-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: The 14th IEEE International Conference on Mobile Ad Hoc and Sensor Systems (IEEE MASS 2017) Datum: Fri, 9 Dec 2016 00:03:49 -0500 Von: Shigang Chen sgchen@UFL.EDU Antwort an: Shigang Chen sgchen@UFL.EDU An: tccc-announce@COMSOC.ORG
CALL FOR PAPERS
The 14th IEEE International Conference on Mobile Ad Hoc and Sensor Systems (IEEE MASS 2017)
Orlando, Florida, USA
October 14-17, 2017
IEEE MASS is a premier, annual forum for sharing original, novel ideas in mobile ad hoc networks and wireless sensor networks, defined broadly. Continuing this tradition, the 14th IEEE International Conference on Mobile Ad hoc and Sensor Systems (MASS) will be held in Orlando, Florida, USA, on October 14-17, 2017. Wireless ad hoc communications, Internet of Things, and mobile computing are increasingly being used in civilian and military applications in homes and businesses, cities and rural areas, sea and space. Wireless sensor and actuator networks are being widely deployed for enhancing industrial processes and management, for various forms of environmental monitoring and control, and for improving quality of life. Sponsored by the IEEE Computer Society, IEEE MASS 2017 aims at bringing together researchers, developers, and practitioners to address recent advances in mobile ad-hoc and sensor-actuator systems, covering algorithms, theories, systems, protocols, applications, experiments, and testbeds.
IMPORTANT DATES
Abstract Submission Deadline: March 30, 2017 midnight EDT
Paper Submission Deadline: April 6, 2017 midnight EDT Notification of Acceptance: July 1, 2017 Camera-ready version: August 1, 2017
TOPICS OF INTEREST
Original, unpublished contributions are solicited in all aspects of mobile ad hoc networks (MANETs) and wireless sensor networks (WSNs), from mobile networking/computing to cyber-physical systems to Internet of Things, from theory to systems to applications. Topics of interest include, but are not limited to:
Algorithms for MANETs and WSNs Application Layer Protocols Clustering, topology control, coverage, and connectivity Cognitive networking Cooperative and cognitive communication Cooperative sensing, compressive sensing, sensing from communications
Cloud, crowd-sourced, participatory and (mobile) social sensing Cyber-physical systems and applications
Data gathering, fusion, and dissemination Experiences in real-world applications and deployments Heterogeneous networks
Internet of Things (IoT) devices, gateways, and infrastructure
Security and privacy at all layers, including the physical layer Localization and Location Based Services Measurements, experimental systems and test-beds Mobile computing and networking Mobility modeling and management Multi-channel, multi-radio and MIMO technologies Network components, operating systems, and middleware Opportunistic networking, delay tolerant networking Energy-efficient architectures, algorithms, and protocols QoS and Resource management Robotic networks Routing protocols
Scalability, stability, and robustness of networks and sensor systems Sensor enabled drone, UAV, UUV systems
Smart grid, healthcare, transportation applications
Vehicular networks and protocols Wearable and human-centric devices and networks
ORGANIZING COMMITTEE
Steering Committee:
Dharma Agrawal, University of Cincinnati, Cincinnati, OH, USA Jie Wu, Temple University, Philadelphia, PA, USA Kang Shin, University of Michigan, An Arbor, MI, USA J. J. Garcia-Luna-Aceves, University of California, Santa Cruz, CA,USA
General Chair: Victor Leung, The University of British Columbia, Vancouver, BC, Canada
Program Co-Chairs: Anish Arora, Ohio State University, Columbus, OH, USA Shigang Chen, University of Florida, Gainesville, FL, USA
Local Co-Chairs: Damla Turgut, University of Central Florida, Orlando, FL, USA
Murat Yuksel, University of Central Florida, Orlando, FL, USA
Publicity Chair:
Yanmin Gong, Oklahoma State University, Stillwater, OK, USA
Registration and Finance Chair: Shuhui Yang, Purdue University, Calumet, Hammond, IN, USA
Workshop Chair: Song Guo, Hong Kong Polytechnic University, Hong Kong, China
Publication Chair:
Dajin Wang, Montclair State University, Montclair, NJ, USA
SUBMISSION GUIDELINES Authors are invited to submit original, unpublished research papers that are not currently under review elsewhere. All submissions should be written in English with a maximum length of 9 single-spaced, double-column pages using 10pt fonts on 8.5 x 11 inch paper, including all figures, tables, and references, in PDF format. Authors must use the Manuscript Templates for IEEE Conference Proceedings. Accepted papers will appear in the conference proceedings published by IEEE and will be presented at the conference. Based on TPC reviews and discussions, some papers may be accepted as 5-page short papers, in addition to the regular 9 page papers. For all papers, IEEE reserves the right to exclude the paper from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not presented at the conference. Note that the conference will also include a poster and demo session.
Shigang Chen, TPC co-Chair, sgchen@ufl.edu
Professor, FIEEE
Computer and Information Science and Engineering
University of Florida
(352) 214 9215
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