IEEE Workshop on Telecom Standards (2nd Edition, co-located with IEEE ICC 2013) (deadline extended!)
Happy New Year to all of you!
Building on the great success of the first edition of the IEEE Workshop on Telecommunications Standards: "From Research to Standards" (which won the Best IEEE ComSoc Workshop Award at IEEE ICC 2012), we are happy to announce the organization of its second edition in Budapest, Hungary, collocated with IEEE ICC 2013 (June 9 - 13, 2013).
The goal of this Workshop is to bridge the gap between researchers, scientists, and standards experts in both academia and industry and to promote standardization as an important vehicle for information sharing and cooperation between academia and industry. An additional goal is to bring together experts from different standardization bodies, providing opportunities for closer understanding and collaboration; catalyzing development of more interoperable standards and more efficient and effective communication systems.
The Workshop technical program will deliver high quality technical as well as visionary papers that will be reviewed and selected by an international program committee representing both academia and industry with a strong standardization background. All submissions are required to comply with ICC’s guidelines. Accepted papers will appear in IEEE Xplore.
Extended versions of selected best papers will be recommended for publication in Special Issues of IEEE Journals.
Looking forward your submissions to the 2nd IEEE Workshop on Telecommunications Standards: "From Research to Standards". For further details, please visit the workshop's official site: http://www.research2standards.net/
IMPORTANT DATES
Paper abstract deadline: Jan 25, 2013 (extended) Paper submission deadline: Jan 25, 2013 (extended) Acceptance notification: Feb. 22, 2013 Final manuscript: Mar. 08, 2013
Steering Committee Dr. Heinrich J Stuettgen, Vice President, NEC Europe Ltd (Chair) Dr. Alexander D. Gelman, CIO, IEEE ComSoc, Member of IEEE-SA Standards Board Dr. Asok Chatterjee, Vice President of Industry Relations, Ericsson, USA Brian Kiernan, VP and Chief Scientist, InterDigital, USA Prof. Sherman Shen, Waterloo University, Canada Dr. Marcus Brunner, Head of Standards Department, Swiss Com, Switzerland
Workshop General Chair Dr. Tarik Taleb, NEC Europe, Germany
TPC Co-Chairs Dr. Tuncer Baykas, Tohoku University, Japan Dr. Alex Reznik, InterDigital, USA Dr. Konstantinos Samdanis, NEC Europe, Germany
Publicity Co-Chairs Prof. Joe Touch, Univ. of Southern California, USA Dr. Periklis Chatzimisios, Alexander TEI of Thessaloniki, Greece
participants (1)
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Periklis Chatzimisios