-------- Original Message -------- Subject: [Tccc] CFP: IEEE Network special issue on protection, restoration, and disaster recovery Date: Tue, 4 Feb 2003 20:18:19 -0500 From: Debanjan Saha debanjan@yahoo.com Reply-To: debanjan@acm.org To: tccc@cs.columbia.edu

IEEE Network Call for Papers Protection, Restoration, and Disaster Recovery http://www.comsoc.org/pubs/net/ntwrk/cfpnetwork2003.pdf

Guest Editors: Debanjan Saha, Tellium, Inc. Satish Tripathi, University of California James Manchester, Tellium, Inc.

Scope: Technological innovations are enabling today's networks to carry increasingly higher volumes of data, much of which is mission critical. As networks grow and become an integral part of our daily lives, the consequences of a failure become more pronounced. Even a brief outage can result in the loss of very large amounts of critical information and disrupt our day-to-day life and business. Network protection and automatic restoration can minimize the impact of network failures. Such protection mechanisms are generally implemented at several protocol layers and are the subject of this special issue.

The objective of this special issue of IEEE Network Magazine is to assemble a series of state-of-the-art articles on protection, restoration, and disaster recovery in different layers of the network. In particular, we are interested in tutorial, survey, and original research articles on, but not limited to, the following topics:

* Traditional SONET/SDH Ring protection mechanisms * Optical mesh protection, Resilient Packet Ring (RPR) * IP network restoration - MPLS, fast convergence of routing protocols * Protection and restoration in ATM and Frame Relay networks * Restoration in wireless and wireline telephone networks * Signaling network (SS7 etc.) protection and recovery * Disaster recovery in OSS and network management systems * Resiliency at the application layer, emergency services (e.g. 911) * Multi-tier restoration and interaction of different layers * Experimental studies, applications impact

Submission Guidelines: Interested authors should submit an electronic version of the manuscript either in Postscript or PDF format as an email attachment to one of the guest editors. Additional information including "Guidelines for authors" is available at the IEEE Network Website:

http://www.comsoc.org/pubs/net/ntwrk/authors.html

Important Dates Submission Deadline: February 15, 2003 Notification of Acceptance: June 15, 2003 Final Manuscript Due: August 15, 2003 Publication Date: November/December 2003

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