Von: "Harpreet S. Dhillon" <hdhillon@VT.EDU>
Gesendet: 10. September 2018 06:19:02 MESZ
An: tccc-announce@COMSOC.ORG
Betreff: [TCCC-ANNOUNCE] CFP: Wireless Communications Symposium, IEEE ICC 2019

 *Apologies if you receive multiple copies of this email*

*CALL FOR PAPERS *
*Wireless Communications Symposium*

*IEEE International Conference on Communications*

*20-24 May 2019, Shanghai, China*
http://icc2019.ieee-icc.org

*Scope and Topics of Interest *
The Wireless Communications Symposium (WCS) covers all aspects related to
current and future wireless communications and its applications, with a
focus on topics related to physical layer (PHY), Medium Access Control
(MAC) layer, cross-layer, and PHY-related network analysis and design. High
quality papers reporting on novel and practical solutions to PHY, MAC, and
cross-layer designs in wireless communication systems are encouraged. In
addition, papers on field tests and measurements, field trials and
applications from both industries and academia are of special interest. To
ensure complete coverage of the advances in wireless communications
technologies for the current and future systems, the WCS cordially invites
original contributions in, but not limited to, the following topical areas:

- Artificial intelligence for wireless communications
- Advanced equalization, channel estimation, and synchronization
- Antennas, smart antennas, and space-time processing
- Broadband wireless access techniques, systems and standards
- Channel modeling and propagation
- Compressive sensing and communications
- Cooperative and relay-aided communications
- Cross-layer design and physical-layer based network issues
- Digital broadcasting of audio (DAB), video (DVB), and multimedia
(MBMS)
- Energy harvesting for wireless communications
- Heterogeneous and small-cell networks
- Hybrid communication systems (e.g. satellite/terrestrial/wireline
hybrids)
- Inter-cell interference coordination (ICIC) and coordinated
multi-point (CoMP)
- Interference management, alignment, and cancellation
- Interference modeling and performance analysis using stochastic tools
- Localization and navigation techniques
- Millimeter wave communications
- MIMO, multi-user MIMO, and massive MIMO
- Modulation, coding, and diversity techniques
- Multiple access techniques and air interfaces (CDMA, TDMA, FDMA,
OFDMA, NOMA)
- Performance analysis of wireless communication systems
- Physical-layer aspects of wireless sensor networks
- Physical-layer issues in device-to-device and machine-to-machine
communications
- Physical-layer network coding
- Physical-layer security
- Radio resource allocation and interference management
- RFID and its applications
- Security issues related to wireless communications
- Terahertz communications
- Wireless communications on different media (e.g., underwater)
- Wireless power transfer
- Wireless system standards
- Wireless communications testbeds, field tests, and measurements

*Submission Guidelines: *The IEEE ICC 2019 website provides full
instructions on how to submit papers & the paper format. Please select the
desired symposium when submitting. The paper submission deadline is October
14, 2018. Only PDF files will be accepted for the review process and all
submissions must be done through EDAS at http://edas.info/.

*Symposium Co-Chairs *
Xu (Judy) Zhu, The University of Liverpool, UK, xuzhu@liverpool.ac.uk
Harpreet Dhillon, Virginia Tech, USA, hdhillon@vt.edu
Feifei Gao, Tsinghua University, China, feifeigao@ieee.org
Julian Cheng, University of British Columbia, Canada, Julian.Cheng@ubc.ca
Andreas Knopp, Bundeswehr University Munich, Germany, andreas.knopp@unibw.de

Best regards,
Harpreet

--
Harpreet S. Dhillon, Ph.D.
Assistant Professor & Steven O. Lane Junior Faculty Fellow
Wireless@VT, Bradley Department of ECE, Virginia Tech
Mail: 432 Durham Hall, 1145 Perry St., Blacksburg, VA 24061
Phone: (540)-231-2129 | Website: www.dhillon.ece.vt.edu
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