-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [CFP] The 20th International Conference on Embedded Wireless Systems and Networks (EWSN 2023) Datum: Thu, 24 Nov 2022 15:41:57 +0100 Von: loscri valeria.loscri@INRIA.FR Antwort an: loscri valeria.loscri@INRIA.FR An: tccc-announce@COMSOC.ORG

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Call for Papers

The 20th International Conference on Embedded Wireless Systems and Networks (EWSN 2023)

https://ewsn2023.dimes.unical.it https://ewsn2023.dimes.unical.it/ University of Calabria – Rende, Italy – 25-27 September 2023

The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. Building on the past 19 years of success, the 20th edition will be held in Rende, Italy. The conference continues its aim for broad, world-wide impact. Proceedings will be indexed in the ACM Digital Library, SCOPUS, and other prominent digital libraries.

FEATURE TOPIC: Enabling the IoT ecosystem through Embedded Wireless Systems and Networks

The Internet of Things (IoT) is the latest example of an ecosystem whose constituent elements promise to be independent, situated, and temporarily networked to synergically provide advanced cyber–physical functionalities. Embedded Wireless Systems and Networks play a key role in the IoT scenario but their engineering poses several challenges from as many viewpoints, spanning across the whole development stack: at device level, embedded systems demands to incorporate embedded intelligence for smartness, autonomy, safety, resilience, efficiency and privacy; at network level, current wireless technologies like 5G, NB-IOT, ZigBee and Lora as well as next-generation ones need to be fully exploited aiming to enable edge computing paradigm; at data level, the huge amount of data with heterogeneous data schemas and formats demand for effective processing, storage and exploitation techniques; finally, at the service level, integration and interoperability issues need to be addressed by means of semantic technologies to avoid siloed and segmented systems and applications.

To systematically address these issues and tame the intrinsic complexity of the IoT ecosystem, full-fledged sets of development solutions and multidisciplinary approaches are needed: therefore, methodologies, frameworks, platforms and tools purposely conceived for the IoT scenario are gaining traction.

SPECIFIC TOPICS`: of interest include but are not limited to: Edge Intelligence paradigms, models and techniques for IoT ecosystems; Architectures and infrastructures for Edge-Cloud continuum for IoT ecosystems; Interoperability-oriented and integration-oriented enablers for IoT ecosystems; Communication and networking for wireless, embedded and cognitive systems; Operating systems, middleware, and services; Processing, storage, and management of data; Communication and programming paradigms, languages and tools; Dependability (real-time, reliability, availability, safety) in wireless systems; AI operated wireless sensing, actuation and control systems; Modeling, simulation, and measurement tools for wireless AI systems and applications; Machine learning and data mining for wireless sensor system; Services and wireless networking for Cyber-Physical Systems and IoT; Next generation wireless networks, 6G; Privacy and security in applications and systems; Human- centric interaction with wireless and embedded AI systems; Experiences, challenges, comparisons of embedded AI platforms; Applications of wireless embedded AI in health, automation, manufacturing , transportation; Embedded algorithms and systems for computational perception, vision, speech, haptics; Empirical studies, measurement, validation, deployment, experiences; Sustainability and Green Tech; Applications and problems from developing countries and emerging markets.

SUBMISSION to EWSN 2023 must be original (i.e., not previously published) and not currently under review by any other conference or journal. Submissions related to the featured topic are especially welcome, but all other submissions in scope of EWSN are equally welcome, all submissions will be evaluated based on the same criteria. EWSN 2023 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that their identities are not disclosed to reviewers and reviewers are discouraged from actively working to uncover author identities. To promote early dissemination, submission to arXiv (or similar) is allowed, provided cross-citations are not made.

Paper Submission is managed through Easychair at: https://easychair.org/conferences/?conf=ewsn2023 https://easychair.org/conferences/?conf=ewsn2023 Publication template available at website. Visit us at https://ewsn23.dimes.unical.it https://ewsn23.dimes.unical.it/ Honorary Chair

Adam Wolisz, Tech Univ. Berlin, Germany

General Chair

Giancarlo Fortino, Univ. of Calabria, Italy

General co-Chair

Archan Misra, Singapore Management Univ., Singapore

Program Chair

Valeria Loscrì, Inria Lille, France Fabrizio Granelli, Univ. of Trento, Italy Tarek Abdelzaher, Univ. of Illinois, USA

Workshop & Special Session Chairs

Gian Pietro Picco, Univ. of Trento, Italy

Raymond Choo, Univ. of Texas at San Antonio, USA Gregory O’Hare, Trinity College Dublin, Ireland

Sponsorship/Industry/Projects Chairs

Tommaso Melodia, Northeastern Univ., USA

Carlos Palau, Politech. Univ. of Valencia, Spain

Yiannis Andreopoulos, Univ. College London, UK

Finance Chair

Antonio Guerrieri, ICAR-CNR, Italy

Publication Chair

Claudio Savaglio, Univ. of Calabria, Italy Antonella Guzzo, Univ. of Calabria, Italy

Web Chair

Raffaele Gravina, Univ. of Calabria, Italy Important Dates

Full paper submission: 01 Apr 2023

Acceptance Notice: 01 Jun 2023

Camera Ready Submission: 30 Jun 2023

Early Bird Registration: 15 Jul 2023

Paper Types Full Paper: 10-12 pages Short Paper: 4-6 pages

Poster/Demo Paper: 2-3 pages

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Valeria Loscri Research Scientist FUN Team

Inria Lille-Nord Europe. Parc scientifique de la Haute Borne 40, Avenue Halley - Bât A - Park Plaza 59650 Villeneuve d'Ascq - France http://researchers.lille.inria.fr/~loscri/home.html

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