-------- Original-Nachricht -------- Betreff: [TCCC-ANNOUNCE] IEEE LANMAN 2014 Submission Site and CFP Update Datum: Tue, 21 Jan 2014 14:18:32 +0800 Von: Fangming Liu fangminghk@GMAIL.COM Antwort an: Fangming Liu fangminghk@GMAIL.COM An: tccc-announce@COMSOC.ORG

*Call for Papers*

IEEE LANMAN 2014 will be held on May 21-23, 2014 at the University of Nevada, Reno campus in Reno, Nevada. IEEE LANMAN has an established tradition as a forum for presenting and discussing the latest technical advances in local and metropolitan area networking. Continuing that tradition, IEEE LANMAN 2014 invites cutting-edge papers spanning both theory and experimentation. Papers are solicited in all areas of networking, but in keeping with the current research trend, this workshop’s central theme is *data center networking*. The intimate single-track session format of the workshop encourages stimulating exchanges between researchers. The workshop is expected to be a forum for discussion of new and interdisciplinary ideas on architectures, service models, pricing, and performance. Speculative and potentially transformative ideas are particularly encouraged, as are studies reporting measurements from real-life networks and testbeds. Papers are solicited on any LANMAN topic including, but not limited to, the following:

- Novel data center network architectures - Data center network virtualization - Energy-efficiency in data centers - Routing and transport protocols in data center networks - Software defined data center networks - Data center network pricing - Resource allocation in data center networks - Performance measurement and modeling of data centers - Inter-data center network issues - Reliable data center networks - Broadband wireless access, including WiMAX, LTE - WiFi: roaming services, architectures, and performance - Metropolitan and residential networks and architectures including Ethernet in the first mile, EPONs, FTTx, etc. - Network management related to edge networks - Heterogeneous wireless and ad-hoc networks - Local-area and metropolitan-area network security - LAN-based and MAN-based applications (gaming, distributed computing, media distribution to and in the home, enterprise applications, ambient technology, wearable-computing) - Impact of sensors everywhere including homes

IEEE LANMAN 2014 solicits paper submissions of Regular Papers (up to 6 pages) and Short Papers (up to 2 pages). The short papers will be presented in a poster session. Also, some of regular paper submissions may be accepted as short papers by the TPC. The page limits include all figures, tables, and references. All papers must be electronically submitted in PDF according to the guidelines in the workshop website http://www.ieee-lanman.org. The proceedings will be published by IEEE Xplore and will include both short and regular papers presented at the workshop. Best Paper Award will be given to the paper(s) with the highest technical merit. Selected papers will be invited for submission and fast track review by *IEEE Transactions on Cloud Computing* and *Elsevier Computer Communications Journal*. The paper submission site is https://www.easychair.org/conferences/?conf=lanman2014.

All IEEE LANMAN 2014 technical papers and posters must be associated with an author registration at the full rate. For authors presenting multiple papers/posters, one full registration is valid for up to three papers/posters. IEEE reserves the right to exclude a paper/poster from distribution after the workshop (e.g., removal from IEEE Xplore) if the paper/poster is not presented at the workshop.

Important dates: Abstract Registration: Feb 14, 2014, Friday Paper Submission: Feb 21, 2014, Friday Acceptance Notification: Mar 28, 2014, Friday Camera-ready Submission: Apr 18, 2014, Friday

Workshop Date: May 21-23, 2014

Committees

General Chairs

Rittwik Jana http://www.research.att.com/people/Jana_Rittwik, AT&T Labs Research, E-mail: rjana@research.att.com

Murat Yuksel http://www.cse.unr.edu/~yuksem/, University of Nevada, Reno, E-mail: yuksem@cse.unr.edu

TPC Chairs

Dan Lihttp://www.tsinghua.edu.cn/publish/csen/4623/2010/20101225163855518778544/20101225163855518778544_.html, Tsinghua University, E-mail: tolidan@tsinghua.edu.cn

Suresh Subramaniam http://www.seas.gwu.edu/~suresh, George Washington University, E-mail: suresh@gwu.edu

Local Coordination Chairs

Mehmet H. Gunes http://www.cse.unr.edu/~mgunes/, University of Nevada, Reno, E-mail: mgunes@cse.unr.edu

Shamik Sengupta http://www.cse.unr.edu/~shamik/, University of Nevada, Reno, E-mail: ssengupta@unr.edu

Publicity Chairs

Fangming Liu http://grid.hust.edu.cn/fmliu/, Huazhong University of Science and Technology, E-mail: fmliu@mail.hust.edu.cn

Eric Rozner, IBM Research, E-mail: erozner@gmail.com

Publications Chair

Tian Lan http://www.seas.gwu.edu/~tlan/, George Washington University, E-mail: tlan@gwu.edu

Web Chair

Hayreddin Ceker, University at Buffalo, E-mail: hayreddi@buffalo.edu

Steering Committee

Jack Brassil, HP Labs, Princeton, USA Maria Papadopouli, University of Crete, Crete, Greece K. K. Ramakrishnan, AT&T Labs Research, Florham Park, USA George Rouskas, North Carolina State University, Raleigh, USA Kobus Van der Merwe, AT&T Labs Research, Florham Park, USA

Technical Program Committee

Kemal Akkaya, Southern Illinois University Carbondale, USA Koike Arata, NTT, Japan Leo van Biesen, Vrije Universiteit Brussel, Belgium Jack Brassil, HP, USA Rajkumar Buyya, University of Melbourne, Australia Kai Chen, Hongkon University of Science and Technology, China Renato Lo Cigno, University of Trento, Italy Florin Ciucu, TU Berlin, Germany Reuven Cohen, Technion, Israel Virgil Dobrota, Technical University of Cluj-Napoca, Romania Jordi Domingo-Pascual, UPC, Spain Ashley Flavel, Microsoft, USA Xiaoming Fu, University of Goettingen, Germany Albert Greenberg, Microsoft, USA Deke Guo, National Univeristy of Defense Technology, China Dongsu Han, KAIST, Korea Yuan He, Tsinghua University, China Yuming Jiang, NUNT, Norway Tian Lan, GWU, USA Wei (Wilson) Li, University of Sydney, Australia Jun Li, University of Oregon, USA Fangming Liu, Huahzong University of Science and Technology, China Jiangchuan Liu, SFU, Canada Songwu Lu, UCLA, USA John C.S. Lui, CUHK, China Kobus Van der Merwe, University of Utah, USA Eytan Modiano, MIT, USA Maria Papdopouli, University of Crete, Greece Dan Pei, Tsinghua Univeristy, China Daniel Pitt, Open Network Foundation, USA Chunming Qiao, University of Buffalo, USA K.K. Ramakrishnan, AT&T, USA Byrav Ramamurthy, U. Nebraska-Lincoln, USA George Rouskas, North Carolina State University, USA Ashutosh Sabharwal, Rice University, USA Weisheng Si, University of Western Sydney, Australia Cormac Sreenan, University College Cork, Ireland Kris Steenhaut, Vrije Universiteit, Belgium Puneet Sharma, HP, USA

Javid Taheri, University of Sydney, Australia Jianping Wang, CUHK, China Tilman Wolf, UMASS, USA Kang Xi, Poly-U, USA Lisong Xu, University of Nebraska, Lincoln, USA

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