-------- Ursprüngliche Nachricht -------- Von: Xianjun Deng xdeng@STFX.CA Gesendet: 29. Mai 2020 21:35:31 MESZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] [CFP]: IEEE iThings 2020

[Our apologies if you receive multiple copies of this CFP]

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The 13th IEEE International Conference on Internet of Things

Rhodes Island, Greece

November 02-06, 2020

http://cse.stfx.ca/~cybermatics/2020/ithings/

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INTRODUCTION

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As an emerged promising networking model, the Internet-of-Things (IoT) is a novel paradigm to interconnect a multitude of heterogeneous physical objects and devices. The IoT significantly provides an umbrella for a series of critical building technologies including wireless sensor networks (WSNs), fifth generation (5G) networks, and RFID. The philosophy of the IoT is to develop an intelligent, dynamic, large-scale, and coherent network framework for a wide range of applications and industries. Due to its potential advantages and merits such as high reliability, good scalability and intelligent capacity, the IoT has attracted great attentions and interests from both academia and industry.

As the earliest IEEE international conference on Internet of Things, the 2020 IEEE International Conference on Internet of Things (iThings-2020) will provide a high-profile, leading-edge forum for researchers, engineers, and practitioners from both academic and industrial communities to present state-of-the-art advances and innovations in theories, systems, infrastructure, tools, testbeds, technologies and applications for the IoT, as well as to identify emerging research topics and define the future of everything interconnect via cyberspace.

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IMPORTANT DATES

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Paper Submission Deadline: June 15, 2020

Authors Notification: July 31, 2020

Camera-Ready Paper Due: September 02, 2020

Conference Date: November 02 - 06, 2020

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ORGANIZING COMMITTEE

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General Chairs

•   Jelena Misic, Ryerson University, Canada

•   Shiwen Mao, Auburn University, USA

•   Symeon Papavassiliou, National Technical University of Athens, Greece

Program Chairs

•   Abderrahim Benslimane, Avignon University, France

•   Lucia Lo Bello, University of Catania, Italy

•  Xianjun Deng, St. Francis Xavier University, Canada & University of South China, China

Workshop Chairs

•   Salimur Choudhury, Lakehead University, Canada

•   Haipeng Dai, Nanjing University, China

•   Gaojie Chen, University of Leicester, UK

Steering Chairs

•   Jianhua Ma (Chair), Hosei University, Japan

•   Laurence T. Yang (Chair), St. Francis Xavier University, Canada

•   Schahram Dustdar, Technische Universität Wien, Austria

•   Antonio Puliafito, University of Messina, Italy

•   Huadong Ma, Beijing University of Posts and Telecommunications, China

Publicity Chairs

•   Lingzhi Yi, University of South China, China

•   Zhenchao Ma, St. Francis Xavier University, Canada

•  Yinxue Yi, Chongqing University of Posts and Telecommunications, China

Web Publication Chairs

•   Zihao Jiang, St. Francis Xavier University, Canada

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SUBMISSION GUIDELINES

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Conference papers are limited to 8 pages (regular), 6 pages (short), 2-4 pages (poster), following the IEEE proceedings format. Papers are to be submitted as PDF via the site: https://edas.info/N27352

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PROCEEDINGS & SPECIAL ISSUES

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All accepted papers in the main tracks, workshops, special sessions and

poster sessions will be published in an IEEE Computer Society proceedings (EI indexed).

Extended versions of selected excellent papers will be considered for publication in several special issues of a number of excellent journals.

List of Special Issues:

1. IEEE Transactions on Industrial Informatics

Special Issue: Digital Twinning: Integration AI-ML and Big Data Analytics for Virtual Representation

Publisher: IEEE, SCI indexed, IF=7.377

2. Information Fusion

Special Issue: Data Fusion for Trust Evaluation

Publisher: Elsevier, SCI indexed, IF=10.716

3. Future Generation Computer Systems

Special Issue: Artificial Intelligence for Cyber Defence and Smart Policing

Publisher: Elsevier, SCI indexed, IF=5.768

4. Journal of Cloud Computing

Special Issue: Security and Privacy Issues for AI in edge-Cloud Computing

Publisher: Springer, SCI indexed, IF=2.14

5. Electronics

Special Issue: Blockchain-based Technology for Mobile Application

Publisher: MDPI, SCI indexed, IF=1.764

6. Sensors

Special Issue: Smart Cities of the Future: A Cyber Physical System Perspective

Publisher: MDPI, SCI indexed, IF=3.031

7. Software: Practice and Experience

Special Issue: Software and Hardware Co-Design for Sustainable Cyber-Physical Systems

8. IEEE/CAA Journal of Automatics Sinica

Special Issue: Blockchain for Internet-of-Things and Cyber-Physical Systems: Emerging Trends, Issues and Challenges

Publisher: IEEE

9. Future Internet

Special Issue: Network Economics and Utility Maximization

Publisher: MDPI

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