-------- Original-Nachricht -------- Betreff: [Tccc] CFP:The 6th International Conference on Mobile Ad-hoc and Sensor Networks (MSN'10) Datum: Tue, 20 Apr 2010 23:41:58 +0800 Von: Jiming Chen jmchen@ieee.org An: tccc@lists.cs.columbia.edu

CALL FOR PAPERS

The 6th International Conference on Mobile Ad-hoc and Sensor Networks (MSN'10) December 20-22, 2010 Huagang HNA Resort, Hangzhou, China http://guide.hdu.edu.cn/msn10

MSN 2010 provides a forum for researchers and practitioners to exchange research results and share development experiences in the field of mobile ad hoc and sensor networks. Topics of interest include, but are not limited to, the following:

- Multi-hop wireless networks and wireless mesh networks - Sensor, actuator and cyber-physical networks - Wireless personal/body area networks - Vehicular networks - System model and performance analysis - Data and information management in mobile ad hoc and sensor networks - Network mobility, self-organization, and synchronization - Routing, network protocols, and transport protocols - Energy efficiency - Network planning, provisioning, deployment, and quality of service - Security, privacy, and fault tolerance

SUBMISSION GUIDELINES

All submissions must be full papers in PDF format and uploaded on EDAS. They must not exceed 8 single-spaced, double-column pages using 10 pt size fonts on 8.5 x 11 inch pages in IEEE style format. Please find the specific submission guidlines at the conference website ( http://guide.hdu.edu.cn/msn10).

At least one author of each accepted paper is required to register for the conference at the regular rate and present the accepted paper.

A conference proceedings including all the accepted and appropriately registered/presented papers will be published by IEEE. Selected papers will be published in the special issues of journals.

IMPORTANT DATES

Paper submission: July 9, 2010 Acceptance notification: September 10, 2010 Camera ready due: October 8, 2010 Conference: December 20--22, 2010

ORGANIZING COMMITTEE

Steering Committee: Jiannong Cao, Hong Kong Polytechnic University, China Xiaohua Jia, City University of Hong Kong, China Peng-Jun Wan, Illinois Institute of Technology, USA

Honorary General Chair: Youxian Sun, Zhejiang University and member of Chinese Academy of Engineering

General Co-Chairs: Sajal Das, NSF and University of Texas at Arlington, USA Anke Xue, President of Hangzhou Dianzi University, China

TPC Co-Chairs: Nageswara Rao, Oak Ridge National Laboratory, USA David Yau, Purdue University, USA

TPC Vice Chairs: Minming Li, City University of Hong Kong, China Xin Wang, Stony Brook University, USA

Local Organization Chair: Guojun Dai, Hangzhou Dianzi University, China

Workshop Chair: Xiang-Yang Li, Illinois Institute of Technology, USA

Publicity Co-Chairs: Jiming Chen, Zhejiang University, China Mario Di Francesco, University of Texas at Arlington, USA

Web Chair: Xingfa Shen, Hangzhou Dianzi University, China

TPC members: Please see http://guide.hdu.edu.cn/msn10. _______________________________________________ Tccc mailing list Tccc@lists.cs.columbia.edu https://lists.cs.columbia.edu/cucslists/listinfo/tccc