Anfang der weitergeleiteten Nachricht:
Von: James Pope james.h.pope8@GMAIL.COM Datum: 26. Mai 2018 um 12:30:37 MESZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] CfP: Deadline extension to 29 May, IEEE SenseApp 2018, 1-4 October 2018, Chicago, USA Antwort an: James Pope james.h.pope8@GMAIL.COM
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IEEE SenseApp 2018
THIRTEENTH IEEE INTERNATIONAL WORKSHOP ON PRACTICAL ISSUES IN BUILDING SENSOR NETWORK APPLICATIONS
(in conjunction with IEEE LCN 2018)
Chicago, USA 1-4 October 2018
www.senseapp.org
CALL FOR PAPERS
For more than a decade, embedded wireless sensors and actuators have been increasingly networked to continually narrow the gap between the physical world and cyberspace. Domain-specific sensing deployments in scenarios like industrial settings and home automation are becoming more and more ubiquitous, particularly with the advent of novel sensing platforms which allow for the seamless integration of sensing devices into everyday environments. At the same time, data gathered through wireless sensor network deployments empower applications in the emerging domains of smart cities and smart infrastructures.
While enabling technologies have evolved into mature and widely available solutions, insights gathered from real-world sensor network deployments are still scarce and many practical issues in building sensor network applications persist. A thorough understanding of these challenges from a practical/systems perspective is still necessary. This especially applies to insights from the areas of hardware platforms of sensor and actuator nodes, their operating systems, the networking of nodes, and fresh perspectives from field trials and applications.
This workshop aims at bringing together researchers from both academia and industry to showcase their work and obtain feedback. It serves as a forum for the sensing network research communities working on embedded sensing systems to discuss open issues, novel solutions, and the future development of wireless sensing in general. We encourage contributions describing innovative work in the realms of wireless sensor networks, cyber-physical systems, smart spaces, machine-to-machine communication, the Internet of Things, and all related disciplines. Topics of interest include, but are not limited to:
- Practical experiences from innovative real-world sensor network deployments
and applications
- Hands-on experiences with the integration of sensor networks and the
Internet of Things
- Middleware support for sensor networks
- Programming and debugging sensor networks
- Security, availability and dependability issues in sensor networks
- Experiences with new sensor hardware and node/platform designs
- Practical problems in implementing localization and time synchronization
- Experiences with communications protocols for the IoT, M2M, or CPS
- Practical medium access control protocols (MACs)
- Topology control and routing protocols in sensor network deployments
- Novel communication paradigms for wireless sensor networks
- Mobility management in sensor applications and deployments
- Fault-tolerance and troubleshooting sensor networks
- Experiences regarding energy management and network lifetime
- Experiences with energy harvesters and energy-sustainable designs
- Deployment, installation, and configuration support
- Management of large-scale sensor networks and sensing campaigns
- Interconnection between IP and sensor networks
- Interfacing with sensor networks using mobile computing devices
- Large-scale open sensor data sets from real deployments
- Integration of wireless sensor networks with smart city infrastructures
- Real-world use of WSN platforms in smart spaces and cyber-physical systems
- Sensor networking for smart power grids
- Practical experiences with wearable sensing technologies
Submitted papers will be reviewed by at least three independent experts in the field. Proceedings of the workshop will be published together with those of IEEE LCN, and will be available in digital format from the IEEE Xplore Digital Library.
SUBMISSION INSTRUCTIONS: Authors are invited to submit original unpublished work, not currently under review by another conference, workshop or journal. Regular (full) papers (10 pt font in two-column IEEE format) should present novel perspectives and match with at least two of the topics of interest of the workshop. Papers are expected to be 6 pages long, yet submissions of up to 8 pages are allowed. Papers in excess of this limit will not be considered for review or publication. Papers must be submitted electronically via EDAS at:
All papers must include title, complete contact information of all authors, abstract and up to 5 keywords on the cover page. Further information can be found at: www.senseapp.org
IMPORTANT DATES: Paper submission deadline (ext): 29 May 2018 Notification of acceptance: 6 July 2018 Camera ready manuscript due: 6 August 2018
PROGRAM COMMITTEE CO-CHAIRS: Andreas Reinhardt, TU Clausthal, Germany Xenofon Fafoutis, University of Bristol, United Kingdom
PUBLICITY CHAIR: James H. Pope, University of Bristol, United Kingdom
GENERAL CO-CHAIRS: Matthias Hollick, Technische Universität Darmstadt, Germany Salil Kanhere, The University of New South Wales, Australia
STEERING COMMITTEE: Sanjay Jha, The University of New South Wales, Australia Cormac Sreenan, University College Cork, Ireland
TECHNICAL PROGRAM COMMITTEE: Neil Bergmann, University of Queensland, Australia Carlo Alberto Boano, Graz University of Technology, Austria Fernando Boavida, University of Coimbra, Portugal David Boyle, Imperial College London, United Kingdom (Great Britain) Rachel Cardell-Oliver, The University of Western Australia, Australia Anna Förster, University of Bremen, Germany Csaba Kiraly, Fondazione Bruno Kessler, Italy Letizia Marchegiani, University of Oxford, United Kingdom (Great Britain) Alan Marchiori, Bucknell University, USA George Oikonomou, University of Bristol, United Kingdom (Great Britain) Georgios Papadopoulos, IMT Atlantique, France Christian Renner, Hamburg University of Technology, Germany Olga Saukh, ETH Zurich, Switzerland Corinna Schmitt, University of Zurich, Switzerland Philipp Sommer, ABB Corporate Research, Switzerland Leonardo Steinfeld, Universidad de la República, Uruguay Kristof Van Laerhoven, University of Siegen, Germany Dingwen Yuan, Technische Universität Darmstadt, Germany
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