-------- Weitergeleitete Nachricht -------- Betreff: Submit a Paper for IEEE WCNC 2023 (Glasgow, Scotland // 26-29 March) Datum: Thu, 21 Jul 2022 15:01:04 -0500 (CDT) Von: IEEE Communications Society ieee@deliver.ieee.org Antwort an: no-reply@deliver.ieee.org An: wolf@ibr.cs.tu-bs.de
IEEE Master email Call for Papers: 2023 IEEE Wireless Communications and Networking To view this email as a web page, click here https://connect.ieee.org/v/NzU2LUdQSC04OTkAAAGFwVInYm6DRJi1j0LjrakT4RqoeTgx3PK7uh3J62oj_s6_yM9oEVSjroTKWGj7tp1VoxppUWs=
IEEE WCNC 2023 https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYt6wrnSXjI8XDjMCHd_lVDRm_wxoGcq9I7U-N8j_M_vhuTpox3g2Gz3Qe-fdsT4t4ik=
The 2023 IEEE Wireless Communications and Networking Conference (WCNC 2023) https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYt6wrnSXjI8XDjMCHd_lVDRm_wxoGcq9I7U-N8j_M_vhuTpox3g2Gz3Qe-fdsT4t4ik=, an IEEE premier annual event in the wireless research arena, bringing together researchers, academics, and industry professionals from all over the world. WCNC 2023 will take place from 26–29 March 2023 // Glasgow, Scotland.
*Call for Papers*
WCNC 2023 will include technical sessions, tutorials, workshops, and technology and business panels. You are invited to submit papers, and proposals for panels, tutorials, and workshops, in all areas of wireless communications, networks, services, and applications. Information on how to submit proposals for panels, tutorials, and workshops can be found on the WCNC 2023 conference website. Submissions of technical papers should be made via EDAS in the following four tracks.
Track 1. Physical Layer and Communication Theory Track 2. Networking and Mac Track 3. Machine Learning and Optimization for Wireless Systems Track 4. Emerging Technologies, Standards, and Applications
Submission Deadline: 12 September 2022 /**/ /**/
Submit a Paper https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYt6wrnSXjI8XDjMCHd_lVDRm_wxoGcq9I7U-N8j_M_vhuTpox3g2Gz3Qe-fdsT4t4ik=
If you have an IEEE Account, manage your IEEE communications preferences here https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYoXbSfIuyJ7QHm6YhU5owd29j-8tPEwnT7f4F66s4xxqU5lSTFk0YbmBZIiX0nc3VuA=. Users without an IEEE Account can access the Privacy Portal https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYuwC3hAE8RzbKOBr7oLSLU6wLI5SHFoEddYixeUs1CtpKcEfSKDWdjZ01UOVKLPAGXE= to view selected preferences and policies.
© 2022 IEEE– All rights reserved.
Website https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYrHio2eg8VAFDwD_H_dtKLU0os2ldgzVu6kKEM2upS6H6iataSCq4DFFST9qZSHBhGE= | Privacy Policy https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYs3eJgaRD0jHt6Deynv1NAcxvSON7Fo9DIu0G2CXUzela3bjU8ZPBs9djjIi_EloS9o= | Contact https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYu_uftzUHTxpW7yRpIcJEcytBsJdACHglfDlvwpX5alv9QPuglGHjO_haHAfteazzbQ= | Unsubscribe https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYk7iHSLmORs9D78l49U56Oe82_E43FUVgtLc15AKs13fhEM4PmqUPnT4IHNcdwpZcQQ=
https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYr_LUm1-P68U2KjYnru4FEGCg5rjhGpthSN88cykdTXIeTmo8fl4PacIuaJyUllP6kE= https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYpGrbZmCVRIiRsxDaUaefMVhatxPpMOuttLTi5lqw5ZYNsMlk5MO2qTt4rTo9nBPx4w= https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYm_9dX83Ipe7CWilf6i6aB9nF1mwQFu7YSJclZHMpaLv1CVUMaGujX-5PcJHjb6_pSo= https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYsJyYRmP3jC54qW9dGTJFg6Itt7ZyKGDv7gddn2szQ8rPNhfiUn3aXoiJKV2I1vn45A= https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYoSip_uY1KMU6d9O9FrICUyfpAIDht7Hx_4bfBBGDzn9E7ZVzRvjUWEYXP7cVCCwFLQ= https://connect.ieee.org/NzU2LUdQSC04OTkAAAGFwVInYvuJKZcCgfqu1FfnuSIY8yOPV6MpNB5DPmBuBQ6FILCQL3tRkPwI1oN4T-0j4YOWMFU=