-------- Original-Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: IEEE goSMART 2014 (Deadline Extended: 21st April 2014) Datum: Mon, 7 Apr 2014 16:30:19 +1000 Von: salil kanhere salilk@CSE.UNSW.EDU.AU Antwort an: salil kanhere salilk@CSE.UNSW.EDU.AU An: tccc-announce@COMSOC.ORG
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CFP: Third IEEE International Workshop On GlObal Trends in SMART Cities (goSMART) (in conjunction with IEEE LCN 2014) Edmonton, Canada 8-11 September 2014 Web: http://www.cse.unsw.edu.au/~gosmart
Deadline Extended: 21st April 2014
More than half of the world's population lives in urban areas today. The current trend of unprecedented migration from rural areas to urban centers is expected to continue in the near future. This increasing urbanization has placed continuous and increasing pressure upon infrastructure, residential and commercial properties, and social communities. Cities of the future can be models of environmental efficiency, because increased density and better management reduce the cost of service delivery, promote innovation, and enable prosperity through economic development.
The goSMART workshop will bring together academics, researchers and practitioners from around the world to discuss and exchange ideas on recent developments, current research challenges and future directions in the use of networking, communications, IT systems, applications and service to realize smart communities of the future.
Topics of interest include but are not limited to
- sensor networks for large-scale urban sensing - smart meters, smart grid and efficient energy management - deployment issues for smart infrastructure in urban areas - traffic management and efficiency - mechanisms to measure quality of life of communities - participatory sensing for smart cities - security and privacy implications - methods to reduce carbon footprint of cities - mechanisms for motivating behavior change towards sustainability - experimental testbeds and simulation environments - smart clouds for management of large-scale data - service delivery and logistics planning - communication infrastructure for smart energy management (Wifi, Wi-sun, Zigbee, or others)
Submitted papers will be reviewed by three independent experts in the field. Proceedings of the workshop will be published together with those of IEEE LCN, and will be available in digital format from the IEEE Explore Digital Library.
Authors are invited to submit original unpublished work, not currently under review by another conference, workshop or journal. Full papers should be restricted to 8 camera-ready pages (in 10 pt font, double column, US letter size, 8.5 x 11 inches, IEEE format), including text, figures and references. Authors should use only standard fonts, i.e. Times Roman, Courier, Symbol, Helvetica or equivalent. All papers must include title, complete contact information of all authors, abstract and up to 5 keywords on the cover page. Papers must be submitted electronically via EDAS : https://edas.info/newPaper.php?c=17143
Important Dates:
Submission Deadline: 21 April 2014 Notification of Acceptance: 30 May 2014 Camera-Ready Deadline: 30 June 2014
Workshop Co-Chairs Satoko Itaya, NICT, Japan Salil Kanhere, UNSW, Australia Stefan Aust, NEC Communication Systems, Japan
Standing Committee Shinichi Doi, NEC Central Research Laboratories, Japan Chun-Tung Chou, UNSW, Australia Peter Davis, Telecognix Corporation, Japan
Technical Program Committee
Omar Alfandi, University of Goettingen, Germany Onur Altintas, Toyota InfoTechnology Center, USA Karl Andersson, Lulea University of Technology, Sweden Bernd Bochow, Fraunhofer FOKUS, Germany Jens-Matthias Bohli, NEC Laboratories Europe, Germany David Boyle, Imperial College London, UK Chun Tung Chou, UNSW, Australia Peter Davis, Telecognix Corporation, Japan Marc Emmelmann, Fraunhofer FOKUS, Germany Sonia Heemstra de Groot, Eindhoven Technical University, Netherlands Mitsuru Iwaoka, Yokogawa Electric Corporation Klaus Moessner, University of Surrey, UK Parag Mogre, Siemens AG, Germany Venkatesh Prasad, Delft University of Technology, Netherlands Vijay Sathyanarayana Rao, Delft University of Technology, Netherlands Dola Saha, NEC Labs America, USA Ryoichi Shinkuma, Kyoto University, Japan Mineo Takai, UCLA, USA Zhixian Yan, Samsung Research America, USA
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