-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call for Papers: IEEE MobiSec 2020 (co-located with IEEE INFOCOM 2020), Beijing, China, April 2020 (Submission due: 1/15/2019) Datum: Sun, 3 Nov 2019 11:41:36 +0000 Von: Wenjia Li wli20@NYIT.EDU Antwort an: Wenjia Li wli20@NYIT.EDU An: tccc-announce@COMSOC.ORG

​​​​​Dear Colleagues,

Sorry if you receive this message multiple times. We really appreciate if you would consider submitting your work to IEEE MobiSec 2020, which will be co-located with IEEE INFOCOM 2020 at Beijing, China in April 2020.

The submission due date is January 15, 2020.

If you have any question regarding it please contact the workshop chairs. Thank you.

Sincerely Yours,

Wenjia Li, Ph.D. Workshop co-organizer and TPC co-chair, IEEE MobiSec 2020 Assistant Professor, Computer Science New York Institute of Technology New York, NY, USA

+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ The Fourth IEEE International Workshop on the Security, Privacy, and Digital Forensics of Mobile Systems and Networks (IEEE MobiSec 2020) co-located with IEEE INFOCOM 2020

Beijing, China

April 2020 https://bit.ly/2DzADBAhttps://bit.ly/2PFon7x%E2%80%8B%E2%80%8B%E2%80%8B%E2%80%8B%E2%80%8B%E2%80%8B... +++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++

Call for Papers

To many people, smartphones have been an indispensable part of daily life and work. With personal financial and medical information and job related data being processed on smartphones and related mobile systems and networks, it is critically important that the development and advancement of secure mobile operating systems, secure mobile applications, secure smartphone devices and cellular networks keep up with the ever‐ growing smartphone usage. For this reason, this research area has been a very important sector in the network and telecommunication industry and a focus of funded research projects in many research institutes.

The scope of MobiSec 2020 encompasses the security, privacy, and digital forensics of mobile systems and networks, including but not limited to Android, iOS and Windows Mobile operating systems, smartphones and applications for these platforms and devices, as well as cellular networks.

Topics of interest include (but are not limited to) the following subject categories:

​+ Android, iOS, and Windows Mobile security and privacy + Digital forensics on mobile operating systems, applications and smartphones + Secure mobile application development + Smartphone device/hardware security + Mobile application security and digital forensics + Mobile user authentication and authorization + Multi‐factor mobile authentication + Mobile user privacy + Mobile vulnerability detection and remediation + Intrusion detection and recovery on mobile OS, applications, smartphones, and cellular networks + Social network security and privacy + Secure cloud for mobile environment + Mobile device management + 4G and 5G security

SUBMISSION INSTRUCTIONS

MobiSec 2020 only accepts original and unpublished papers with no longer than 6 pages. The reviews will be single blind: authors name and affiliation should be included in the submission. The manuscripts should be formatted in standard IEEE camera-ready format (double column, 10 pt font) and be submitted as PDF files (formatted for 8.5x11 inch paper). Prospective authors should submit their papers though EDAS. The accepted and presented papers will be published in the IEEE INFOCOM 2019 workshop proceedings and appear in IEEE Xplore.

Submission link is as follows:

https://edas.info/newPaper.php?c=26846&track=99563

Important Dates and Location

Submission Due: January 15, 2020 Author Notification: February 15, 2020 Camera-ready Due: March 6, 2020

Honorary General Chair

* Dr. Wenjing Lou, Virginia Tech, USA

Workshop Organizers and Technical Program Chairs

* Dr. Lei Chen (Point of Contact: LChen@georgiasouthern.edu), Georgia Southern University, USA * Dr. Wenjia Li, New York Institute of Technology, USA * Dr. Danda Rawat, Howard University, USA * Dr. Yun Lin, Harbin Engineering University, China

Technical Program Vice Chairs

* Dr. Yiming Ji, Georgia Southern University, USA * Dr. Mauro Conti, The University of Padua, Italy * Dr. Feng Zeng, Central South University, China * Dr. Peter Mueller, IBM Zurich Research Laboratory, Switzerland * Dr. Yupeng Hu, Hunan University, China

Publication Chairs

* Dr. Narasimha Shashidhar, Sam Houston State University, USA * Dr. Umit Karabiyik, Purdue University, USA * Dr. Yuansheng Luo, Changsha University of Science & Technology, China

Publicity Chair

* Dr. Weitian Tong, Eastern Michigan University, USA * Dr. Nhien‐An Le Khac, University College Dublin, Ireland * Dr. Yejun He, Shenzhen University, China * Dr. Yehua Wei, Hunan Normal University

Web Chair

* Weinan Gao (Georgia Southern University, USA)

Technical Program Committee Members

* Nirwan Ansari (New Jersey Institute of Technology, USA) * Konstantin (Kosta) Beznosov (University of British Columbia, Canada) * Md Zakirul Alam Bhuiyan (Fordham University, USA) * Marina Blanton (University of Notre Dame, USA) * Nikita Borisov (University of Illinois at Urbana‐Champaign, USA) * Xiaojiang Du (Temple University, USA) * Venkatesan Ekambaram (Qualcomm, USA) * Michael Franz (University of California, Irvine, USA) * Xingwen Fu (University of Massachusetts Lowell, USA) * Feng Hong (Ocean University of China, China) * Yupeng Hu (Hunan University, China) * Shweta Jain (City University of New York, USA) * Brent Kang (Korea Advanced Institute of Science and Technology (KAIST), Korea) * Vimal Kumar (The University of Waikato, New Zealand) * Andrea Lanzi (University of Milan, Italy) * Jaime Lloret Mauri (Polytechnic University of Valencia, Spain) * Joel Rodrigues (University of Beira Interior, Portugal) * Sachin Shetty (Tennessee State University, USA) * Houbing Song (Embry-Riddle Aeronautical University, USA) * Chiu C. Tan (Temple University, USA) * Mohit Tiwari (University of Texas at Austin, USA) * Xiwei Wang, Northeastern Illinois University, USA * Shucheng Yu, Stevens Institute of Technology, USA

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