-------- Original-Nachricht -------- Betreff: [Tccc] CFP: The 3rd IEEE Workshop on Automotive Networking and Applications Datum: Tue, 10 Jun 2008 10:28:36 -0400 (EDT) Von: Ratul Guha rguha@research.telcordia.com An: tccc@lists.cs.columbia.edu

APOLOGIES FOR MULTIPLE COPIES

Call for Papers

The 3rd IEEE Workshop on Automotive Networking and Applications

(AutoNet 2008)

Co-located with IEEE GLOBECOM 2008

December 4, 2008 (Thursday) New Orleans, LA, USA

Coupled with advances in wireless communications and computing technologies, there have been significant recent efforts to enhance and integrate the communications and computing technologies into the vehicle and transportation systems to enhance vehicle safety, reduce traffic congestion, and protect environment. Significant industrial and governmental efforts are underway to push for vehicle-to-vehicle / vehicle-to-infrastructure networking functions in vehicles and highway infrastructure. When such communications and networking capabilities are integrated into vehicles and the infrastructure, not only safety but many other emerging applications can be supported for intelligent interactions with the transportation system, with other vehicles, and inside vehicles, to help with traffic management, vehicle diagnostics, mobile commerce, and much more.

This one-day workshop intends to bring together researchers, professionals, and practitioners to discuss and address recent developments and challenges in deploying vehicle-to-vehicle / vehicle-to-infrastructure networking technologies and their applications.

Specifically, we solicit original research contributions addressing the following areas:

* Vehicle-to-vehicle (V2V) communications

* Vehicle-to-infrastructure (V2I) communications

* Vehicular ad hoc networks

* Potential applications of V2V and V2I communications including ITS

* Protocols for V2V and V2I communications (MAC, routing, mobility management, etc.)

* Security and privacy issues in V2V and V2I networks

* Physical layer and RF level technologies for V2V and V2I communications

* Antenna technologies for V2V and V2I communications

* Radio resource management and QoS support for V2V and V2I communications

* Information networking over V2V, V2R and next-generation networks

* Simulation / performance evaluation techniques for V2V and V2I communications

* Algorithms, protocols and systems for data dissemination in V2V and V2I communications

* Experimental systems and testbeds for V2V and V2I communications

* Standardization updates on V2V and V2I communications

All submitted papers will be peer-reviewed. Accepted papers will appear in the Workshop proceedings (CD-ROM and booklet of papers) as well as on the IEEE Xplore.

Workshop URLs: http://www.ieee-globecom.org/ (workshops) or

http://autonet2008.research.telcordia.com/

EDAS URL: http://edas.info/newPaper.php?c=5783&track=4681

Submission Instructions Authors are invited to submit full papers of up to 20 double-spaced pages, including references, figures and tables. All submissions should be submitted electronically in Postscript or Adobe PDF format on EDAS http://edas.info/newPaper.php?c=5783&track=4681

Please direct questions regarding the submission procedure to:

Wai Chen (wchen@research.telcordia.com)

Onur Altintas (onur@jp.toyota-itc.com)

Important Dates:

Paper Submission Deadline:

September 1, 2008

Notification of Acceptance: October 1, 2008

Camera-Ready Submissions: October 15, 2008

Workshop Co-chairs Dr. Wai Chen, Telcordia Technologies, USA Dr. Onur Altintas, Toyota InfoTechnology Center, Japan

Program Advisor Prof. Tadao Saito Professor Emeritus, University of Tokyo, Japan

CTO, Toyota InfoTechnology Center, Japan

Technical Program Committee

Subir Biswas

Michigan State University, USA

Fan Bai

GM R&D Center, USA

Luca Delgrossi

Mercedes-Benz Research Lab, USA

Eylem Ekici

Ohio State University, USA

Andreas Festag

NEC Lab, Germany

Marco Gruteser

WINLAB, Rutgers University, USA

Ratul Guha

Telcordia Technologies, USA

Jerome Harri

University of Karlsruhe, Germany

Teruo Higashino

Osaka University, Japan

Hariharan Krishnan

GM R&D Center, USA

Tim Leinmuller

Denso Automotive Deutschland GmbH, Germany

Thomas Luckenbach

FOKUS, Germany

Michela Meo

Politecnico di Torino, Italy

Rahul Mangharam

University of Pennsylvania, USA

Nick Maxemchuk

Columbia University, USA

Guevara Noubir

Northeastern University, USA

Umit Ozguner

Ohio State University, USA

Ai-Chun Pang

National Taiwan University, Taiwan

Chirag Patel

Qualcomm, USA

Panagiotis Papadimitratos

EPFL, Switzerland

Daniel Stancil

Carnegie Mellon University, USA

Chien-Chung Shen

University of Delaware, USA

Marcus Strassberger

BMW Group, Germany

Kazunori Takeuchi

KDDI R&D Lab, Japan

Kemal Tepe

University of Windsor, Canada

Christian Wewetzer

Volkswagen Group, Germany

Benjamin Weyl

BMW Group, Germany

Richard Wolff

Montana State University, USA

Daniel Wong

Malaysia University of Science and Technology, Malaysia

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