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Fwd: CFP: 37th IEEE International Performance Computing and Communications Conference (IPCCC 2018)
by Lars Wolf 03 Jul '18

03 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: CFP: 37th IEEE International Performance Computing and Communications Conference (IPCCC 2018) Datum: Tue, 3 Jul 2018 16:03:32 +0200 Von: Nils Aschenbruck <aschenbruck(a)uos.de> An: tccc-announce(a)computer.org ================================================================= Apologies if you receive multiple copies of this Call for Papers ================================================================= IEEE IPCCC 2018 The 37th IEEE International Performance, Computing, and Communication Conference (IPCCC) 2018 http://www.ipccc.org/ November 17 – 19, 2018 Orlando, Florida, USA CALL FOR PAPERS The International Performance, Computing, and Communications Conference is a premier IEEE conference presenting research in the performance of computer and communication systems. For over three-and-a-half decades, IPCCC has been a research forum for academic, industrial, and government researchers. We encourage submission of high-quality papers reporting original work in both theoretical and experimental research areas. -------------------------------------------------- **** Hot Topics for IPCCC 2018 **** Big Data Processing and Analytics Cloud Computing Edge Computing Crowdsourcing Systems Cyber Physical Systems Data Centers Embedded Systems Internet of Things Network Protocols Multimedia Networking Network Data Mining Security and Privacy Ubiquitous Computing Software Defined Networking Cache, Memory, and Disk Storage Systems Fundamental Theory and Algorithms Internet of Things Internet Services and Network Management Many-core and Heterogeneous Computing Mobile Ad Hoc, Sensor and Mesh Networks Network Information Assurance and Security Online Social Network Analysis Parallel and Distributed Systems Performance Evaluation and Modeling Smart Grid and Intelligent Mission Critical Operations Smart Health Systems, Wearable, and Implantable Systems Smartphone and Mobile Applications Wireless Communication and Networks Workload Characterization & its Impacts on Architecture Design Networks on Chip -------------------------------------------------- **** SUBMISSION GUIDELINES ***** -------------------------------------------------- Paper submissions should be formatted according to the IEEE standard double-column format with a font size of 10 pt or larger with a maximum of 8 pages for full papers and 2 pages for poster papers. Please refer to the IEEE formatting instruction for details: http://www.ieee.org/conferences_events/conferences/publishing/templates.html Submissions should represent original research results and may not be under review or accepted for publication in another venue. All papers should be submitted through the EDAS system: https://edas.info/newPaper.php?c=24827 For any questions regarding paper submissions, please contact the program co-chairs Yingshu Li (yili(a)gsu.edu) or Fan Li (fli(a)bit.edu.cn). Please refer to the conference website http://ipccc.org for more details. -------------------------------------------------- **** IMPORTANT DATES **** Paper Abstract Due: July 27, 2018 Full Paper Due: August 3, 2018 Poster Paper Due: August 24, 2018 Acceptance Notification: September 21, 2018 Camera Ready Due: October 5, 2018 _______________________________________________________________________ To unsubscribe from the tccc-announce list, click the following link: https://cs-listserv.ieee.org/cgi-bin/wa?SUBED1=tccc-announce&A=1

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Fwd: IEEE PerCom 2019 - Paper registration due September 14th, 2018
by Lars Wolf 03 Jul '18

03 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: IEEE PerCom 2019 - Paper registration due September 14th, 2018 Datum: Tue, 3 Jul 2018 10:10:33 -0700 Von: hassan.ghasemzadeh <hassan.ghasemzadeh(a)wsu.edu> An: Multiple recipients <LISTSERV(a)CS-LISTSERV.IEEE.ORG> [We apologize if you receive multiple copies of this CFP.] CALL FOR PAPERS - IEEE PerCom 2019 IEEE International Conference on Pervasive Computing and Communications Kyoto, Japan, March 11-15 2019 http://www.percom.org IEEE PerCom, now in its seventeenth year, is established as the premier annual scholarly venue in the areas of pervasive computing and communications. Pervasive computing and communications have evolved into highly active areas of research; they have found their way into many current commercial systems due to the tremendous advances in a broad spectrum of technologies and topics including wireless networking, mobile and distributed computing, sensor systems, ambient intelligence, and smart devices. PerCom 2019 will be held in Kyoto, formerly the imperial capital of Japan for long years and one of the most attractive cities for tourists for its cultures, histories and cuisines. PerCom 2019 will provide a leading edge scholarly forum for researchers, engineers, and students alike to share their state-of-the art research and developmental work in the broad areas of pervasive computing and communications. The conference will feature a diverse mixture of interactive forums: core technical sessions of high-quality cutting-edge research articles; targeted workshops on exciting topics; live demonstrations of pervasive computing in action; insightful keynote speeches; panel discussions from domain experts; and posters of emerging ideas. Research contributions are solicited in all areas pertinent to pervasive computing and communications, including: • Advances in pervasive systems and infrastructures middleware systems and services; large-scale data management for pervasive computing; clouds, cloudlets, and fog computing; device-to-device coordination; Internet of Things; sensor and actuator networks; experiences from real-world deployments. • Theoretical and analytical models and algorithms context modelling and reasoning; adaptive and context-aware computing; activity recognition; programming paradigms; applied machine learning; cognitive computing techniques. • Domain-specific challenges and novel applications pervasive technologies for healthcare, sport, smart homes and buildings, smart manufacturing (Industry 4.0), smart cities; innovative pervasive computing applications in such domains. • Intersections of pervasive computing and communications with other research areas social networks; urban/mobile crowd sensing & intelligence; opportunistic networks; big data. • New techniques for user-level concerns participatory and social sensing; trust, security, and privacy; user interfaces, interaction, and persuasion; blockchain and smart contracts. • Technological innovations architectures, protocols, and technologies for pervasive communications; mobile and wearable computing systems and services; smart devices and intelligent environments; cognitive and reconfigurable hardware; positioning and tracking technologies. Important Dates Paper Registration: Sep. 14, 2018 Paper Submission: Sep. 21, 2018 Notification: Dec. 11, 2018 Camera Ready: Jan. 11th, 2019 Contact: percom2019(a)gmail.com General Chairs Behrooz Shirazi, Washington State University, USA Keiichi Yasumoto, Nara Institute of Science and Technology, JAPAN Technical Program Chair Gregor Schiele, University of Duisburg-Essen, Germany Vice Technical Program Chairs Philippe Lalanda, Grenoble University, France Lama Nachman, Intel Labs, USA Hirozumi Yamaguchi, Osaka University, Japan Steering Committee Chair Mohan Kumar, Rochester Institute of Technology, USA _______________________________________________________________________ To unsubscribe from the tci-announce list, click the following link: https://cs-listserv.ieee.org/cgi-bin/wa?SUBED1=tci-announce&A=1

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Fwd: [TCCC-ANNOUNCE] Call for papers: EuroSys 2019
by Lars Wolf 03 Jul '18

03 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] Call for papers: EuroSys 2019 Datum: Tue, 3 Jul 2018 15:37:48 +0000 Von: Etienne Riviere <etienne.riviere(a)UCLOUVAIN.BE> Antwort an: Etienne Riviere <etienne.riviere(a)UCLOUVAIN.BE> An: tccc-announce(a)COMSOC.ORG ---------------------------------------- EuroSys 2019: Call for Papers ---------------------------------------- # General Information - Website: https://www.eurosys2019.org - Venue: Dresden, Germany - Conference Date: 25-28 Apr, 2019 The European Conference on Computer Systems (EuroSys) is a premier international forum for presenting computer systems research, broadly construed. EuroSys 2019 seeks papers on all areas of computer systems research, including: - Cloud computing and datacenter systems - Operating systems - Distributed systems - File and storage systems - Networked systems - Language support and runtime systems - Systems security and privacy - Dependable systems - Database systems and data analytics frameworks - Virtualization and virtualized systems - Mobile and pervasive systems - Parallelism, concurrency, and multicore systems - Real-time, embedded, and cyber-physical systems - Tracing, analysis, verification, and transformation of systems We encourage papers that span multiple topics and communities. Papers will be judged on novelty, significance, correctness, and clarity. The program committee seeks papers that address a significant problem with an interesting and compelling solution whose validity and practicality are clearly demonstrated. A good paper will draw appropriate conclusions, honestly present related prior work, and clearly describe the new aspects of the authors‘ work. We welcome experience papers that clearly articulate lessons learned, as well as papers that refute prior published results. Reviewing is double-blind, meaning that the authors‘ identities will be hidden from the reviewers and vice versa. EuroSys applies ACM‘s policies for plagiarism, submission confidentiality, reviewer anonymity, and prior and concurrent paper submission. Papers will be provisionally accepted and final acceptance will be subject to shepherding by a member of the program committee. Full submission details will appear online on the conference Web site (http://eurosys2019.org/). In addition to paper presentations, EuroSys 2019 will have a poster session. Submissions for posters will open closer to the conference deadline. Accepted papers will automatically qualify for the poster session, and authors will be strongly encouraged to participate. EuroSys grants awards for the best and best student papers. Authors who are unsure whether or not their submissions might meet these guidelines, or with specific questions about the guidelines, are welcome to contact the program committee co- chairs via pc-chairs(a)eurosys2019.org. # Important Dates - Abstract Submission: 24 September, 2018 - Full Paper Submission: 1 October, 2018 - Notification of Acceptance: 21 December, 2018 - EuroSys 2019 workshops: 25 March, 2019 - EuroSys 2019: 26-28 March, 2019 # Organization Christof Fetzer (TU Dresden) - General Chair George Candea (EPFL) - Program Committee Chair Robbert van Renesse (Cornell University) - Program Committee Chair # Program Committee Gustavo Alonso (ETH Zurich) Lorenzo Alvisi (Cornell University) Aruna Balasubramanian (Stony Brook University) Hitesh Ballani (Microsoft Research Cambridge) Andrew Baumann (Microsoft Research Redmond) Adam Belay (MIT) Sonia Ben Mokhtar (CNRS Lyon) Theo Benson (Brown University) Pramod Bhatotia (University of Edinburgh) Björn Brandenburg (Max Planck Institute for Software Systems) Christian Cachin (IBM Research Zürich) Michael Carbin (MIT) Haibo Chen (Shanghai Jiao Tong University) Kang Chen (Tsinghua University) Manuel Costa (Microsoft Research Cambridge) Jon Crowcroft (University of Cambridge) Chris De Sa (Cornell University) Peter Druschel (Max Planck Institute for Software Systems) Ittay Eyal (Technion) Pascal Felber (University of Neuchâtel) Roxana Geambasu (Columbia University) Johannes Gehrke (Microsoft) Ioana Giurgiu (IBM Research Zürich) Steve Hand (Google) Tim Harris (Amazon UK) Jon Howell (Google) Charlie Hu (Purdue University) Baris Kasikci (University of Michigan) Anne-Marie Kermarrec (Inria) Eddie Kohler (Harvard University) Christos Kozyrakis (Stanford University) Petros Maniatis (Google) Frank McSherry (ETH Zurich) Madan Musuvathi (Microsoft Research Redmond) Neha Nerula (MIT Media Lab) Cristina Nita-Rotaru (Purdue University) Aurojit Panda (New York University) Marta Patiño (Technical University of Madrid) Mathias Payer (EPFL) Peter Pietzuch (Imperial College London) Dan Ports (University of Washington) Costin Raiciu (Politehnica Bucharest) John Regehr (University of Utah) Martin Rinard (MIT) Rodrigo Rodrigues (Nova U. of Lisbon) Mema Roussopoulos (University of Athens) Bianca Schroeder (University of Toronto) Wolfgang Schröder-Preikschat (FAU Erlangen-Nürnberg) Assaf Schuster (Technion) Marc Shapiro (Inria) Liuba Shrira (Brandeis University) Robert Soulé (University of Lugano) Phillip Stanley-Marbell (University of Cambridge) Michael Swift (University of Wisconsin−Madison) Jens Teubner (TU Dortmund) Boon Thau Loo (University of Pennsylvania) Nalini Venkatasubramanian (UC Irvine) Ymir Vigfusson (Emerson University) Yuan Yu (Microsoft) Lidong Zhou (Microsoft Research Asia) ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [EWSN 2019] Call for Papers
by Lars Wolf 03 Jul '18

03 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: [EWSN 2019] Call for Papers Datum: Tue, 3 Jul 2018 10:28:12 +0200 Von: Olga Saukh <olga.saukh(a)GMAIL.COM> Antwort an: Mailing List der GI FG 3.3.1 "Kommunikation und Verteilte Systeme" <KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE> An: KUVS-L(a)LISTSERV.UNI-HEIDELBERG.DE Call for Papers: International Conference on Embedded Wireless Systems and Networks (EWSN 2019) **** EWSN 2019 **** Beijing, China February 25-27, 2019 http://ewsn2019.thss.tsinghua.edu.cn The International Conference on Embedded Wireless Systems and Networks (EWSN) is a highly selective single-track international conference focusing on the latest research results on embedded systems and wireless networking, key enablers for visionary scenarios such as the Internet of Things and Cyber-Physical Systems. Building on 15 years of successful EWSN conferences, the 16th edition marks a significant change: for the first time, EWSN will go outside Europe, and be held in Beijing, China. The conference aims at a broader impact world-wide, while maintaining its role as a premier conference originated from Europe. The conference solicits both full technical papers and short papers describing validated early ideas. Specific topics of interest include but are not limited to: -- Communication and networking for wireless and embedded systems -- Sensing, actuation, and control -- Operating systems, middleware, and services -- Processing, storage, and management of data -- Programming paradigms, languages, and tools -- Emerging computing platforms, e.g., drones and robots -- Time and location management -- Dependability (real-time, reliability, availability, safety) -- Sustainability (low-power operation, energy management, energy harvesting) -- Privacy and security in applications and systems -- Human-machine interaction with wireless and embedded systems -- Design and implementation of real-world applications and systems -- Measurement studies and deployment experiences Contributions that reflect emerging technologies and applications related to industrial IoT are particularly welcome. The conference proceedings will appear in the ACM Digital Library. Selected accepted papers will be fast-tracked to ACM Transactions on Sensor Networks (TOSN) or ACM Transactions on the Internet of Things (TIOT). Submission Instructions Submissions to EWSN 2019 must be original (i.e., not previously published) and not currently under review by any other conference or journal. EWSN 2019 will adopt a double-blind review process. Authors must make a good faith effort to anonymize their submissions to ensure that author identities are not disclosed to reviewers. We will also offer authors a rebuttal phase before final decisions are made. Formatting requirements. Full paper submissions must have at most 12 pages. Short paper submissions must have at most 6 pages. Pages must have 8.5" x 11" (letter) two-column format, using 10-point type on 11-point leading, with a maximum text block of 7" wide x 9" deep with an inter-column spacing of .25". The page limits include figures, tables, and references. Authors may use the LaTex templates provided here. Submission Site. Paper submission is managed through HotCRP at the following site: http://hotcrp.disi.unitn.it/ewsn2019/ Important Dates Paper registration: 23:59:59 pm.(AOE), September 7, 2018 Paper submission: 23:59:59 pm.(AOE), September 14, 2018 Authors rebuttal deadline: November 16, 2018 Notification: December 1, 2018 Organisation Committee General Co-Chairs Yunhao Liu, Tsinghua University (China) Guoliang Xing, The Chinese University of Hong Kong (China) TPC Co-Chairs Yuan He , Tsinghua University (China) Gian Pietro Picco, University of Trento (Italy) Workshop Co-Chairs Mo Li, Nanyang Technological University (Singapore) Marco Zimmerling, Technische Universität Dresden (Germany) Poster Co-Chairs Simon Duquennoy, RISE SICS (Sweden) Rui Tan, Nanyang Technological University (Singapore) Demo Co-Chairs Zhichao Cao, Tsinghua University (China) Hongkai Wen, University of Warwick (UK) Competition Chair Carlo Alberto Boano, Graz University of Technology (Austria) Phd Colloquium Co-Chairs Lothar Thiele, Swiss Federal Institute of Technology Zurich (Switzerland) Thiemo Voigt, Uppsala University and RISE SICS (Sweden) Industry Liaison Chair Xiaohua Tian, Shanghai Jiao Tong University (China) Local Arrangement Co-Chairs Fan Li, Beijing Institute of Technology (China) Liang Liu, Beijing University Of Posts And Telecommunications (China) Jiliang Wang, Tsinghua University (China) Registration Chair Kele Shen, Tsinghua University (China) Publicity Co-Chairs Octav Chipara, University of Iowa (USA) JeongGil Ko, Ajou University (Korea) Olga Saukh, Graz University of Technology (Austria) Fu Xiao, Nanjing University of Posts and Telecommunications (China) Publication Co-Chairs Bernd-Christian Renner, Hamburg University of Technology (Germany) Yuanqing Zheng, Hong Kong Polytechnic University (HK) Web Chair Xipeng Ma, Tsinghua University (China)

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Fwd: [TCCC-ANNOUNCE] [SenSys 2018] Call for Poster/Demo
by Lars Wolf 02 Jul '18

02 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [SenSys 2018] Call for Poster/Demo Datum: Sun, 1 Jul 2018 09:09:08 -0700 Von: Shijia Pan <shijiapan(a)CMU.EDU> Antwort an: Shijia Pan <shijiapan(a)CMU.EDU> An: tccc-announce(a)comsoc.org Call for Poster/Demo: The ACM Conference on Embedded Networked Sensor Systems (SenSys 2018) **** ACM SenSys 2018 **** Shenzhen, China November 4-7, 2018 http://sensys.acm.org/2018/ Dear Colleagues, SenSys 2018 solicits submissions of poster and demo abstracts reflecting on-going research progress and/or demonstrating working prototypes. We welcome submissions in broadly defined areas of interests (but not limited to): systems of smart sensors and actuators, brand-new applications of sensory devices, smart things, and smart infrastructure, and the underlying research challenges in communication, networking, energy and resources, data management, algorithms and machine intelligence, hardware designs, and deployment on real environments. Student participants will greatly benefit from the Posters and Demos session; it will be a lively forum to present their work and receive early feedback from international leading experts attending the conference. We explicitly encourage submissions of revolutionary concepts, path-breaking ideas, and ongoing research prototypes. Major IT industry, as well as emerging technology startups, are also highly encouraged to participate. SenSys is an ideal venue to present brand-new products, early prototypes, new development platforms, or even ongoing crowdfunding projects of smart platforms and solutions that might catalyze future applications and/or disrupt today’s sensing and networking technologies. Submitted abstracts will be evaluated based on technical merit and innovation as well as their potential to stimulate interesting discussions and exchange of ideas. Authors of accepted abstracts will be given a one-minute slot in a “madness session” during the conference to present their work in front of the conference audience. As with previous editions of SenSys, the best poster and demo will receive an award. All abstracts shall be formatted according to the main conference paper layout. Accepted abstracts will appear in the conference proceedings and the ACM Digital Library. **** Submission Instructions **** -- Posters and Demos must be submitted as a single PDF containing *no more than 2 pages*. The submission should be self-contained ready for publication, including the title, authors, institutional affiliations and contact information, abstract, main body, and references. Please *DO NOT anonymize* your submission. Upon acceptance, instructions for the final camera-ready abstract will be provided. -- You may include links to additional online material such as videos. Links to videos showing the demonstration are especially encouraged. Videos of accepted posters/demos will be linked from the SenSys web pages and permanently included in the ACM Digital Library. -- To submit a demo abstract, please add *"Demo Abstract:"* at the beginning of the manuscript's title. -- To submit a poster abstract, please add *"Poster Abstract:"* at the beginning of the manuscript's title. -- Template link <http://www.acm.org/sigs/publications/proceedings-templates> for MS Word and LaTeX. -- Submissions can be done for posters and demos at the following URL: Poster/Demo submission site <https://sensys18postersdemos.hotcrp.com/> **** Poster/Demo Program Co-Chairs **** Hae Young Noh (Carnegie Mellon University) Pengyu Zhang (Stanford University) Olga Saukh (TU Graz) **** Important Dates **** Submission Deadline: August 20, 2018, 11:59:59pm AOE Notification of acceptance: August 31, 2018, 11:59:59pm AOE Camera-ready abstract: September 14, 2018, 11:59:59pm AOE For more information, please contact the Poster & Demo Chairs. ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] CFP: Special Section on "Blockchain for Industrial Internet of Things" of IEEE Transactions on Industrial Informatics
by Lars Wolf 02 Jul '18

02 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: Special Section on "Blockchain for Industrial Internet of Things" of IEEE Transactions on Industrial Informatics Datum: Mon, 2 Jul 2018 14:03:11 +0800 Von: Henry Hong-Ning Dai <hndai(a)ieee.org> Antwort an: Henry Hong-Ning Dai <hndai(a)ieee.org> An: tccc-announce(a)COMSOC.ORG [We apology for cross-postings.] ***** Call For Papers ***** Special Section on "Blockchain for Industrial Internet of Things" of IEEE Transactions on Industrial Informatics --------------------------------------------------------- Theme: --------------------------------------------------------- Industrial Internet of Things (IIoT) is reshaping various industrial sectors, such as manufacturing, logistics, transportation, healthcare, energy and utilities. IIoT consists of various smart objects distributed throughout the whole industrial system to collect massive ambient data, which can be used to identify performance bottlenecks, troubleshoot faults and detect malicious behaviours consequently enforcing effective control to the physical world. However, there are several challenges posed on IIoT before the formal adoption of IIoT across various industries. Among them, security and efficiency on IIoT data are the most crucial concerns. On the other hand, the blockchain technology is transforming industries by enabling anonymous and trustful transactions in decentralized and trustless environment. As a result, blockchains help to reduce system risks, mitigate financial fraud and cut down operational cost. The convergence of IIoT and blockchains can potentially overcome the deficiencies of IIoT consequently resulting in the realization of IIoT in industrial sectors. Both industry practitioners and academic researchers aim at realizing general, scalable and deployable blockchain-based IIoT platforms in various application domains while there are a number of challenges like distributed consensus algorithms and data analytics with privacy-preservation in IIoT systems. To fill the gap, this special section solicits high quality and unpublished work on recent advances in Blockchains for IIoT. Topics include, but are not limited to, the following research topics and technologies: - New distributed consensus algorithms for blockchain-enabled IIoT - New security mechanisms for blockchain-enabled IIoT - New location-based services for blockchain-enabled IIoT - New blockchain platforms for IIoT - Advances in big data analytics in blockchain-enabled IIoT - Advanced contextual computing for blockchain-enabled IIoT - Edge/cloud intelligence for blockchain-enabled IIoT - Design, development and application of blockchain technology in IIoT - Intelligent manufacturing based on blockchain-enabled IIoT - Energy/smart grids/utilities based on blockchain-enabled IIoT - Smart supply chain based on blockchain-enabled IIoT - Intelligent transportation applications based on blockchain-enabled IIoT - Applications of big data analytics in blockchain-enabled IIoT --------------------------------------------------------- Manuscript Preparation and Submission --------------------------------------------------------- Follow the guidelines in “Information for Authors” in the IEEE- IES website: http://www.ieee-ies.org/pubs/transactions-on-industrial-informatics. Please submit your manuscript in electronic form through Manuscript Central web site: https://mc.manuscriptcentral.com/tii . On the submitting page #1 in popup menu of manuscript type, select: SS on Blockchain for Industrial Internet of Things. Submissions to this Special Section must represent original material that has been neither submitted to, nor published in, any other journal. Regular manuscript length is 8 pages. Note: The recommended papers for the section are subject to final approval by the Editor-in-Chief. Some papers may be published outside the special section, at the EIC discretion. --------------------------------------------------------- Timetable: --------------------------------------------------------- Deadline for manuscript submissions August 30, 2018 Expected publication date (tentative) March 2019 --------------------------------------------------------- Guest Editors: --------------------------------------------------------- Prof. Yan Zhang, University of Oslo, Norway, yanzhang(a)ifi.uio.no Prof. Zibin Zheng, Sun Yat-Sen University, China, zhzibin(a)mail.sysu.edu.cn Prof. Hong-Ning Dai, Macau University of Science and Technology, Macau, hndai(a)ieee.org Prof. Davor Svetinovic, Khalifa University of Science and Technology, UAE, davor.svetinovic(a)ku.ac.ae -- Hong-Ning Dai, Ph.D. Associate Professor Faculty of Information Technology Macau University of Science and Technology Tel: (853) 8897 2154 Email: hndai(a)ieee.org ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] [CFP] Special Issue on Vehicular Communication Systems -- Elsevier Computers and Electrical Engineering Journal, IF = 1.74
by Lars Wolf 02 Jul '18

02 Jul '18

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] [CFP] Special Issue on Vehicular Communication Systems -- Elsevier Computers and Electrical Engineering Journal, IF = 1.74 Datum: Sun, 1 Jul 2018 15:28:53 -0400 Von: Mubashir Husain Rehmani <mshrehmani(a)GMAIL.COM> Antwort an: Mubashir Husain Rehmani <mshrehmani(a)GMAIL.COM> An: tccc-announce(a)COMSOC.ORG Dear All, Please find below a call for papers for Special Issue on Vehicular Communication Systems in Elsevier Computers and Electrical Engineering Journal. Please accept our apologies if you receive multiple copies of this announcement. Call for Paper -------------------- Link: https://www.journals.elsevier.com/computers-and-electrical-engineering/call… Background ------------------ Automakers have been busy with implementing new designs and features for new vehicles for the last several years. The efforts have been in variety of areas such as fuel efficiency, smart features on wheels, performance, batteries, and a cluster of new products made with new materials such as aluminum, carbon fiber, and titanium. One challenging area is related to the communication system within new vehicles. The idea of self-driving vehicles from a decade ago is becoming a reality today. The development of new cars and self-driving vehicles brings a set of new challenges for the designers and drivers as well. Ease of use, accuracy, efficiency, and reliability of the new technologies used in the new vehicles are the main priority for automakers. The idea of “Connected Vehicle” has been the focus of automakers, telecommunication industry, and IT providers for quite a while. The evolution of technologies that advances vehicle connectivity has brought new fields of research and development in several industries. Numerous new terms such as vehicle-to-vehicle (V2V), vehicles-to-everything (V2X), vehicle-to-infrastructure (V2I) and others have been conceived to describe the passing of information from one vehicle to the surrounding entities. The aim of this special issue is to create a platform to foster new ideas and technical insights in the design and analysis of vehicular communication systems and discuss emerging technologies. Original manuscript describing unpublished work not currently under review by any other journal are welcome. Papers may describe system level design, modeling, simulation, experiment and optimization of wireless systems, emerging wireless technologies and applications, wireless system protocols and architecture and multilayer integration of RF energy and sensing components that are related to the vehicular communication systems. Topics ----------- The list of topics includes: - Vehicle to Vehicle (V2V) Communication - Vehicle to Everything (V2X) Communication - Vehicle to Infrastructure (V2I) Communication - Vehicle-to-Device (V2D) Communication - Vehicle-to-Grid (V2G) Communication - Grid-to-Vehicle (G2V) Communication - Vehicle-to-Pedestrian (V2P) Communication - Vehicle to Roadside (V2R) Communication - Software Defined Vehicular Communication Networks - Cognitive Radio enabled Vehicular Communication - Vehicular ad hoc network (VANET) - Vehicular Networks and Telematics (VNTA) - Inter-Vehicle Communication (IVC) - Intelligent Transportation System (ITS) - Electric Vehicles (EVs) and Smart Grid Communication - Electric Vehicles recharging techniques - Efficient Utilization of Spectrum of Vehicular Communication Systems - Communication Standards for Vehicular Communication Systems - Other topics that are related to vehicular communication systems Important Dates ------------------------ Manuscript Due: August 31, 2018 Acceptance notification: October 30, 2018 Revised paper due: December 15, 2018 Notification of the re-review: January 15, 2019 Final notification: February 28, 2019 Final manuscript due: March 30, 2019 Expected Publication of the Special Issue: August 2019 Submission Guidelines --------------------------------- All submissions have to be prepared according to the Guide for Authors as published in the Journal website at http://www.elsevier.com/wps/find/journaldescription.cws_home/367/authorinst…. Authors should submit online at: https://www.evise.com/profile/#/COMPELECENG/login by selecting “SI-vcs” from the “Issues” pull-down menu during the submission process. All contributions must not have been previously published or be under consideration for publication elsewhere. A submission based on one or more papers that appeared elsewhere has to comprise major value-added extensions over what appeared previously (at least 30% new material). Authors are requested to attach to the submitted paper their relevant, previously published articles and a summary document explaining the enhancements made in the journal version. Guest Editors of the Special Issue ------------------------------------------------- - Mehdi Shadaram, Managing Guest Editor, University of Texas at San Antonio, TX, USA Email: mehdi.shadaram(a)utsa.edu - Mubashir Husain Rehmani, Waterford Institute of Technology, Ireland Email: mrehmani(a)gmail.com - Vyasa Sai, Intel Corporation, California, USA E-mail: vyasa.sai(a)ieee.org ================================================= Mubashir Husain Rehmani, Ph.D., Senior Member IEEE Telecommunications Software and Systems Group (TSSG) Waterford Institute of Technology (WIT), Ireland Area Editor, IEEE Communications Surveys and Tutorials Associate Editor, IEEE Communications Magazine Associate Editor, IEEE Access Associate Editor, Elsevier CAEE, FGCS & JNCA Journals Associate Editor, Springer Wireless Networks Associate Editor, AHSWN Journal and JCN Journal https://sites.google.com/site/mshrehmani/ ================================================= ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [TCCC-ANNOUNCE] CFP: IEEE Journal of IoT Special Issue on Internet-of-Things for Smart Energy Systems
by Lars Wolf 29 Jun '18

29 Jun '18

-------- Weitergeleitete Nachricht -------- Betreff: [TCCC-ANNOUNCE] CFP: IEEE Journal of IoT Special Issue on Internet-of-Things for Smart Energy Systems Datum: Fri, 29 Jun 2018 11:35:38 +0000 Von: Sid Chau <Sid.Chau(a)ANU.EDU.AU> Antwort an: Sid Chau <Sid.Chau(a)ANU.EDU.AU> An: tccc-announce(a)COMSOC.ORG IEEE Journal of IoT Special Issue on Internet-of-Things for Smart Energy Systems http://ieee-iotj.org/wp-content/uploads/2018/06/CFP-IoT-J-SI-SES.pdf The paradigm of Internet of Things (IoT) is increasingly integrated with real-world applications. There are many critical IoT applications in the energy sector. Worldwide energy systems and infrastructure are experiencing tremendous transformation. There has been a drastic surge in global energy consumption, which has tripled in the past 50 years. As a result, new measures have been introduced to improve the responsiveness and robustness of energy systems, along with the global trends of deregulation and decarbonization. Energy systems, covering energy generation, transmission, distribution, and consumption processes in various energy media (e.g., electricity, gas, heat, fuel cell technology) in diverse sectors such as power grid, buildings, transportation systems, are one of the most important applications of IoT-based solutions. There is a heightened need in energy systems for real-time data analytics, dynamic control, and disruption mitigation, which can be empowered by a variety of IoT technologies. This special issue (SI) solicits novel solutions and techniques of applying IoT to smart energy systems. This SI aims to create a forum for researchers, developers and practitioners from both academia and industry to disseminate the state-of-the-art results and to advance the applications of IoT for smart energy systems. Topics of interests include (but are not limited to) the following categories: ● System architecture and protocol design of IoT for smart energy systems (e.g., electrical, gas, heat generation, transmission, distribution and consumption systems) ● Reliable, low-latency communication networks in IoT for smart energy systems ● Planning and management of sensors for smart energy systems (e.g., phasor measurement unit, smart metering infrastructure for electrical/gas/heat grids) ● IoT data analytics for smart energy systems ● IoT-based optimization and control for smart energy systems ● Intelligent software-controlled renewable energy generation (e.g., solar, wind, geothermal, hydro, combined heat and power) ● IoT-based solutions for energy storage and electric/alternative energy vehicle management ● IoT-based energy management for data centers, smart homes, smart buildings, and smart cities (e.g., HVAC control, district heating and cooling) ● Cyber security and privacy in IoT for smart energy systems ● Fog computing and mobile edge computing for smart energy systems ● Experiences from IoT testbeds and field-trials for smart energy systems Important Dates Submissions Deadline: September 1, 2018 First Reviews Due: November 15, 2018 Revision Due: December 15, 2018 Second Reviews Due/Notification: January 15, 2019 Final Manuscript Due: February 15, 2019 Publication Date: 2019 Submission The special issue seeks submission of papers that present novel original results and findings on Internet-of-Things for smart energy systems. Solicited original submissions must not be currently under consideration for publication in other venues. Author guidelines and submission information can be found at http://ieee-iotj.org/special-issues/. All manuscripts should be submitted through Manuscript Central: http://mc.manuscriptcentral.com/iot Guest Editors Sid Chi-Kin Chau (Australian National University) Hans-Peter Schwefel (Aalborg University) Vincent Wong (University of British Columbia) Angela Yingjun Zhang (Chinese University of Hong Kong) ______________________________________________________________ IEEE Communications Society Tech. Committee on Computer Communications http://committees.comsoc.org/tccc/ TCCC Announce: For announcements concerning computer networking and communications. tccc-announce(a)comsoc.org https://comsoc-listserv.ieee.org/

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Fwd: [Call for Competitors] 4th Dependability Competition at EWSN 2019
by Lars Wolf 28 Jun '18

28 Jun '18

-------- Weitergeleitete Nachricht -------- Betreff: [Call for Competitors] 4th Dependability Competition at EWSN 2019 Datum: Thu, 28 Jun 2018 08:15:01 +0000 Von: Saukh, Olga <saukh(a)tugraz.at> Antwort an: engelbert.meissl(a)tugraz.at An: iti.announce(a)mlist.tugraz.at <iti.announce(a)mlist.tugraz.at> ---------------------------------------------------------------------- Call for Competitors 4th Dependability Competition at the Intl. Conf. on Embedded Wireless Systems and Networks (EWSN) February 25-27, 2019 - Beijing, China http://ewsn2019.thss.tsinghua.edu.cn/call-for-competitors.html ---------------------------------------------------------------------- Following the success of the first three editions, the International Conference on Embedded Wireless Systems and Networks will host also this year a dependability competition to benchmark the performance of WSN and IoT communication protocols in harsh RF environments. ******** FORMAT ******** The EWSN 2019 dependability competition will take place remotely and the final results will be announced during EWSN in Beijing. Remote preparation phase. After successfully registering to the conference, accepted contestants will obtain the credentials to remotely access the competition infrastructure. During the official preparation phase, all competing teams will have the possibility to test and optimize their solution for this year's competition scenario. In particular, contestants will be able to program all nodes in the competition infrastructure and download their serial output, as well as the evaluation results. The latter will be published on a leaderboard that will be visible to all other competing teams. Final evaluation phase. At the end of the preparation phase, each team needs to provide one single ihex binary file for each competition category. During the evaluation phase, this binary file will be used to extensively benchmark the performance of the competing solution. Competition abstracts. Each team will have the possibility to publish a competition abstract as part of the EWSN proceedings that will appear in the ACM Digital Library. The competition abstracts will follow the same camera-ready deadline as the EWSN poster abstracts and are expected to include a description of the competing solution, as well as preliminary results and lessons learned from the preparation phase. Poster session. A poster session dedicated to the dependability competition will take place during the main EWSN conference. All competing teams must present their solution in the poster session and will have the possibility to engage in lively discussions with the other conference attendees. Awards. The winners of each competition's category will be awarded during a dedicated plenary session of the main conference. After receiving the award, the winning teams must hold a plenary short presentation about their solution, followed by a discussion session. ******** COMPETITION CATEGORIES ******** The EWSN 2019 dependability competition foresees two categories: Category 1: Data collection for condition monitoring. In this category, a fixed number of source nodes communicate to a single destination node over a multi-hop network (i.e., multipoint-to-point traffic). The destination node collects the data transmitted by all source nodes and forwards it to a control center for further processing. Category 2: Dissemination of actuation commands. In this category, a fixed number of source nodes needs to disseminate actuation commands to a specific set of destinations nodes in the network (i.e., point-to-multipoint traffic). Each source node is associated to a specific set of destinations (at most eight), which will be injected as input parameter into the firmware under test by the competition infrastructure. A detailed description of the competition scenario and evaluation procedure can be found on: http://ewsn2019.thss.tsinghua.edu.cn/competition-scenario.html ******** ELIGIBILITY ******** Both academia and industry submissions are encouraged. All wireless communication protocols used in low-power wireless sensor networks are welcome, and there is no restriction on the operating system used to program the sensor nodes. There is also no requirement on the originality of the competing solutions: the demonstration of good use of well-known or previously-published protocols is strongly encouraged. The EWSN 2019 dependability competition will take place if at least five teams competing in the same category respond to this preliminary call for competitors. ******** SUBMISSION INSTRUCTIONS ******** Contestants must submit a short abstract describing their approach by the competition entry deadline. The abstract should prominently include the name of all members of the team, as well as their affiliation and contact information. Detailed information on the formatting requirements and the submission instructions can be found on: http://ewsn2019.thss.tsinghua.edu.cn/call-for-competitors.html ******** IMPORTANT DATES ******** - Competition entry deadline: August 6, 2018 (23:59, AoE) - Notification of acceptance: August 31, 2018 - Preparation phase: from September 15 to November 30, 2018 - Evaluation phase: from December 1 to February 15, 2019 - Camera-ready abstract: December 31, 2018 - Awards and poster session: February 26-27, 2019 ******** ORGANIZERS ******** Carlo Alberto Boano (Graz University of Technology, Austria) Markus Schuß (Graz University of Technology, Austria) --------------------------------------------------------------------- Our sincere apologies if you receive multiple copies of the call ---------------------------------------------------------------------

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Fwd: ACM UbiComp/ISWC 2018 Call for Demos (Deadline: July 6, 2018)
by Lars Wolf 28 Jun '18

28 Jun '18

-------- Weitergeleitete Nachricht -------- Betreff: ACM UbiComp/ISWC 2018 Call for Demos (Deadline: July 6, 2018) Datum: Thu, 28 Jun 2018 17:14:58 +0900 Von: UbiComp '18 Publicity Chairs <publicitychairs-2018(a)ubicomp.org> An: publicitychairs-2018(a)ubicomp.org [Apologies if you got multiple copies of this email.] ------------------------------------------------------ CALL FOR DEMOS Submission deadline: July 6, 2018 ------------------------------------------------------ ACM UbiComp & ISWC 2018 8-12 October 2018 Singapore http://ubicomp.org/ubicomp2018/ http://iswc.net/iswc18/ http://ubicomp.org/ubicomp2018/cfps/demos.html # CALL FOR DEMOS Demos are an important part of UbiComp / ISWC 2018 program. They provide researchers with an opportunity to present their latest, cutting-edge research. Demos can cover preliminary or exploratory work within the field of ubiquitous and wearable computing, report about smaller projects or results that are still maturing towards a full paper submission, or present any other research that would encourage discussion. ## Already published in the past? It is OK to submit demos of research work that has been published elsewhere, however this should be explicitly made clear in the submission. In particular, we encourage demo submissions from authors of accepted Notes and Papers to complement their research publication at the conference. This allows attendees to get a hands-on experience of your innovation in addition to the technical presentation. ## Planning to publish in future? All accepted submissions will be included in UbiComp 2018 Adjunct Proceedings and in the ACM Digital Library. These are not considered to be archival publications; presentation in this venue should not affect the ability for researchers to subsequently publish this work in an archival forum as a conference/journal paper. All demos will be considered for the best demo award. An independent review committee will select the winner at the conference. # Demo Deadlines - July 6, 2018: Submission deadline - July 27, 2018: Notification of acceptance - August 10, 2018: Camera ready extended abstract deadline # What Role Do Demos Play At UbiComp? Demos are an integral part of the UbiComp conference. It is an opportunity for you to showcase your early implementations, prototypes work in-progress systems and even commercial products to a broad audience. It is your chance to engage the attendees and media representatives at a personal level and let them see, touch and experience the future of UbiComp. Whether you are coming with new what-if scenarios, developing new technologies or using existing ones in novel ways, your submissions are welcome. Demos should be brief and repeatable so that it can be efficiently shown repeatedly to a large number of attendees. We particularly encourage demos that people can interact with, have physical sensors or artifacts and in general keep the audience engaged. # What To Submit Your demo submission begins with a submission of a short video OR a 2 page abstract in SIGCHI Extended Abstracts template explaining your proposed demonstration scenario. The video should be 1-4 minutes in length and must clearly explain the demo concept. The primary purpose of the video or the short abstract is to communicate to the demo selection committee what the demo is about and whether it is a relevant fit for the UbiComp community. If you choose to submit a video, please note that your video must show a working version of the system (software or hardware). If you choose to submit 2 page abstract, it should convince the reader that the system works (pictures are highly encouraged). (You can even supplement your 2 page abstract with a short video, i.e. submit both an abstract and a video.) We understand that for many research prototypes, it may not always be feasible to demo the entire system (for example a system that requires sensors to be deployed throughout a home). In such instances, we encourage you to limit the scope of the system for the purposes of the demo and communicate clearly in the video or the abstract document how the demonstrated system is a small scale version of the overall innovation. Please note that the video can be of informal quality (it just needs to show the concept) as it will only be used for selection process and will NOT be archived and/or published publicly, unless you submit a video as part of the camera ready. Finally, as part of the first step, please also include the Demo Supplement Document containing a description of attendees’ interactions with the demo and technical requirements of the demo. Note that the conference will at minimum provide you with a space for your demo, including a table, chairs, and a power connection (230V 50Hz). Participants should bring any special equipment or devices such as power converters, projectors or audio amplification. # Extended abstract for accepted authors If your proposed demo is accepted, we require that you submit a 4-page extended abstract prepared using the SIGCHI Extended Abstracts template, by the camera-ready deadline. - Word: http://prior.sigchi.org/publications/chipubform/sigchi-paper-format-2016/vi… - LaTeX: https://github.com/sigchi # How To Submit Demos should be submitted electronically through the UbiComp Online Submission System (PCS) ( https://new.precisionconference.com/submissions ). Please select “SIGCHI” as Society, “Ubicomp 2018” as Conference/Journal and “Ubicomp 2018 Posters, Demos and Videos” as the track in the submission page. If you are submitting a 2 page abstract, please format your abstract title as “Demo: Title of the abstract”, so that it is recognized as a demo submission. If you are submitting a video, upload it as a supplement file at the submission portal. The review process will be single blind. Submissions must *NOT* be anonymized! For a video submission, author names and affiliations must be mentioned in the Demo Supplement Document. If you have any further inquiries, please contact pdvchairs-2018(a)ubicomp.org ------------------------------------------------------ UbiComp 2018 Poster, Demo & Videos Chairs Tadashi Okoshi, Keio University Chenren Xu, Peking University Rijurekha Sen, IIT Delhi ------------------------------------------------------------------------

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