-------- Weitergeleitete Nachricht -------- Betreff: GlobeCom 2023 [Firm Deadline] Datum: Sun, 7 May 2023 13:13:42 +0000 Von: Ranga Rao Venkatesha Prasad - EWI 0000018e8c53103c-dmarc-request@COMSOC-LISTSERV.IEEE.ORG An: tccc-announce@COMSOC.ORG tccc-announce@COMSOC.ORG, TCGCC@COMSOC.ORG TCGCC@COMSOC.ORG, tccn@COMSOC.ORG tccn@COMSOC.ORG, csim@comsoc.org csim@comsoc.org, tciin@comsoc.org tciin@comsoc.org, TactileInternet@comsoc.org TactileInternet@comsoc.org, ierc@internet-of-things-research.eu ierc@internet-of-things-research.eu

*Globecom is a premier IEEE ComSoc conference: https://globecom2023.ieee-globecom.org https://globecom2023.ieee-globecom.org*

*Due to many requests we have extended the deadline.*

**

*Symposium Paper Submission: *6 May 2023*21 May 2023 (Sunday)

*

To aubmit your papers Please go to: https://globecom2023.ieee-globecom.org/authors/call-symposium-papers https://globecom2023.ieee-globecom.org/authors/call-symposium-papers

With best regards,

vp

Dr. R Venkatesha Prasad

_https://www.st.ewi.tudelft.nl/rvprasad https://www.st.ewi.tudelft.nl/rvprasad_

To Call on Skype use: https://join.skype.com/invite/k6t9ndVmY2Rf https://join.skype.com/invite/k6t9ndVmY2Rf

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