-------- Weitergeleitete Nachricht -------- Betreff: CfP: 13th IEEE Int'l Symposium on Industrial Embedded Systems SIES 2018, Graz, Austria Datum: Sat, 13 Jan 2018 16:37:25 +0000 Von: Baunach, Marcel Carsten baunach@tugraz.at Antwort an: iti.announcement@mlist.tugraz.at An: wolf@ibr.cs.tu-bs.de

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IEEE SIES 2018 CALL FOR PAPERS

13th IEEE International Symposium on Industrial Embedded Systems            Featured Topic: ICT for a Dependable Internet of Things

June 6 - 8, 2018, Graz, Austria

URL: http://sies2018.tugraz.at/

Regular Paper submission deadline:    February 25, 2018 Acceptance notification:              April 4, 2018 Camera ready deadline:                May 4, 2018

WiP and Poster Submission Deadline:   April 13, 2018 Acceptance notification:              April 26, 2018 Camera ready deadline:                May 4, 2018 ================================================================================

The IEEE Symposium on Industrial Embedded Systems (SIES) is a highly selective single-track international conference focusing on premier research results for embedded systems - an area of highest relevance for visionary technologies such as the Internet of Things (IoT) and applications such as Industry 4.0, Smart Production, Smart Cities, Connected Cars, etc.

The featured topic of SIES 2018 is "ICT for a Dependable Internet of Things", where increasingly complex software and growing networks, application-specific hardware and systems on chips (SoC) will become more and more relevant for all related areas of industrial and consumer applications. In this regard, the IoT promises to be one of the most disruptive technologies with transformational impact on industry and society throughout the next decades. As a global super- infrastructure, the IoT is a key enabling technology for a multitude of application domains, including smart cities, smart cars, smart home, smart health, smart factories, smart buildings, etc. However, related applications and services are only feasible if the underlying systems do not fail and disastrous real-world impacts are avoided, making dependability one of the main design challenges.

The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments.

Topics of interest include, but are not limited to: - General Embedded Systems:   Dependability Aspects; Design and Validation; Operating Systems and   Middleware; Power Awareness; Adaptive and Compositional Systems. - System-on-Chip and Network-on-Chip: Design & Testing; Multiprocessor Design;   Design of Application-Specific CPU/MCU Architectures; Platform-Based Design;   Reconfigurable Platforms; Implementation and Testing of Integrated Circuits. - Networked Embedded Systems: Design, Dependability and Tooling; Middleware;   Network Protocols. - Embedded Applications: Cyber-Physical Systems and the Internet of Things;   Domain Specific Systems (e.g., Industrial Automation and Control, Intelligent   Transportation, Automotive, Avionics and Aerospace, Smart Home, Wireless   Health Care, Automation and Control).

PAPER SUBMISSION AND PUBLICATION ================================================================================ SIES 2018 is a highly selective conference. We will only accept original contributions that have not been previously published and are not currently under review by any other conference or journal. The conference solicits full papers, work-in-progress papers, and posters.

Submission implies the willingness of at least one author to attend SIES and present the paper. Accepted papers will be included in the proceedings of SIES 2018 and submitted to IEEE explore for publication.

Please visit the SIES website for further details.

CO-LOCATED EVENT ================================================================================ SIES 2018 will be co-located with the "2nd Symposium on Dependable Internet of Things" (5 June 2018), presenting project results, talks by international experts, and an exhibition on the TU Graz LEAD Project Dependable Internet of Things in Adverse Environments. Please visit the SIES website for further details.

ORGANIZING COMMITTEE ====================================================================== General Co-Chairs: - Marcel Baunach (TU Graz, Austria)  - Roman Obermaisser (University of Siegen, Germany)

Program Committee Co-Chairs: - Roberto Passerone (Univ of Trento, Italy)  - Stig Petersen (SINTEF, Norway)

WiP and Posters Co-Chairs: - Tobias Hoßfeld (University of Duisburg, Germany)  - Haibo Zeng (VirginiaTech, USA)

IEEE CEDA Representative  - Yao-Wen Chang (National Taiwan University, Taiwan)    SIES Series Steering Committee:    - R. Ernst (TU Braunschweig, Germany) - G. De Micheli (EPFL, Switzerland)  - R. Gupta (UC San Diego, USA)  - A. Sangiovanni-Vincentelli (UC Berkeley, USA)  - R. Zurawski (ISA Group, USA)   International Advisory Committee:    - J. J. Chen, Germany  - E. Dekneuvel, UNSA, France  - M. Di Natale, Scuola Superiore S. Anna, Italy  - L. Gomes, Uninova, Portugal  - T. Nolte, Mälardalen University, Sweden  - R. Obermaisser, University of Siegen, Germany  - R. Passerone, Univ. of Trento, Italy SIES - G. Sassatelli, LIRM, France  - J.-L. Scharbarg, INP-ENSEEIHT & IRIT, France  - E. Tovar, IPP, Portugal  - A. Vachoux, EPFL, Switzerland  - K. Zielinski, AGH UST, Poland

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