-------- Ursprüngliche Nachricht -------- Von: Wenjia Li wli20@NYIT.EDU Gesendet: 21. November 2018 06:47:43 MEZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] CFP: IEEE MobiSec 2019 (co-located with IEEE INFOCOM 2019), Paris, France, April 2019 (Submission due: 12/30/2018)
Dear Colleagues,
Sorry if you receive this message multiple times. We really appreciate if you would consider submitting your work to IEEE MobiSec 2019, which will be co-located with IEEE INFOCOM 2019 at Paris, France in April 2019.
The submission due date is December 30, 2018.
If you have any question regarding it please contact the workshop chairs. Thank you.
Sincerely Yours,
Wenjia Li, Ph.D. Workshop co-chair, IEEE MobiSec 2019 Assistant Professor, Computer Science New York Institute of Technology New York, NY, USA
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ The Third IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2019) co-located with IEEE INFOCOM 2019 Paris, France April 29, 2019 https://bit.ly/2DzADBA +++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
Call for Papers
To many people, smartphones have been an indispensable part of daily life and work. With personal financial and medical information and job related data being processed on smartphones and related mobile systems and networks, it is critically important that the development and advancement of secure mobile operating systems, secure mobile applications, secure smartphone devices and cellular networks keep up with the ever-growing smartphone usage. For this reason, this research area has been a very important sector in the network and telecommunication industry and a focus of funded research projects in many research institutes.
The scope of MobiSec 2019 encompasses the security, privacy, and digital forensics of mobile systems and networks, including but not limited to Android, iOS and Windows Mobile operating systems, smartphones and applications for these platforms and devices, as well as cellular networks.
Topics of interest include (but are not limited to) the following subject categories:
+ Android, iOS, and Windows Mobile security and privacy + Digital forensics on mobile operating systems, applications and smartphones + Secure mobile application development + Smartphone device/hardware security + Mobile application security and digital forensics + Mobile user authentication and authorization + Multi‐factor mobile authentication + Mobile user privacy + Mobile vulnerability detection and remediation + Intrusion detection and recovery on mobile OS, applications, smartphones, and cellular networks + Social network security and privacy + Secure cloud for mobile environment + Mobile device management + 4G and 5G security
SUBMISSION INSTRUCTIONS
MobiSec 2019 only accepts original and unpublished papers with no longer than 6 pages. The reviews will be single blind: authors name and affiliation should be included in the submission. The manuscripts should be formatted in standard IEEE camera-ready format (double column, 10 pt font) and be submitted as PDF files (formatted for 8.5x11 inch paper). Prospective authors should submit their papers though EDAS. The accepted and presented papers will be published in the IEEE INFOCOM 2019 workshop proceedings and appear in IEEE Xplore.
Journal Special Issues (MORE TO BE ANNOUNCED SOON)
Extended version of high quality accepted papers will be recommended to the following journal(s) for publication.
# Special Issue “Mobile Networks and Management” with ACM/Springer Mobile Networks & Applications (MONET), ISSN: 1383‐469X (print version), ISSN: 1572‐8153 (electronic version), editors: Yun Lin et al.
# Special issue “Mobile Security, Privacy and Forensics toward a Smart City” with the International Journal of Performability Engineering, ISSN: 0973‐1318, editors: Yun Lin, Lei Chen, et al.
Important Dates and Location
Paper Due: December 30, 2018 Author Notification: February 22, 2019 Camera-ready Due: March 10, 2019
Workshop Chairs
Lei Chen (Georgia Southern University, USA)
Mauro Conti (University of Padua, Italy)
Yun Lin (Harbin Engineering University, China)
Peter Mueller (IBM Zurich Research Laboratory, Switzerland,)
Wenjia Li (New York Institute of Technology, USA)
Danda Rawat (Howard University, USA)
Nhien‐An Le Khac (University College Dublin, Ireland)
Publication Chair
Narasimha Shashidhar (Sam Houston State University, USA)
Publicity Chair
Weitian Tong (Georgia Southern University, USA)
Web Chair
Weinan Gao (Georgia Southern University, USA)
Technical Program Committee Members
* Nirwan Ansari (New Jersey Institute of Technology, USA) * Konstantin (Kosta) Beznosov (University of British Columbia, Canada) * Md Zakirul Alam Bhuiyan (Fordham University, USA) * Marina Blanton (University of Notre Dame, USA) * Nikita Borisov (University of Illinois at Urbana‐Champaign, USA) * Xiaojiang Du (Temple University, USA) * Venkatesan Ekambaram (Qualcomm, USA) * Michael Franz (University of California, Irvine, USA) * Xingwen Fu (University of Massachusetts Lowell, USA) * Feng Hong (Ocean University of China, China) * Yupeng Hu (Hunan University, China) * Shweta Jain (City University of New York, USA) * Brent Kang (Korea Advanced Institute of Science and Technology (KAIST), Korea) * Vimal Kumar (The University of Waikato, New Zealand) * Andrea Lanzi (University of Milan, Italy) * Jaime Lloret Mauri (Polytechnic University of Valencia, Spain) * Joel Rodrigues (University of Beira Interior, Portugal) * Sachin Shetty (Tennessee State University, USA) * Houbing Song (West Virginia University, USA) * Chiu C. Tan (Temple University, USA) * Mohit Tiwari (University of Texas at Austin, USA) * Shucheng Yu, Stevens Institute of Technology, USA
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