[Tccc] CFP: IEEE PerCom 2009
------------------------------------------------------------------------------- CALL FOR PAPERS
PerCom 2009 - THE PREMIER IEEE CONFERENCE ON PERVASIVE COMPUTING
Seventh IEEE International Conference on Pervasive Computing and Communications PerCom 2009 (http://www.percom.org/) Galveston, Texas, USA, March 9-13, 2009 --------------------------------------------------------------------------------
**** FIRM Paper Registration Deadline --- September 15, 2008 **** **** FIRM Paper Submission Deadline --- September 22, 2008 ****
Sponsored by
IEEE, IEEE Computer Society The University of Texas at Arlington IEEE TCPP, IEEE TCCC
-------------------------------------------------------------------------------- IEEE PerCom, now in its seventh year, is the premier scholarly venue in the areas of pervasive computing and communications, which aim at providing a ubiquitous platform for supporting exciting anytime and anyplace services paradigms. Pervasive computing and communications is a natural outcome of the tremendous advances of a broad spectrum of technologies including wireless and sensor networks, mobile and distributed computing, and agent technologies. PerCom 2009 will provide a high profile, leading edge forum for researchers and engineers alike to present state-of-the-art research in the respective fields of pervasive computing and communications. The conference will feature a diverse mixture of presentation forums including core technical sessions, several targeted workshops, demonstrations, keynote speeches and panel discussions from domain experts. The conference will take place in Dallas-Fort Worth Metroplex, one of the leading technology centers of the United States.
Topics of Interest: Research contributions are solicited in all areas pertinent to pervasive computing and communications, including:
- Ad hoc networks for pervasive communications - Autonomic computing and communications - Context-aware computing - Enabling technologies (e.g., wireless BAN, PAN) - Low power and green pervasive computing - Middleware services and agent technologies - Mobile/Wireless computing systems and services in pervasive computing - Novel/innovative pervasive computing applications - Pervasive computing and communication architectures - Pervasive computing in the automotive domain - Pervasive opportunistic communications and applications - Pervasive sensing, perception and semantic interpretation - Positioning and tracking technologies - Programming paradigms for pervasive systems - Quality of information (QoI) in sensor-enabled pervasive environments - Sensors and RFID in pervasive systems - Smart devices and intelligent environments - Trust, security and privacy issues in pervasive systems - User interfaces and interaction models - Virtual immersive communications - Wearable computers
Workshops and affiliated events: Many workshops will be held in conjunction with the conference. Workshop papers will be included and indexed in the IEEE digital libraries (Xplore), showing their affiliation with IEEE PerCom. As in the past, PerCom 2009 will also feature a PhD Forum, Demonstrations and a Work-in-Progress Session.
PerCom 2009 Submission Guidelines: Submitted papers must be original and unpublished or under consideration elsewhere for publication. Papers must show a significant relevance to pervasive computing and networking. Only electronic submissions in PDF will be considered. The page limit is 9 pages (at least 10pt font, 2-column pages, including references, figures and tables); link to formatting templates can be found at: http://www.percom.org/submissionguidelines.html. All submitted papers will undergo a rigorous review process managed by the technical program committee. IEEE Press will publish the conference proceedings. The best paper will receive the prestigious Mark Weiser best paper award. Papers of particular merit will be considered for a special issue of Elsevier's Pervasive and Mobile Computing Journal.
Important Dates: Paper registration: September 15, 2008 Paper submission: September 22, 2008 (firm deadline!) Workshop proposal: May 23, 2008 Author notification: December 12, 2008, Camera-ready due: January 7, 2009
Please check the conference Web-site (http://www.percom.org) frequently for more details. For further information, please contact: zaruba@uta.edu.
Organizing Committee: General Chair: Klara Nahrstedt, Univ. of Illinois at Urbana- Champaign, USA General Vice-chair: Gergely Zaruba, Univ. of Texas at Arlington, USA Program Chair: Chatschik Bisdikian, IBM Research, USA Program Vice-chairs: Silvia Giordano, SUSPI, Switzerland Chandra Narayanaswami, IBM Research, USA Albrecht Schmidt, Univ. of Duisburg-Essen, Germany Workshops Co-chairs: Ben Lee, Oregon State Univ., USA Hao Chu, National Taiwan Univ. Panels Chair: Christian Becker, Universitaet Mannheim, Germany Keynotes Chair: Marco Conti, CNR, Italy Ph.D. Forum: Scott Midkiff, Virginia Tech, and NSF, USA Steering Committee Chair: Mohan Kumar, Univ. of Texas at Arlington, USA
To see all committee members please visit the main conference web site.
Technical Program Committee: Ozgur Akan, Middle East Technical University, Turkey Giuseppe Anastasi, University of Pisa, Italy Stefano Basagni, Northeastern University, USA Christian Becker, Universitaet Mannheim, Germany Joel Branch, IBM Research, USA Fabian Bustamante, Northwestern University, USA Tiziana Calamoneri, University of Rome "Sapienza", Italy Roy Campbell, University of Illinois at Urbana-Champaign, USA Guohong Cao, Pennsylvania State University, USA Jiannong Cao, Hong Kong Polytechnic University, Hong Kong Paul Castro, IBM T.J. Watson Research Center, USA Mun Choon Chan, National University of Singapore, Singapore Hao-hua Chu, National Taiwan University, Taiwan Marco Conti, IIT-CNR, Italy Diane Cook, Washington State University, USA Sajal Das, The University of Texas at Arlington, USA Nigel Davies, Lancaster University, UK Luca Delgrossi, Mercedes-Benz Research and Development, USA Jonathan Engelsma, Motorola, Inc., USA Alois Ferscha, University of Linz, Austria Morten Fjeld, Chalmers University of Technology, Sweden Eric Fleury, ENS Lyon / INRIA, France Christian Floerkemeier, MIT, USA Hans Gellersen, Lancaster University, UK Mario Gerla, University of California at Los Angeles, USA Tao Gu, Institute for Infocomm Research, Singapore Xiaohui Gu, North Carolina State University, USA Jonna Hakkila, Nokia, Finland Qi Han, Colorado School of Mines, USA Robert Harle, University of Cambridge, UK Seongsoo Hong, Seoul National University, Korea Jadwiga Indulska, University of Queensland, Australia Yu Jiao, Oak Ridge National Laboratory, USA Vana Kalogeraki, University of California, Riverside, USA Holger Karl, University of Paderborn, Germany Sneha Kasera, University of Utah, USA Timo Kosch, BMW, Germany Polychronis Koutsakis, McMaster University, Canada Bhaskar Krishnamachari, University of Southern California, USA Mohan Kumar, The University of Texas at Arlington, USA Rodger Lea, University of British Columbia, Canada Ben Lee, Oregon State University, USA Dongman Lee, Information and Communications University, Korea Yunhao Liu, Hong Kong University of Science and Technology, Hong Kong Paul Lukowicz, University of Passau, Germany Cecilia Mascolo, University of Cambridge, UK Martin Mauve, Heinrich Heine University Duesseldorf, Germany Scott Midkiff, Virginia Tech, USA Archan Misra, IBM Research, USA Matt Mutka, Michigan State University, USA Tamer Nadeem, Siemens Corporate Research, Inc., USA Daniela Nicklas, Carl von Ossietzky Universitaet Oldenburg, Germany Joerg Ott, Helsinki University of Technology, Finland Max Ott, NICTA, Australia Symeon Papavassiliou, National Technical University of Athens, Greece Jong Hyuk Park, Kyungnam University, Korea Andrea Passarella, IIT-CNR, Italy Giovanni Pau, University of California Los Angeles, USA Chiara Petrioli, University of Rome "La Sapienza", Italy Tom Pfeifer, Waterford Institute of Technology, TSSG, Ireland Gian Pietro Picco, University of Trento, Italy Gopal Pingali, IBM Research, USA Claudio Pinhanez, IBM Research, USA Aaron Quigley, University College Dublin, Ireland Mandayam Raghunath, Google, India Nishkam Ravi, Intel, Santa Clara, USA Kay Roemer, ETH Zurich, Switzerland Michael Rohs, Deutsche Telekom Laboratories, TU Berlin, Germany Kurt Rothermel, University of Stuttgart, Germany George Roussos, Birkbeck College, University of London, UK Antony Rowstron, Microsoft Research, UK Enrico Rukzio, Lancaster University, UK Ichiro Satoh, National Institute of Informatics, Japan Gregor Schiele, Universitaet Mannheim, Germany James Scott, Microsoft Research, UK Mitali Singh, University of Southern California, USA Wen-Zhan Song, Washington State University, Vancouver, USA Danny Soroker, IBM Research, USA Mani Srivastava, University of California, Los Angeles, USA Vincent Stanford, National Institute of Standards and Technology, USA Ioannis Stavrakakis, National and Kapodistrian University of Athens, Greece Ivan Stojmenovic, University of Ottawa, Canada Thomas Strang, DLR Oberpfaffenhofen, Germany Violet Syrotiuk, Arizona State University, USA Sameer Tilak, University of California at San Diego, USA Anand Tripathi, University of Minnesota, USA Gerhard Troester, Wearable Computing Lab ETH Zuerich, Switzerland Kristof Van Laerhoven, TU Darmstadt, Germany Athanasios Vasilakos, University of Western Macedonia, Greece Li Xiao, Michigan State University, USA David Yates, Bentley College, USA Franco Zambonelli, University of Modena and Reggio Emilia, Italy Gergely Zaruba, University of Texas at Arlington, USA Daqing Zhang, GET/INT-National Institute of Telecommunications, France _______________________________________________ Tccc mailing list Tccc@lists.cs.columbia.edu https://lists.cs.columbia.edu/cucslists/listinfo/tccc
participants (1)
-
Qi Han