michigan Kannan Srinivasan, Ohio State University Karl-Erik Arzen, Lund University, Sweden Kyoung-Dae Kim, Texas A&M University Le Xie, Texas A&M University Lei Rao, General Motors Long Le, INRS (Institut national de la recherche scientifique), Canada Lui Sha, University of Illinois at Urbana-Champaign Marco Caccamo, University of Illinois at Urbana-Champaign Panos Antsaklis, University of Notre Dame Paulo Tabuada, University of California at Los Angeles Prabir Barooah, University of Florida Qixin Wang, Hong Kong Polytechnic University Rahul Mangharam, University of Pennsylvania Rong Zheng, University of Houston Sayan Mitra, University of Illinois at Urbana-Champaign Sujay Sanghavi, University of Texas at Austin Tarek Abdelzaher, University of Illinois at Urbana-Champaign Wenbo He, McGill University Xenofon D. Koutsoukos, Vanderbilt University Xue Liu, McGill University
Publicity Chair Hongwei Zhang, Wayne State University Prabir Barooah, University of Florida
Web Chair Kyoung-Dae Kim, Texas A&M University
ICCPS Steering Committee Karl-Erik Arzen, Lund University, Sweden Bruce Krogh, Carnegie Mellon University, USA Raj Rajkumar, Carnegie Mellon University, USA (Chair) John Stankovic, University of Virginia, USA Janos Sztipanovits, Vanderbilt University, USA Claire Tomlin, University of California at Berkeley, USA Marilyn Wolf, Georgia Institute of Technology, USA
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