-------- Original-Nachricht -------- Betreff: [Tccc] CFP - International Workshop on Mobile Device and Urban Sensing Datum: Thu, 25 Oct 2007 18:36:35 -0400 Von: Yu Yang-a65018 Yang@motorola.com An: tccc@lists.cs.columbia.edu

[Apologies for possible multiple copies]

======================================================================================== CALL FOR PAPERS

MODUS 2008: INTERNATIONAL WORKSHOP ON MOBILE DEVICE AND URBAN SENSING

April 21, 2008 St. Louis, Missouri, USA http://www.motorola.com/content.jsp?globalObjectId=8623

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Co-located with: ================

* IEEE International Conference on Information Processing in Sensor Networks (IPSN '08) * IEEE Real Time and Embedded Technology and Application Symposium (RTAS '08) * International Conference on Hybrid Systems: Computation and Control (HSCC '08)

Scope: ======

This workshop intends to bring together researchers and practitioners from both academia and industry working in sensor networking and mobile computing to foster a discussion on the key research challenges and exploration of new business models around mobile device centric sensing and urban sensing.

The goal of the workshop is not only to promote the visibility of mobile device sensing and urban sensing research across the community, but also to provide insights into theoretical aspects as well as practical methods and tools, including key reusable technology components and platforms that can serve as a foundation for further research in this area.

Topics of interest include (but are not limited to): ====================================================

* Application development * Opportunistic sensing and networking * User activity inference * Interactions with mobile device applications * Human-Machine Interface * Context-awareness * Mobility modeling and management * Platform and Operating System support * Software architecture and networking protocols * Middleware infrastructure * Quality-of-Service and cross-layer optimization * Scalability in metropolitan environments * Security, privacy, robustness, and fault tolerance * Simulation tools and testbeds * Standards development and business models * Resources management and energy efficient design

Important Dates: ================

Workshop: April 21, 2008 Submission deadline: January 15, 2008 Notification of acceptance: February 25, 2008 Camera-ready version: March 15, 2008

Papers and Submission: ======================

Submitted papers should be no longer than 7 (seven) pages in IEEE two-column format for conferences, including text, tables, figures, and references. Note that the font size for submission should be 10pt. All submissions are being handled through the EDAS system (https://edas.info). Manuscript submissions should be in Adobe Portable Document Format (PDF) only. Please make sure that the paper prints without problems (take care to embed all required fonts, etc.).

Organization Committee: =======================

Program Co-Chairs: Tarek Abdelzaher, University of Illinois at Urbana Champaign, USA Yang Yu, Motorola Labs, USA

Publication Chair: Krishnamachari Bhaskar , University of Southern California, USA

Publicity Chair: Gavin Stephanie, Motorola, USA

Technical Program Committee: ============================

Fan Bai GM Research, USA Andrew Campbell Dartmouth College, USA Roy Campbell University of Illinois at Urbana Champaign, USA Bogdan Carbunar Motorola Labs, USA Rohit Chaudhri University of Washington, Motorola Labs, USA Tian He University of Minnesota, USA Jan Höller Ericsson Research, Sweden Bhaskar Krishnamachari University of Southern California, USA Koen Langendoen Delft University of Technology, Netherland Phil Levis Stanford University, USA Jie Liu Microsoft Research, USA Chenyang Lu Washington University in St. Louis, USA Liqian Luo Microsoft Research, USA Nitya Narasimhan Motorola Labs, USA Trevor Pering Intel Research, USA Christian Poellabauer University of Notre Dame, USA Rajiv Ramnath Ohio State University, USA Kay Römer ETH, Switzerland Sol Shatz University of Illinois at Chicago, USA Filippo Tempia Telecom Italia, Italy Adam Wolisz Technical University of Berlin, Germany Fan Ye IBM Research, USA Hongwei Zhang Wayne State University, USA Lin Zhong Rice University, USA ========================================================================================

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