-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call for Submission: MobiCom 2018 Mobile App Competition Datum: Wed, 22 Aug 2018 19:10:32 +0530 Von: Vinayak Naik naik@IIITD.AC.IN Antwort an: Vinayak Naik naik@IIITD.AC.IN An: tccc-announce@COMSOC.ORG

MobiCom 2018 is pleased to organize the 6th Mobile App Competition in conjunction with the main conference. The competition is for novel and innovative mobile applications utilizing any computing architecture (stand-alone, client/server, client/proxy/server, peer-to-peer/ad-hoc, cloud/mobile, others). Applications can be developed for, but not limited to, Android, iOS, Windows Phone, Blackberry OS 10 and HTML5.

To participate in the competition, you are required to submit a one-page proposal, a video demo, and your fully-functional app binary for evaluation. A selected set of finalists will advance to enter the last phase, presenting at the MobiCom 2018 conference to a panel of esteemed academic and industry researchers.

The top three apps will be promoted on the MobiCom website and will receive a prize during the conference. More details about the requirements and evaluation criteria are available at https://www.sigmobile.org/mobi com/2018/app.php.

About MobiCom ACM MobiCom 2018, the Annual International Conference on Mobile Computing and Networking, is a highly selective, premier international forum addressing networks, systems, algorithms, and applications that support mobile computers and wireless networks. MobiCom has historically been well attended by high-profile academic and industry researchers from all over the world.

Dates Sept. 3: App proposal submission window opens Sept. 17: App proposal submission window closes Sept. 24: Finalists notified of selection Oct. 29th - Nov 2: Finalists present in front of MobiCom App Panel in New Delhi, India

For questions, email Dr. Sayandeep Sen at sayandes@in.ibm.com and Dr. Robert LiKamWa at likamwa@asu.edu

Best,

Publicity Co-Chairs Vinayak Naik (IIIT Delhi, India) He Wang (Purdue University, USA) Kirill Kogan (IMDEA Networks, Spain) Wen Hu (UNSW, Australia) Binbin Chen (ADSC, Singapore)

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