-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [Call for Papers] EWSN 2019 Datum: Fri, 3 Aug 2018 12:29:50 +0900 Von: JeongGil (John) Ko jeonggil.ko@GMAIL.COM Antwort an: JeongGil (John) Ko jeonggil.ko@GMAIL.COM An: tccc-announce@COMSOC.ORG

<Call for Papers: EWSN 2019>

The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. Building on 15 years of successful EWSN conferences, the 16th edition marks a significant change: for the first time, EWSN will go outside Europe, and be held in Beijing, China. The conference aims at a broader impact world-wide, while maintaining its role as a premier conference originated from Europe.

The conference solicits both full technical papers and short papers describing validated early ideas. Specific topics of interest include but are not limited to: - Communication and networking for wireless and embedded systems - Sensing, actuation, and control - Operating systems, middleware, and services - Processing, storage, and management of data - Programming paradigms, languages, and tools - Emerging computing platforms, e.g., drones and robots - Time and location management - Dependability (real-time, reliability, availability, safety) - Sustainability (low-power operation, energy management, energy harvesting) - Privacy and security in applications and systems - Human-machine interaction with wireless and embedded systems - Design and implementation of real-world applications and systems - Measurement studies and deployment experiences

Contributions that reflect emerging technologies and applications related to industrial IoT are particularly welcome.

The conference proceedings will appear in the ACM Digital Library. Selected accepted papers will be fast-tracked to ACM Transactions on Sensor Networks (TOSN) or ACM Transactions on the Internet of Things (TIOT).

Submission Instructions Submissions to EWSN 2019 must be original (i.e., not previously published) and not currently under review by any other conference or journal. EWSN 2019 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that author identities are not disclosed to reviewers. We will also offer authors a rebuttal phase before final decisions are made.

​Formatting requirements. Full paper submissions must have at most 12 pages. Short paper submissions must have at most 6 pages. Pages must have 8.5" x 11" (letter) two-column format, using 10-point type on 11-point leading, with a maximum text block of 7" wide x 9" deep with an inter-column spacing of .25". The page limits include figures, tables, and references. Authors may use the LaTex templates provided here.

Submission Site. Paper submission is managed through HotCRP at the following site: http://hotcrp.disi.unitn.it/ewsn2019/

Important Dates Paper registration: 23:59:59 pm.(AOE), September 7, 2018 Paper submission: 23:59:59 pm.(AOE), September 14, 2018 Authors rebuttal deadline: November 16, 2018 Notification: December 1, 2018

Organisation Committee

General Co-Chairs Yunhao Liu, Tsinghua University (China) Guoliang Xing, The Chinese University of Hong Kong (China)

TPC Co-Chairs Yuan He , Tsinghua University (China) Gian Pietro Picco, University of Trento (Italy)

Workshop Co-Chairs Mo Li, Nanyang Technological University (Singapore) Marco Zimmerling, Technische Universität Dresden (Germany)

Poster Co-Chairs Simon Duquennoy, RISE SICS (Sweden) Rui Tan, Nanyang Technological University (Singapore)

Demo Co-Chairs Zhichao Cao, Tsinghua University (China) Hongkai Wen, University of Warwick (UK)

Competition Chair Carlo Alberto Boano, Graz University of Technology (Austria)

Phd Colloquium Co-Chairs Lothar Thiele, Swiss Federal Institute of Technology Zurich (Switzerland) Thiemo Voigt, Uppsala University and RISE SICS (Sweden)

Industry Liaison Chair Xiaohua Tian, Shanghai Jiao Tong University (China)

Local Arrangement Co-Chairs Fan Li, Beijing Institute of Technology (China) Liang Liu, Beijing University Of Posts And Telecommunications (China) Jiliang Wang, Tsinghua University (China)

Registration Chair Kele Shen, Tsinghua University (China)

Publicity Co-Chairs Octav Chipara, University of Iowa (USA) JeongGil Ko, Ajou University (Korea) Olga Saukh, Graz University of Technology (Austria) Fu Xiao, Nanjing University of Posts and Telecommunications (China)

Publication Co-Chairs Bernd-Christian Renner, Hamburg University of Technology (Germany) Yuanqing Zheng, Hong Kong Polytechnic University (HK)

Web Chair Xipeng Ma, Tsinghua University (China)

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