-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call for WiP and Demo -- SMARTCOMP 2022 -- Deadline: 29 April 2022 Datum: Thu, 24 Mar 2022 11:36:30 +0000 Von: Eirini Eleni Tsiropoulou eirini@UNM.EDU Antwort an: Eirini Eleni Tsiropoulou eirini@UNM.EDU An: tccc-announce@COMSOC.ORG

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CALL FOR WIP-DEMO PAPERS

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The 8th IEEE International Conference on Smart Computing (SMARTCOMP 2022), June 20-24, 2022 in Helsinki, Finland

https://smartcomp.aalto.fi/

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SMARTCOMP 2022 is the 8th edition of the premier conference on Smart Computing.

Smart computing is a multidisciplinary domain based on the synergistic influence of advances in sensor-based technologies, Internet of Things, cyber-physical systems, edge computing, big data analytics, machine learning, cognitive computing, and artificial intelligence.

Applications of smart computing can be found in different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, industrial systems, entertainment, and social media. Algorithmic and system advancements of cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking and social computing are taking smart computing to a new dimension and improving our ways of living.

SMARTCOMP WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions.

WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools.

Currently the conference is planned to be in Helsinki, Finland, hoping we will be able to meet in person again.

TOPICS

Areas of interest include (but are not limited to):

* Future Smart Computing Paradigms

* Models of Smart Environments

* Algorithms for Smart Computing

* AI and Machine Learning in Smart Computing

* Security, Privacy, and Trust issues in Smart Computing

* Fairness and Socio-technical issues of Smart Computing

* Smart Computing for Cyber-physical Systems

* Middleware Platforms for Smart Systems

* Mobile and Ubiquitous Platforms for Smart Systems

* Cloud, Edge and Fog Smart Computing Platforms

* Data Architectures and Analytics for Smart Computing

* Smart Computing for Smart and Connected Communities

* Smart green computing

* Social computing and smart systems

* Wearable computing and IoT for Smart Systems

* Architectures and Software for Smart Computing

* Novel communication paradigms (e.g., 5G/6G, VLC, DSA) in smart computing

* Quantum Computing in Smart Systems

* Interdisciplinary approaches to Smart Computing

* Applications of Smart Computing include:

* Smart healthcare and digital epidemiology

* Smart agriculture

* Smart infrastructures

* Smart cities

* Smart energy, transportation, water distribution systems

* Smart factories

* Smart workspace

WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at *IEEE conference template*. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.

WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated.

Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment.

Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that), through EDAS - WiP and Demo Track.

Submitted WIP and Demo papers will be subject to peer reviews by SMARTCOMP Technical Program Committee members and other experts in the field.

All accepted papers will be published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. They will be presented as posters and demo live presentations. At least one author of each accepted paper must register and attend the conference to present the work.

Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template.

Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission.

Submissions must be made via EDAS.

When submitting, please select the "SMARTCOMP 2021: WIP and Demo" track.

IMPORTANT DATES:

Paper Submission: extended to 29 April 2022

Acceptance Notification: extended to 9 May 2022

Camera ready: 16 May 2022

WIP AND DEMO CO-CHAIRS:

Franca Delmastro, IIT-CNR, Italy (franca.delmastro@iit.cnr.itmailto:franca.delmastro@iit.cnr.it)

Sandip Chakraborty, Indian Institute of Technology Kharagpur, India (sandipc@cse.iitkgp.ac.inmailto:sandipc@cse.iitkgp.ac.in)

****************************************************************************************************** ------------------------------------------------------------- Eirini Eleni Tsiropoulou Assistant Professor Director of Recruiting and Admissions Computer Engineering Area Chair

Department of Electrical and Computer Engineering University of New Mexico Albuquerque, NM, 87131 Office: 326B Tel.: (505)-277-5501 Email: eirini@unm.edumailto:eirini@unm.edu

"Those who know, do. Those that understand, teach." ~ Aristotle

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