-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: Innovation Challenge Panel/Pitchfest Datum: Mon, 1 Feb 2016 16:27:56 -0500 Von: Shiwen Mao maoshiwen@HOTMAIL.COM Antwort an: Shiwen Mao maoshiwen@HOTMAIL.COM An: tccc-announce@COMSOC.ORG

IEEE INFOCOM 2016 at San Francisco will highlight Silicon Valley entrepreneurship energy by hosting its 1st innovation challenge panel/pitchfest. At this panel, innovators from both academia and industry will present their entrepreneurial ideas and compete for a significant cash prize that can seed further prototype development. The judges panelists include Tier-1 venture capitalists from Silicon Valley, industry veterans and top academicians.

We solicit original, business-worthy and technically groundbreaking ideas in the area of networking and communications for this panel. Submissions must describe the high-level vision, top value proposition to potential users, and technical merit of the idea in a 1-page paper. Submissions can, optionally, include a link to a 2-min video that can make a crisp pitch of the idea. Of the submitted proposals, we will shortlist 6 ideas for presentation at the panel in the form of a 10-minute pitch. The winner selected by the judges will receive a cash prize.

More details on the panelists and submission instructions are available at http://infocom2016.ieee-infocom.org/content/innovation-challenge

CO-CHAIRS Srini Seetharaman, Platform Architect at Infinera Anees Shaikh, Network Architect at Google

IMPORTANT DATES One-page idea description due by: 11:59pm (EST), Feb 28, 2016 (firm) Notification of acceptance: March 4, 2016 INFOCOM Panel: April 14, 2016

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