-------- Ursprüngliche Nachricht -------- Von: "Liubingyang (Bryan)" liubingyang@HUAWEI.COM Gesendet: 1. März 2018 02:27:13 MEZ An: tccc-announce@COMSOC.ORG Betreff: [TCCC-ANNOUNCE] [CFP] SIGCOMM NEAT Workshop

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ACM SIGCOMM 2018 Workshop on Networking for Emerging Applications and Technologies (NEAT 2018) August 20 or 24, 2018, Budapest co-located with ACM Sigcomm'18

Scope ACM NEAT'18 workshop is a forum about new network architectures, technologies and protocols specifically in the context of emerging applications, with a particular focus on achieving accurate prescribed latency, high throughput, and meeting service level objectives in complex and large-scale networks.

Topics of Interest

- New network architectures, technologies and protocols, evolutionary or disruptive, for future applications - Convergence and optimizations of protocols for industrial, tactile or vehicular networks - Techniques and solutions for deterministic services in industrial, tactile or vehicular networks - Network challenges and requirements for emerging, resource-sensitive applications - Architecture and protocols for ultra-reliable packet delivery at low latency - Mechanisms to maximize link utilization for high-throughput applications - Network security and privacy issues in Industrial and Tactile internet - Resource allocation mechanisms for deterministic and reliable data transmission - Architectures to enable edge computing and its seamless integration with remote clouds - New network resource allocation based on data-driven adaptation and machine learning - Quality of Services and Experience of Service guarantees: the key metrics that will allow future networks to meet industry demands

Submission deadline: March 25, 2018 Submission link: https://sigcomm18neat.hotcrp.com More details available at: https://conferences.sigcomm.org/sigcomm/2018/workshop-neat.html

Regards, Bingyang Liu on behalf of General Chairs

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