-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] COINS 2020 (IEEE CEDA) Datum: Thu, 12 Sep 2019 10:25:37 +0200 Von: Farshad Firouzi farshadfirouzi@GMAIL.COM Antwort an: Farshad Firouzi farshadfirouzi@GMAIL.COM An: tccc-announce@COMSOC.ORG

*COINS 2020: International Conference on Omni-Layer Intelligent Systems *

Barcelona, Spain| July 27-29, 2020

In collaboration with IEEE CEDA

Submission Deadline: March 06, 2020 https://coinsconf.com

COINS is the premier conference devoted to omni-layer techniques for smart IoT systems, by identifying new perspectives and highlighting impending research issues and challenges. COINS main topics include the following but are not limited to:

· Internet of Things: From Device to Edge, and Cloud

· Embedded Systems, and Computer Architecture

· Cloud Computing

· Big Data

· Distributed Ledger Technologies and Blockchain

· Artificial Intelligence, Machine Learning, and Advanced Analytics

· Artificial Intelligence Circuits and Systems

· Intelligent IoT eHealth

· Omni-Layer Security, Privacy, and Trust

Special tracks:

· Cyber-physical and embedded systems

· Critical System Design

· Face Recognition

*Important Date*

Submission Deadline: March 06, 2020 Acceptance Notification: May 06, 2020

Camera-Ready Submission: May 16, 2020

Contact the chairs at farshad.firouzi@duke.edu

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