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Call for Papers

Special issue on Wireless Ad Hoc, Sensor and Mesh Networks, Telecommunication Systems journal, Springer, US

http://www.springer.com/cda/content/document/cda_downloaddocument/ CFP_11235_20080206.pdf

The last few years have experienced a steep growth in research in the area of infrastructure-less networks such as wireless ad hoc, sensor and mesh networks. Even though these networks hold great promises for our future, there are several challenges that need to be addressed. This special issue aims to publish high quality research papers relating to different experimental, simulation, algorithmic and theoretical aspects of mobile ad hoc networks, sensor networks, mesh networks, and other related areas. Manuscripts relating to these issues will be invited from researchers working in these areas worldwide. Topics of primary interest include, but not limited to, the following issues in ad hoc, sensor and mesh networks:

• Addressing and location management • Power-awareness and energy-efficiency • Routing and traffic engineering • Quality of service • Resource allocation • Self-configuring and self-healing schemes • Mobility management • Fault tolerance • Cross-layer interactions • Error control • Media access control • Security and privacy

Guest Editor: Isaac Woungang Department of Computer Science Ryerson University, Toronto Ontario, Canada. E-mail: iwoungan@scs.ryerson.ca

Submission Details: Original, high quality contributions that are not yet published or that are not currently under review by other journals or peer-reviewed conferences are sought. Manuscripts should be submitted by e-mail to iwoungan@scs.ryerson.ca. Please mention “Telecommunication Systems Special Issue Submission” in the subject line of your e-mail. After sending your manuscript, if you do not get a confirmation of receipt of your submission within 2-3 business days, please resend your original e-mail. A guide for authors for preparing their papers can be accessed through http://www.springerlink.com/content/101753/

Important Dates: Manuscript Due: September 1, 2008 Acceptance Notification: December 1, 2008 Camera-Ready Final Manuscript Due: January 1, 2009

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