-------- Original-Nachricht -------- Betreff: [Tccc] CFP: TVT SI on Vehicle-Infrastructure Integration and Telematics Applications Datum: Wed, 5 Dec 2007 15:57:03 -0800 (PST) Von: Lin Cai cai@ECE.UVic.CA An: tccc@lists.cs.columbia.edu

[Our apologies if you receive multiple copies of this CFP]

============================================================== IEEE Transactions on Vehicular Technology (TVT) on Vehicle-Infrastructure Integration and Telematics Applications ==============================================================

For more than a hundred years, the benefits of personal and commercial mobility, made possible by vehicular technology, have been a testimony to the success of automobiles. Their collective presence --- more than a billion registered cars, trucks and buses and growing in number --- places a complex sustainability burden on society and on the planet through factors such as roadway fatalities, fossil-fuel depletion, greenhouse gas emissions & roadway congestion. During the past decade or so, there has been a globally shared realization that in order to enhance the benefits of automobiles and decrease their environmental footprint, the roadway infrastructure and automobiles need to interact as part of an intelligent transportation system (ITS). Coincident with the development of ITS, there has been a much progress made with respect to transportation telematics --- the interaction between automobiles and the infrastructure to deliver services such as road-side assistance, automatic crash notification, concierge assistance and vehicle health reports. There has been extensive research & experimentation on both the underlying architectures and technologies needed to fulfill the goals of ITS and deliver on the expectations of telematics. A new era of vehicular technologies that includes vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications is upon us, seeded by both (pre-competitive) public-sector and private-sector funding. Examples include the dedicated short-range communications (DSRC) radio under consideration in the United States (US) for vehicle-infrastructure integration (VII) and a global system for telematics (GST) chip-set in Europe. Examples of telematics or nomadic device connectivity services include BMW's ASSIT in Europe, Ford's SYNC and General Motors' OnStar, in the US and Toyota's G-Book in Japan.

Topics of Interest: -------------------- - Vehicular technologies for intra-vehicle, V2V, V2I, extra-vehicle networking & services; - Vehicular technologies for connectivity to portable or nomadic digital device & services; - Vehicular technologies to enhance ITS and Telematics services. - Microware radio & handover technologies for ITS and Telematics; - Roadside system-level, board-level and chip-level electronics; - Remote service provisioning and over-the-air vehicle software upgrade technologies; - End-to-end service delivery architectures, algorithms, protocols and scalability; - End-to-end quality of service, resource management, security & privacy; - Rail transit vehicle interface and traffic management; - Applications, including those relating to reduction in roadway fatalities, fuel consumption, greenhouse gas emissions, roadway congestion, digital entertainment & lifecycle maintenance; - Results from large-scale experimental systems, test-beds and field trials; - Business models for ITS and Telematics.

Authors should follow the IEEE TVT manuscript format and submission procedure which can be found at the IEEE TVT home page http://transactions.vtsociety.org/ under Information for Authors. There will be one round of reviews and acceptance will be limited to papers needing only moderate revisions. Prospective authors should submit a PDF version of their complete manuscript.

Important Dates: Manuscript Due: January 1, 2008 Acceptance Notice: April 1, 2008 Final Manuscripts Due: May 15, 2008 Publication: September 2008

Guest Editors: Dr. Tao Zhang Chief Scientist Applied Research Telcordia Technologies One Telcordia Drive Piscataway, New Jersey 08854, USA tao@research.telcordia.com

Prof. Char-Dir Chung Graduate Institute of Communications Engineering and Department of Electrical Engineering National Taiwan University Taipei, Taiwan, R.O.C. cdchung@cc.ee.ntu.edu.tw

Dr. To Russell Hsing Executive Director of Emerging Technologies and Services Research Department Applied Research Telcordia Technologies One Telcordia Drive Piscataway, New Jersey 08854, USA trh@telcordia.com

Dr. K. Venkatesh Prasad Group & Technical Leader Infotronics Research & Advanced Engineering Ford Motor Company Research & Innovation Center, MD 3137 Room 3011B 2101 Village Road, Dearborn, Michigan 48121, USA kprasad@ford.com _______________________________________________ Tccc mailing list Tccc@lists.cs.columbia.edu https://lists.cs.columbia.edu/cucslists/listinfo/tccc