-------- Original Message -------- Subject: [Tccc] Hot Interconnects - 2003 Call for Papers Date: Tue, 11 Mar 2003 23:44:55 -0600 From: John Lockwood lockwood@arl.wustl.edu To: tccc@cs.columbia.edu CC: John Lockwood lockwood@chewbacca.arl.wustl.edu

HOT INTERCONNECTS

The Symposium on High Performance Interconnects will be held at Stanford University in Palo Alto, CA on August 20-22, 2003. We solicit your contribution.

CALL FOR PAPERS

Hot Interconnects is an international symposium focusing on the hardware and software architecture and implementation of high-performance interconnects of all scales. Its themes include cross-cutting issues spanning computer systems and networking technologies for providing universal services over packet networks. Examples of relevant topics include network-attached storage, transport of voice and video over packet networks, high-performance network interfaces, novel switching and routing technologies capable of providing differentiated services, plug-and-play network interfaces, and active network architectures. The conference is directed particularly at new and exciting product and technology innovations in these areas. Contributions should focus on real products, prototypes, or experimental systems and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited on the following topics:

* Gb/sec and Tb/sec switching and routing technologies * High-speed packet processing engines * Network security technologies * Protocol processing hardware * Network appliance technologies * Cluster computing * Technologies for video and voice over packets * xDSL, HFC, and wireless access technologies * Wireless and mobile devices * Software Interconnects * Low-power networking * Optical Interconnects

SUBMISSION GUIDELINE

Submissions consists of a title, paper (five pages, double-column format), and contact information. The paper should have sufficient technical detail to judge its quality and suitability for presentation at the conference. Papers should be electronically submitted via the link found on the on-line Call For Papers page: http://www.gradebot.com/hoti/HotI-CFP.html

Papers selected for the conference will be published as proceedings by the IEEE Computer Society. Further, a select subset of the papers will be published in a special issue of the IEEE Micro Magazine.

Presentations at Hot Interconnects are in the form of 30-minute talks. The conference is single-track with an attendance of several hundred. The program from last year is available on-line at * http://www.hoti.org/index_10.html * http://www.hoti.org/archive/hoti10/program/

IMPORTANT DATES

Submission deadline: April 2, 2003

ORGANIZING COMMITTEE

* General Chair - John Lockwood

* Program Chair - Bryan Lyles

* Tutorial Chair - James Sterbenz

* Steering Committee: - Daniel Pitt - Mark Laubach - Allen J. Baum, - Hasan Alkhatib - Paul Borrill - Glenn Langdon

* Program Committee - Francois Abel, IBM Zurich Research Lab - Adnan Aziz, University of Texas - Andrew T. Campbell, Columbia University - Hans Eberle, Sun Microsystems - Dr. Mounir Hamdi, Hong Kong University - Ken Calvert, University of Kentucky - John Lockwood, Washington University - Shubu Mukherjee, Intel Corporation - Rong Pan, Stanford University - Li-Shiuan Peh, Princeton University - Fabrizio Petrini, Los Alamos National Laboratories - James P.G. Sterbenz, BBN - Dimitrios Stiliadis, Bell Labs Research - Ion Stoica, University of California, Berkeley - Anujan Varma, University of California, Santa Cruz - Marcel Waldvogel , IBM Zurich Research Laboratory - Ben Yoo, University of California, Davis - Zhi-Li Zhang, University of Minnesota

* Local & Web Chair - Liz Rogers

IMPORTANT LINKS

* The conference homepage: http://www.hoti.org/

* Call for Papers http://www.gradebot.com/hoti/HotI-CFP.html