-------- Original Message -------- Subject: [Tccc] CFP: Cross Layer Design for Communications and Signal Processing Systems Date: Mon, 02 Jun 2003 13:48:55 -0400 From: haitao zheng haitaoz@lucent.com Organization: Lucent Technologies To: TCCC tccc@cs.columbia.edu

We apologize if you receive multiple copies of this email. ------------------------------------------------------------- Call for Papers

EURASIP JOURNAL ON APPLIED SIGNAL PROCESSING Special Issue on

Cross Layer Design for Communications and Signal Processing Systems

An important aspect of wireless networks is dynamic behavior. The conventional protocol structure is inflexible as various protocol layers can only communicate in a strict manner. In such a case, the layers are designed to operate under the worst conditions, rather than adapting to changing conditions. This leads to inefficient use of spectrum and energy.

Adaptation represents the ability of network protocols and applications to observe and respond to the channel variation. Central to adaptation is the concept of cross layer design. In general, cross layer design involves four key layers in the overall protocol stack (i.e., application-layer, transport-layer, network-layer and link-layer). The application can adjust its behavior, e.g., its flow rate or the amount of overhead devoted to error resilience, according to the changing network and channel conditions. The adaptation can also take place in the underlying layers such as TCP and UDP, so that the application originally developed for different networks remain unchanged. Information derived from the application, such as its QoS requirements and the priorities of the packets it produces, could be used in coordinating the behavior of the lower layers for resource efficiency. For example, the persistence level of the link layer ARQ mechanism should be varied according to each application's latency and reliability requirements, as well as the traffic load. Another essential factor to adaptation is each layer's ability to estimate the current and even predict the future network and channel conditions and exchange the information across different layers.

This special issue will be devoted to the latest developments in the field of cross layer design, where the emphasis is on interactions among different network layers, so as to improve the performance of communication and signal processing systems. We seek original, previously unpublished, and completed contributions, not currently under review by another journal. Contributions emphasizing recent progress and new research directions are strongly encouraged. Papers are invited from, but not limited to, the following topics:

* Architectures and methodologies for cross layer design in wireless and wireline communications * Energy efficiency in wireless ad hoc networks * Dynamic resource allocation and Quality of Service * Scheduling Algorithms and Link Adaptation * Signal Processing and Medium Access Control * Channel Adaptive Routing Protocols * Interaction between TCP, UDP and RLP layers * Channel-aware applications * Joint source and channel design in wireless multimedia communications * Signaling design for cross layer interaction

Submission Procedure:

Authors should follow the EURASIP JASP manuscript format described at the Journal website http://asp.hindawi.com/. Prospective authors should submit an electronic copy of the complete manuscript through the EURASIP's web submission system at http://asp.hindawi.com/, according to the following timeline:

Manuscript Due: July 31, 2003 Acceptance Notification: February 28, 2004 Final Manuscript due: April 30, 2004 Publication date: 4th Quarter, 2004.

Guest Editors (in alphabetical order)

Prof. Antonio Ortega Dept of EE USC Los Angeles, CA 90036 ortega@sipi.usc.edu

Prof. Lang Tong School of ECE Cornell Univ. Ithaca, NY 14853 ltong@ece.cornell.edu

Dr. Haitao Zheng Bell Laboratory Lucent Technologies Holmdel, NJ 07733 haitaoz@lucent.com

Prof. Michele Zorzi Dipartimento di Ingegneria Universita'di Ferrara Ferrara, Italy mzorzi@ing.unife.it

Editorial Board Representative: Prof. Bastiaan Kleijn, Royal Institute of Technology, Sweden _______________________________________________ Tccc mailing list Tccc@cs.columbia.edu http://lists.cs.columbia.edu/mailman/listinfo/tccc